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LED heat radiating device

A heat dissipation device and LED substrate technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of large volume, poor heat dissipation effect, etc., achieve the effects of fast thermal response, reduce welding work, and avoid damage

Inactive Publication Date: 2010-12-22
广州智择物业管理有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is to overcome the disadvantages of poor heat dissipation, light decay, and large volume in current similar products, and provide an LED heat dissipation device that can not only effectively improve heat dissipation efficiency, but also simplify circuit connections

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] See figure 1 , 2 , this embodiment includes: an LED 1 and a heat conduction heat pipe 2 connected to the LED substrate 11 . The LED 1 includes: an LED chip and an LED substrate 11 for carrying the LED chip. In order to improve the heat dissipation efficiency, the LED substrate 11 in this embodiment adopts low temperature co-fired multilayer ceramics, which can effectively and quickly dissipate the heat generated by the LED chips.

[0033] The heat conduction heat pipe 2 includes: a heat pipe body 21 and an insulating layer 22 covering the heat pipe body 21 , wherein the heat pipe body 21 is in the form of a cylinder, and the surface of the insulating layer 22 is coated with conductive lines. In order to improve heat conduction efficiency, the heat pipe main body 21 in this embodiment is made of copper pipe, and the heat pipe main body 21 is fixed on the bottom surface of the LED substrate 11 by bonding. Its end surface 211 in contact with the LED substrate 11 is a pl...

Embodiment 2

[0043] See image 3 , 4 As shown, this embodiment is similar to Embodiment 1, the difference is that the positive and negative poles of the LED on the LED substrate 11 use a conductive member 3 that is a contact piece 32 made of copper, through which the contact piece 32 is connected with the silver paste circuit The formed power lines 41, 42 are connected. Specifically, the conductive member 3 includes: a contact piece 32 and an insulating seat 33 for fixing the contact piece 32, wherein the insulating seat 33 is fixed on the end of the heat pipe main body 21, the contact piece 32 is fixed on the insulating seat 33, and Each contact piece 32 communicates with the power supply lines 41 , 42 at corresponding positions and the positive and negative contacts of the LED 1 .

[0044] Since the copper contact piece 32 is difficult to be directly fixed on the heat pipe main body 21, an insulating seat 33 is used to fix the contact piece 32 in this embodiment, and the insulating sea...

Embodiment 3

[0046] See Figure 5 , 6 As shown, this embodiment is similar to Embodiment 1, the difference is that: the tail end of the heat pipe body 21 (that is, the condensation end of the heat conduction heat pipe 2) is welded or riveted with fins 23, through which the fins 23 increase the contact with the environment. The heat dissipation area for air heat exchange increases the heat dissipation effect. The materials used as fins are still mainly copper (such as Cu1100) and aluminum (such as AL1100), as well as the recent aluminum-based ceramic composite material (also known as AMC composite material). According to the processing methods, there are stamping, extrusion, casting, welding, folding, forging, cutting, machining and so on. The structure can be designed in different shapes according to the product, and the fins 23 need to optimize the fin pitch, fin thickness, and fin outer diameter according to the LED power and carry out check calculation.

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Abstract

The invention relates to an LED heat radiating device capable of effectively enhancing heat radiating efficiency and simplifying circuit connection, relating to the technical field of LED heat radiating technologies. The LED heat radiating device comprises an LED and a heat-conducting heat pipe, wherein the heat-conducting heat pipe is connected with an LED substrate; the LED substrate is fixed to one end of the heat-conducting heat pipe; and conducting wires are coated on the surface of the heat-conducting heat pipe and electrically connected with the LED. The heat-conducting heat pipe is adopted as a heat-conducting main body, therefore, the invention has the advantages of high heat conductivity, good isothermality, fast heat response, simple structure, no additional electric drive, and the like and becomes an ideal heat-conducting heat-radiating element of the traditional LED chip with high heat density; and in addition, in the invention, the heat-conducting heat-radiating heat pipe used as the heat-conducting main body not only plays a heat-conducting role, but also is used as a transmission carrier of current and a signal, thereby preventing the leads from being used for connection and enabling an integral LED product to be simpler and more attractive.

Description

Technical field: [0001] The invention relates to the technical field of LED heat dissipation, in particular to an LED heat dissipation device which can effectively improve heat dissipation efficiency and simplify circuit connection. Background technique: [0002] In view of the advantages of long life, high luminous efficiency, no radiation and low power consumption of LED, the application of LED lights has been paid more and more attention and accepted by people. But LED is a photoelectric device, only 15%-25% of the electrical energy is converted into light energy in its working process, and the rest of the electrical energy is almost converted into heat energy, which makes the temperature of the LED rise. If no heat dissipation measures are added, the working temperature of the LED chip will decrease Rising rapidly, the LED is damaged due to overheating. The existing heat dissipation method is no longer a fundamentally effective method to solve this problem, and seriousl...

Claims

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Application Information

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IPC IPC(8): H01L33/64H01L33/62
Inventor 叶博森
Owner 广州智择物业管理有限责任公司
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