Copper foil surface passivation treatment process in copper foil surface treatment process

A passivation treatment and surface treatment technology, applied in the direction of surface reaction electrolytic coating, electrolytic coating, coating, etc., can solve the problems of strong carcinogenicity of hexavalent chromium, human body and environmental hazards, etc., to eliminate environmental barriers and ensure sustainable Good growth and high temperature resistance

Inactive Publication Date: 2012-09-05
JIANGXI UNIV OF SCI & TECH +1
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The above passivation method uses hexavalent chromium to passivate the surface of copper foil, but hexavalent chromium is highly carcinogenic and will cause serious harm to the human body and the environment

Method used

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  • Copper foil surface passivation treatment process in copper foil surface treatment process
  • Copper foil surface passivation treatment process in copper foil surface treatment process
  • Copper foil surface passivation treatment process in copper foil surface treatment process

Examples

Experimental program
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Embodiment Construction

[0017] Preparation of passivation solution

[0018] Add 500ml of deionized water into 1L passivation tank, add 17-25ml of phytic acid with a concentration of 70% into the passivation tank, and then dilute to 1L with deionized water to make the required passivation solution.

[0019] Passivation treatment of copper foil

[0020] Put the copper foil after surface roughening and curing treatment in the copper foil surface treatment process into the passivation tank, according to the working temperature of 12-42 ℃, and the current density of 0.4-4.0A / dm 2 , The passivation treatment time is 8-45s to complete the passivation treatment of copper foil.

[0021] figure 1 For the use of phytic acid addition 20ml / L, passivation working temperature 15-30 ℃, current density 0.5-2A / dm 2 , Passivation treatment time 15s electron microscope scanning picture after passivation treatment of copper foil.

[0022] It can be seen from the figure that the surface of the copper foil is smooth an...

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Abstract

The invention discloses a copper foil surface passivation treatment process in a copper foil surface treatment process. The process particularly comprises the steps of preparing passivation solution from de-ionized water serving as a basic solvent and phytic acid serving as an additive and performing passivation treatment on a copper foil. The formula of the invention saves the conventional hexavalent chromium component on the premise of ensuring the passivation effect, so that the technical guarantee for eliminating the environmental protection barrier of copper foil manufacturers and ensuring continuous development of enterprises is provided.

Description

technical field [0001] The invention relates to a copper foil surface passivation treatment process in the copper foil surface treatment process. Background technique [0002] The existing copper foil surface treatment process can generally be summarized as: original foil - pretreatment - roughening - curing treatment - anti-oxidation treatment - surface treatment copper foil. [0003] Copper foil after "roughening-curing" treatment often encounters water vapor, dust, oxidation, and even fingerprint pollution from the external environment during transportation, storage, and copper clad laminate production operations, making the copper foil In addition, after the high-temperature pressing of the board and the high temperature in the processing of the PCB, the copper foil surface will appear local discoloration and form spots of copper oxide, and these changes on the copper foil surface will affect the reliability of the copper surface. Solderability, affinity with ink, adhes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D11/00
Inventor 唐云志肖炳瑞李立清黄永发肖友军王平
Owner JIANGXI UNIV OF SCI & TECH
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