Multifunctional ion beam sputtering equipment

Abstract

The invention discloses multifunctional ion beam sputtering equipment which comprises a vacuum chamber, a sputtering workbench, two sputtering target platforms, two sputtering ion sources and an assistant cleaning ion source, wherein the sputtering workbench is arranged in the top middle position of the vacuum chamber; the lower surface of the sputtering workbench is parallel to the horizontal plane; the two sputtering target platforms are arranged at the lower part of the vacuum chamber and symmetrical bilaterally with respect to the direction of the perpendicular bisector of the sputtering workbench; the two sputtering ion sources are arranged in the middle of the vacuum chamber and symmetrical bilaterally arranged in the direction of the perpendicular bisector of the sputtering workbench; an emitted ion beam and a target surface loaded on the sputtering target platforms form an angle of 45 DEG; the assistant cleaning ion source is arranged in the middle of the vacuum chamber; and the emitted ion beam and the lower surface of the sputtering workbench form an angle of 30 DEG. The equipment has various functions and can be used for sputtering deposition, etching, polishing thinning and heat treatment of high-quality multilayer ultrathin media and metal film materials.

Description

technical field [0001] The invention relates to the technical field of thin film deposition equipment, in particular to a multifunctional ion beam sputtering equipment. Background technique [0002] Ion beam sputtering deposition (IBSD) is one of the important methods of thin film preparation in semiconductor technology. According to the principle of sputtering, the surface of the target is bombarded with a low-energy focused ion beam, and the sputtered target is deposited on the surface of the substrate and deposited on the surface of the substrate. firmly attached to the substrate surface. The filament in the ion gun generates thermal electrons under high pressure, which ionize argon gas into Ar + , are accelerated under an electric field to form an ion beam. [0003] Reactive ion beam sputtering deposition (RIBD) can be performed under local oxygen pressure or oxygen ion beam bombardment to prepare oxide films. [0004] In the process of film deposition, ion beam bomba...

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Problems solved by technology

[0008] Because ion beam has various functions such as ion beam sputtering deposition, ion beam assisted sputtering, ion beam etching, ion beam cleaning, ion beam polishing, ion beam thinning, etc., many vacuum equipment manufacturers in the world are using ion beam Development and production of sputtering deposition and etching equipment, but most of the developed and produced equipment has single functions, such as no co-sputtering function, heating function, and simultaneous sputtering and etching, etc.

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