Manufacturing method of radiator with high heat transfer efficiency

Abstract

The invention provides a manufacturing method of a radiator with high heat transfer efficiency. The radiator comprises a base in a plate shape or a cylindrical part and a plurality of fins which can be combined with the base, wherein the base and the fins are molded from aluminum timbers, and an oxidation film for improving the heat radiation emissivity of the base and the fins is formed on the surfaces of the base or / and the fins through an anodization technology; moreover, the device further comprises a heat pipe by which heat energy on the base can be rapidly transferred to the fins for heat radiation; or, the oxidation film is formed on the fins through anodization by utilizing a radiator type combined by the heat pipe and the fins. By dint of the characteristics, the heat transfer efficiency of the radiator is improved, and meanwhile, the functions of better appearance, easy identification and antifouling are provided.

Description

technical field [0001] The present invention relates to a method for making a heat sink with high heat transfer efficiency, in particular to a heat sink applied to computers or electronic components, and the technology of anode treatment to improve its heat transfer efficiency, and to be beautiful and easy to identify and anti-fouling function. Background technique [0002] Generally, the radiator of a computer or electronic component is composed of a base attached to the heat source and fins combined with the base, or a heat pipe combined with the base and the fins is further used to conduct the heat source to the heat of the base, Directly by fins or indirectly guided by heat pipes to fins to achieve heat dissipation efficiency, and in order to improve good heat dissipation efficiency, radiator manufacturers put considerable effort into the components and structure of the radiator. Taking into account the production capacity and labor cost, the direction of improvement is...

AI Technical Summary

Problems solved by technology

[0003] However, regarding the above-mentioned methods of improving heat transfer rate, whether it is the number of fins that can be planted or the forced convection blown by a fan, there is a limit, that is to say, the heat dissipation that a radiator of a specification can provide per unit time is with its rated limit

However, at present, the faster the processing speed of computers or electronic components, the greater the heat generated, which often exceeds the load of the radiator, thus causing the temperature rise effect of computers or electronic components, affecting their normal operation and service life

Also, in order to solve the above-mentioned problems, some manufacturers adopt water-cooling or TEC (Thermo-Electric Cooler) technology to construct the radiator, but the water-cooling radiator is not only large in size and expensive. High, there is also the lack of cooling water condensation or pipeline leakage, and the use of cooling chips is a heat dissipation component mainly built with a semiconductor process. The theoretical basis for cooling is the Peltier Effect. This is a kind of thermoelectric effect. After the cooling chip is powered on, the heat is transferred from the heat-absorbing end on one side to the heat-emitting end on the other side. The technology listed above is based on the First Law of Thermodynamics-Conservation (First Law of Thermodynamics-Conservation) ofEnergy), the cooling chip only transfers the heat to the other side through the thermoelectric effect of the chip, and then dissipates heat through the heat dissipation component on the other side, which is not only expensive, but also the heat dissipation performance is not as expected. Furthermore, When the cooling chip cannot provide effective heat dissipation for the computer or electronic components, it will cause a temperature rise effect, further reducing the temperature difference between the heat-absorbing end and the heat-radiating end, and reducing the heat transfer efficiency, so its practicability is not high

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