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Broadband high impedance MnZn ferrite material and manufacture method thereof

A ferrite material and high-impedance technology, applied in the field of MnZn ferrite material and its manufacture, can solve the problems of low Curie temperature, low practical value, slow progress in the research of iron-poor MnZn ferrite, etc., and achieve resistivity The effect of high and low content

Active Publication Date: 2010-10-13
江门江益磁材有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Recently, the research on iron-poor MnZn ferrite has been slow, and the produced materials also have the defect of low Curie temperature, so the practical value is low.

Method used

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  • Broadband high impedance MnZn ferrite material and manufacture method thereof
  • Broadband high impedance MnZn ferrite material and manufacture method thereof
  • Broadband high impedance MnZn ferrite material and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Using commercially available Fe 2 o 3 , Mn 3 o 4 , ZnO as the main component, 48.0mol% Fe 2 o 3 , 32.8mol% MnO (raw material is Mn 3 o 4 ), 19.2mol% ZnO was placed in a sand mill and stirred, mixed evenly, then taken out and placed in a drying oven for drying. After drying, use a box-type resistance furnace to pre-fire at 800°C-900°C for 2 hours. Then put the pre-fired powder into the ball mill, and add the auxiliary component SiO 2 , CaCO 3 , the addition amount is respectively 0.006wt%, 0.03wt% of the total weight of the main component, and then add 60wt% deionized water, 1wt% dispersant, and 1wt% defoamer based on the total weight of the main component. Agents are ball milled together. Ball mill the powder until the average particle size is about 1.0±0.2μm, add 8wt% polyvinyl alcohol aqueous solution based on the total weight of the powder after drying to granulate, and press into OR25×8-15mm and OR5×10-2mm The ring-shaped sample is finally sintered at a t...

Embodiment 2

[0029] Using commercially available Fe 2 o 3 , Mn 3 o 4 , ZnO as the main component, according to the amount shown in Table 2 Fe 2 o 3 , MnO (raw material is Mn 3 o 4 ), ZnO was placed in a sand mill and stirred, mixed evenly, then taken out and placed in a drying oven for drying. After drying, use a box-type resistance furnace to pre-fire at 800°C-900°C for 2 hours. Then put the pre-fired powder into the ball mill, and add the auxiliary component SiO 2 , CaCO 3 , the addition amount is respectively 0.003wt%, 0.02wt% of the total weight of the main component, and then add 60wt% deionized water, 1wt% dispersant, and 1wt% defoamer based on the total weight of the main component. Agents are ball milled together. Ball mill the powder until the average particle size is about 1.0±0.2 μm, add 8wt% polyvinyl alcohol aqueous solution based on the total weight of the powder after drying to granulate, and press into OR25×8-15mm and OR5×10-2mm The ring-shaped sample is finally ...

Embodiment 3

[0034] Using commercially available Fe 2 o 3 , Mn 3 o 4 , ZnO as the main component, 48.0mol% Fe 2 o 3 , 32.8mol% MnO (raw material is Mn 3 o 4 ), 19.2mol% ZnO was placed in a sand mill and stirred, mixed evenly, then taken out and placed in a drying oven for drying. After drying, use a box-type resistance furnace to pre-fire at 800°C-900°C for 2 hours. Then put the pre-fired powder into the ball mill, and add the auxiliary component SiO 2 , CaCO 3 , SnO 2 、Co 2 o 3 , the addition amount is listed in Table 3, and then add 60wt% deionized water, 1wt% dispersant, and 1wt% defoamer to account for the total weight of the main component and carry out ball milling together. Ball mill the powder until the average particle size is about 1.0±0.2 μm, add 8wt% polyvinyl alcohol aqueous solution based on the total weight of the powder after drying to granulate, and press into OR25×8-15mm and OR5×10-2mm The ring-shaped sample is finally sintered at a temperature of 1210°C-1350...

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Abstract

The invention provides a broadband high impedance MnZn ferrite material, which comprises main components and assistant components. The main components comprise 47 to 50 mol percent of Fe203, 29 to 35 mol percent of Mn3O4 by MnO and 16 to 21 mol percent of ZnO. The assistant components are at least one kind from SiO2, CaCO3, V205 and Nb2O5. Total weight based on the main components is that SiO2 is0.002 to 0.01 wt percent, CaCO3 is 0.01 to 0.08 wt percent, V205 is 0.01 to 0.07 percent, and Nb2O5 is 0.01 to 0.07 percent. The broadband high impedance MnZn ferrite material has DC resistivity larger than 103 omega meter, curie temperature higher than 115 degrees centigrade and 2000 plus or minus 20 percent initial permeability. Moreover, the low frequency impedance of the material is larger than the common NiZn ferrite material, the high frequency impedance thereof is equal to the common NiZn ferrite material and the material does not contain expensive raw material NiO. The invention further provides the manufacture method of the broadband high impedance MnZn ferrite material, which comprises the steps of mixing, drying, preburning, ball-milling, granulation, molding, sintering and thelike.

Description

technical field [0001] The invention relates to a MnZn ferrite material and a manufacturing method thereof, in particular to a broadband high-impedance MnZn ferrite material and a manufacturing method thereof. Background technique [0002] In the era of electronic information, with the rapid development of satellite communications, mobile communications, computer applications, etc., electromagnetic interference (EMI) has more and more serious impacts on military and civilian electronic information fields, causing serious damage to the public environment, personal safety, and information confidentiality. Great harm. An effective way to solve or reduce electromagnetic pollution and improve the ability of electronic equipment to resist electromagnetic interference is to adopt electromagnetic compatibility design, which requires a large number of anti-EMI materials. Commonly used anti-EMI materials are MnZn ferrite and NiZn ferrite materials. Due to the miniaturization and hig...

Claims

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Application Information

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IPC IPC(8): C04B35/38C04B35/622
Inventor 汪南东黄爱萍谭福清豆小明王家永冯则坤
Owner 江门江益磁材有限公司
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