Auxiliary materials for lamination of flexibility circuit board and lamination process of same

A technology of flexible circuit boards and auxiliary materials, which is applied in the field of flexible circuit boards to achieve the effect of good temperature resistance

Inactive Publication Date: 2010-09-22
周伟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the face of the new FPC lamination with micro-holes, it is unavoidable that a small amount of foreign matter will be embedded in

Method used

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  • Auxiliary materials for lamination of flexibility circuit board and lamination process of same
  • Auxiliary materials for lamination of flexibility circuit board and lamination process of same
  • Auxiliary materials for lamination of flexibility circuit board and lamination process of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Example 1: Auxiliary material A for lamination

[0046] The physical structure of the auxiliary material A for lamination includes the following layers that are stacked in sequence: a high temperature resistant release film 1, a filling coating material 2, and a deformation control material 3, and the three layers of materials are sequentially combined into one.

[0047] High temperature resistant release film 1 uses FEP film deformation control material with a thickness of 10 μm and 3 biaxially stretched PET film with a thickness of 12 μm

[0048] Adopt tape casting processing technology to be viscous resin (the isooctyl acrylate that 30% viscosity is 2000cPa.s; The vinyl MQ resin that the M / Q=0.75 of 10% by weight is, and 10% by weight is that viscosity is 20000cPa .s hydroxyl-terminated vinyl silicone rubber; 50% by weight of low-density PE plastic particles [brand Shanghai Secco LL0220KJ], the above components are mixed at a high speed to obtain a viscous resin) at ...

Embodiment 2

[0049] Example 2: Auxiliary material B for lamination

[0050] The physical structure of the auxiliary material B for lamination is the same as that of the auxiliary material A for lamination. The high-temperature resistant release film 1 uses a PTFE film with a thickness of 25 μm; the deformation control material 3 uses a biaxially stretched PA film with a thickness of 15 μm

[0051] Adopting coating processing technology to be the copolymer of the isooctyl acrylate / ethyl acrylate of 30% by weight and the aqueous dispersion liquid (all the other being water) of the vinyl MQ resin of the M / Q=0.75 of 20% by weight, Coated on the deformation control material 3 and dried at 110 degrees Celsius to obtain a copolymer containing 60% by weight of isooctyl acrylate / ethyl acrylate and 40% by weight of ethylene with M / Q=0.75 The viscous filling coating material 2 based on MQ resin, with a thickness of 30 μm, is directly combined with the high temperature resistant release film 1 by col...

Embodiment 3

[0052] Example 3: Auxiliary material C for lamination

[0053] The physical structure of the auxiliary material C for lamination is the same as that of the auxiliary material A for lamination. High temperature resistant release film 1 uses FEP film with a thickness of 12 μm; deformation control material 3 uses biaxially stretched PA film with a thickness of 15 μm

[0054] Adopt hot-melt coating process technology to be viscous resin (the weight percent is the isooctyl acrylate of 25000cPa.s; the weight percent is the vinyl MQ resin of 30% M / Q=0.80, and the weight percent is 30% viscosity 20000cPa.s hydroxyl-terminated vinyl silicone rubber heated and kneaded to obtain a viscous resin) hot-melt coated on the deformation control material 3 at 210°C to obtain a filling coating material 2 with a thickness of 30 μm, and then directly bonded with the high-temperature resistant debonding material 2 Molding film 1 is thermocompressed and laminated to obtain auxiliary material C for l...

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Abstract

The invention relates to an auxiliary material for lamination of a flexibility circuit board and lamination process of the same. The auxiliary material (4) for lamination of the flexibility circuit board comprises the following layers: heat-resistant release film (1), a filling and coating material (2) and a deformation control material (3), wherein the heat-resistant release film (1) is fluorinated ethylene propylene or polytetrafluoroethylene film; the filling and coating material (2) comprises the following components: crylic acid alkyl ester polymer, polysiloxane and polyethylene; the deformation control material (3) comprises PET, PBT or PA film; and at least two adjacent layers of the heat-resistant release film (1), the filling and coating material (2), the deformation control material (3) are composited into a whole or three layers are composited into a whole. The invention solves the problem that foreign body plug the hole; and the special filling and coating material can not escape in cross flow in the process of the lamination. The invention also provides a lamination process with excellent glue resistance capability.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to an auxiliary material for lamination of the flexible circuit board and a lamination process of the flexible circuit board using the auxiliary material for lamination. Background technique [0002] The lamination process of single-sided flexible circuit boards commonly used in the prior art is: separating steel plates, deformation control materials such as kraft paper, filling and coating materials such as polyethylene films, high temperature resistant mold release films, circuit board protective films, tapes, etc. The circuit board base material with conductive lines, high temperature resistant release film, and isolation steel plate are flattened into a lamination unit, and one or more lamination units can be stacked in each opening of the laminator. Under the parameter conditions of temperature, pressure and time, use a laminator to press, so that the protective film is tightly wrapp...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/46B32B27/08B32B27/32
Inventor 周伟
Owner 周伟
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