Unlock instant, AI-driven research and patent intelligence for your innovation.

Unleaded epoxy resin composite for printed circuit copper clad laminate

A lead-free epoxy resin and epoxy resin technology, used in printed circuit components, circuit substrate materials, layered products, etc., can solve the problems of harsh resin Tg and heat resistance, large thermal expansion coefficient, and large performance drop. , to achieve the effect of good reactivity, easy impregnation and reduction of thermal expansion coefficient

Active Publication Date: 2010-12-22
EPOXY BASE ELECTRONICS MATERIAL
View PDF3 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The Tg of ordinary FR-4 sheets is 130-140°C, the thermal expansion coefficient in the Z-axis direction is large, and the heat resistance is low. It is easy to produce resin stains during drilling, large shrinkage during processing, and unfavorable alignment. There are certain disadvantages in use. However, based on the resin structure, the properties of the board will drop greatly at high temperatures exceeding Tg, which limits its use in high temperature environments; coupled with the change of lead-free tin furnace, the Tg and heat resistance of the resin will be more severe. harsh

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Unleaded epoxy resin composite for printed circuit copper clad laminate
  • Unleaded epoxy resin composite for printed circuit copper clad laminate
  • Unleaded epoxy resin composite for printed circuit copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) Preparation of acetone solution containing modified epoxy resin:

[0027] 360 parts of bisphenol A type epoxy resin, 28 parts of tetrafunctional novolac epoxy resin, 120 parts of brominated bisphenol A type epoxy resin, 150 parts of tetrabromobisphenol A and 9 parts of tetraphenol Add 0.15 parts of catalyst butyltriphenylphosphine bromide when heating at 120°C, continue heating to 170°C for 2 hours; then cool down to 150°C, add 80 parts of norophenol formaldehyde ring Oxygen resin, after mixing evenly, add acetone solvent to dissolve into the acetone solution containing modified epoxy resin that the solid content is 75%. The above-mentioned consumptions are all parts by weight.

[0028] (2) Preparation of epoxy resin composition:

[0029] Take by weighing the acetone solution containing modified epoxy resin obtained in step (1) as shown in the table below, and add inorganic filler, phenolic curing agent, curing accelerator and solvent to the acetone solution conta...

Embodiment 2

[0034] (1) Preparation of acetone solution containing modified epoxy resin:

[0035] 380 parts of bisphenol F type epoxy resin, 40 parts of four-functional novolac epoxy resin, 120 parts of brominated bisphenol A type epoxy resin, 140 parts of tetrabromobisphenol A and 13 parts of tetraphenol Add 0.12 parts of catalyst butyltriphenylphosphine bromide when heating at 120°C, continue heating to 170°C for 1.8-2.5 hours; then cool down to 130°C, add 120-135 parts of thread Type phenol-formaldehyde epoxy resin, after mixing evenly, add acetone solvent and dissolve into the acetone solution that the solid content is 75% containing modified epoxy resin. The above-mentioned consumptions are all parts by weight.

[0036] (2) Preparation of epoxy resin composition:

[0037] Take by weighing the acetone solution containing modified epoxy resin obtained in step (1) as shown in the table below, and add inorganic filler, phenolic curing agent, curing accelerator and solvent to the acetone...

Embodiment 3

[0042] (1) Preparation of acetone solution containing modified epoxy resin:

[0043] 330 parts of bisphenol S type epoxy resin, 39 parts of four-functional novolac epoxy resin, 95 parts of brominated bisphenol A type epoxy resin, 170 parts of tetrabromobisphenol A and 14 parts of tetraphenol Mix and heat the base ethane together, add 0.10 parts of catalyst butyltriphenylphosphine bromide when heating at 120°C, continue heating to 170°C for 2 hours; then cool down to 150°C, add 80 parts of norophenol formaldehyde ring Oxygen resin, after mixing evenly, add acetone solvent to dissolve into the acetone solution containing modified epoxy resin that the solid content is 75%. The above-mentioned consumptions are all parts by weight.

[0044] (2) Preparation of epoxy resin composition:

[0045]Take by weighing the acetone solution containing modified epoxy resin obtained in step (1) as shown in the table below, and add inorganic filler, phenolic curing agent, curing accelerator and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Decomposition temperatureaaaaaaaaaa
Login to View More

Abstract

The invention discloses an unleaded epoxy resin composite for a printed circuit copper clad laminate (CCL), which is composed of the following components in parts by weight: 120-160 parts of acetone solution containing modified epoxy resin, 35-60 parts of phenolic aldehyde curing agent, 0.01-0.04 part of curing catalyst, 20-40 parts of solvent and 20-35 parts of filler, wherein the acetone solution containing modified epoxy resin is prepared by treating bis-functional epoxy resin, brominated bisphenol epoxy resin, multifunctional novolac epoxy resin and linear novolac epoxy resin in modes of chemical modification and physical blending and dissolving in the acetone. The epoxy resin composite in the invention has the advantages of low viscosity, easy impregnation, convenient operation, good reactivity and the like, is used for preparing the printed circuit CCL to cause the CCL to conform to the unleaded processing, and has the comprehensive properties of good reliability and processability, excellent thermostability and the like.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a lead-free epoxy resin composition for printed circuit copper clad boards. Background technique [0002] The global electronics industry has felt the impact of the new "green" regulations from the European Union, with new lead-free regulations having a real impact on all consumer and industrial electronics applications worldwide. These regulations require that the solder used in the production of electronic laminates must remain lead-free, and because new lead-free solders are required to have higher melting and application temperatures than the original lead-containing solders, manufacturers are currently seeking to withstand more. New laminate material for high temperature. [0003] Due to the needs of environmental protection, from July 1, 2006, the global electronics industry has entered the era of lead-free soldering. Due to the increase of lead-free soldering temperature, hig...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L63/00C08L63/04C08L63/02B32B15/092H05K1/03
Inventor 黄活阳林仁宗吴永光
Owner EPOXY BASE ELECTRONICS MATERIAL