Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring

A technology of excimer laser and ceramic materials, which is applied in the field of ultra-precision machining of hard and brittle materials, and achieves the effect of eliminating the influence of thermal stress, improving flexibility and rapid processing.

Inactive Publication Date: 2010-12-08
DALIAN UNIV OF TECH
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a processing method and device for ultra-precise and low-damage removal of micro-configuration of large-scale ceramic sealing rings

Method used

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  • Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring
  • Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring
  • Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring

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Embodiment 1

[0015] as attached figure 1 As shown, the excimer laser processing system of the present invention includes three mirrors, a workbench 3, a shutter 4, a focusing lens 5, a diaphragm 6, a monitor 8, and a beam adjustment device composed of a convex lens 9 and a concave lens 10. Wherein the combination of the first reflector 2 and the third reflector 11 is used to change the spatial position of the light beam, and expands enough space for the installation of other components of the system; the concave lens 10 is used to diverge the light beam, so that the light beam with a certain divergence angle in the light beam can be more Large divergence angle propagation, to achieve the purpose of eliminating beam interference with excessive divergence angle; convex lens 9 recollimates the divergent beam, and at the same time can obtain the required spot size by controlling the lens position; monitor 8 magnification factor is 50 times, used for focusing , positioning and monitoring the pr...

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PUM

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Abstract

The invention belongs to the technical field of ultrafine processing of hard and brittle ceramic materials, in particular to special microstructure-type excimer laser delaminated processing method and device of a ceramic material sealing ring. The method is characterized by comprising the following steps of: delaminating the special microstructure-type three-dimensional profile of a processed ceramic material; converting into NC (Numerical Control) codes and realizing the computer control of the position of a lens, the size and the shape of an aperture, the replacement of a round lens and a cylindrical lens, the aperture size and the shape of a light chopper and the movement of a worktable in an optical system by combining the generated NC codes so as to realize the automation and the flexibility of a processing process. The invention has the advantages that the ultrafine processing problem of the special microstructure-type hard and brittle ceramic material sealing ring is solved by applying an excimer delaminated processing technology. A non-contact, clean and high-efficiency processing mode is provided to effectively solve the problems of attached contact stress, embedded abrasive grains and low processing efficiency in a traditional processing method, and the processing flexibility is realized.

Description

technical field [0001] The invention belongs to the technical field of microstructure ultra-precision machining of hard and brittle materials, and relates to Al 2 o 3 , SiC and other hard and brittle ceramic materials microstructure ultra-precision machining method and device. Background technique [0002] Ceramic materials have excellent properties such as strong oxidation resistance, good wear resistance, high hardness, good thermal stability, high temperature strength, small thermal expansion coefficient, high thermal conductivity, thermal shock resistance and chemical corrosion resistance. At present, ceramic materials are mainly used to prepare cutting edges of cutting tools in high-precision processing equipment, sealing parts in high temperature, high pressure and strong corrosive environments, etc. Due to their good physical and chemical properties, ceramic materials are widely used in petroleum, chemical, machinery, aerospace, The field of nuclear energy is playin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/02B23K26/064B23K26/066
Inventor 金洙吉尹波康仁科郭东明
Owner DALIAN UNIV OF TECH
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