Low-carbon environmentally-friendly water-based soldering flux

A low-carbon, environmentally friendly, flux technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of flammability and environmental protection of flux, and achieve the effect of reducing carbon dioxide emissions

Inactive Publication Date: 2010-11-24
YIK SHING TAT INDUSTRIALCO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] The technical problem to be solved by the present invention is to solve the problems of flammability and environmental protection of soldering flux in the prior art

Method used

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  • Low-carbon environmentally-friendly water-based soldering flux
  • Low-carbon environmentally-friendly water-based soldering flux
  • Low-carbon environmentally-friendly water-based soldering flux

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0022] The composition of low-carbon environment-friendly water-based flux:

[0023] 94% deionized water

[0024] 1.8% C12 ethers

[0025] 3% Succinic Acid

[0026] 0.1% Hydroxymethylbenzotriazole

[0027] 0.1% N,N-Dimethyldodecylamine

[0028] 1% Surfactant YK-302

specific Embodiment 2

[0029] The composition of low-carbon environment-friendly water-based flux:

[0030] 85% deionized water

[0031] 5% PEG800

[0032] 4.2% C12 ethers

[0033] 4% malonic acid

[0034] 0.4% Hydroxymethylbenzotriazole

[0035] 0.4% N,N-Dimethyldodecylamine

[0036] 1% Surfactant YK-302

specific Embodiment 3

[0037] 95% deionized water

[0038] 1.1% C12 ethers

[0039] 3% Succinic Acid

[0040] 0.2% 2-ethylimidazole

[0041] 0.2% N,N-Dimethyldodecylamine

[0042] 0.5% Surfactant YK-302

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PUM

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Abstract

The invention relates to a low-carbon environmentally-friendly water-based soldering flux which has the soldering aid effect in a wave soldering process of circuit board assembly. The soldering flux consists of a solvent and an active additive, wherein the weight of the solvent is 80-97 percent of the total weight of the soldering flux, and the solvent comprises deionized water as a main component and one of polyethylene glycol 800, polyethylene glycol 1000, polyethylene glycol 1200 and polyethylene glycol 1400 and can also comprises an ether compound of which the carbon atom number is 10-14; and the active additive comprises one or more water-soluble organic weak acids and a water-soluble surfactant. In the soldering flux, water is used as the main solvent, and the soldering flux has higher boiling point and nonflammability compared with the traditional alcohol-based soldering flux so that fire disasters cannot be caused in the stages of preheating and soldering, and the soldering flux is safer than the traditional alcohol-based soldering flux. The soldering flux does not contain any halogen chemical substance and meets the requirements on halogen free and environmentally friendly laws and regulations in the electronics industry. The soldering flux uses water as the main solvent, contains lower carbon compared with the traditional alcohol-based soldering flux, reduces the emission of carbon dioxide and is more environmentally friendly.

Description

technical field [0001] The invention relates to a flux, in particular to a flux used in a wave soldering process in the circuit board assembly industry. Background technique [0002] With the gradual development of electronic products in the direction of miniaturization, integration and multi-function, the circuit board assembly industry is also developing at a high speed, so the demand for flux is also increasing. [0003] Flux plays the following roles in the soldering process: [0004] 1. Remove the metal oxides on the pads and component pins and the oxides on the surface of the molten solder. The reaction principle is as in Formula 1: MOx+2xRCOOH=M(RC00)x+xH2O [0005] Note: RCOOH in Formula 1 represents the organic acid component in the flux. [0006] 2. Reduce the surface tension of molten solder and promote wetting. [0007] 3. During the welding process, isolate the air. Prevents re-oxidation of molten solder and solder joints during soldering. [0008] 4. Play...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362H05K3/34
Inventor 徐金华马鑫陈胜吴建雄吴伟良陈爽吴秋霞
Owner YIK SHING TAT INDUSTRIALCO LTD
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