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Low-temperature cured conductive paste with ultra-low silver content and preparation method thereof

A technology of conductive paste and silver content, applied in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problem of high silver content, achieve low price, good bending performance, The effect of high printing resolution

Inactive Publication Date: 2011-01-19
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the silver content of these products is still high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Preparation of conductive powder: select flake silver powder with a particle diameter of 7-9 μm and a tap density of 1.6-2.0 g / ml, conductive iron-phosphorus alloy powder particles with a particle diameter of less than 10 μm, and conductive nickel powder with a particle diameter of 0.5-4.0 μm Mixed, its mass ratio is 40:3:7;

[0045] The solvent is DBE;

[0046] The polymer resin is selected from Dow Chemical VAGH type vinyl chloride resin;

[0047] The coupling agent is Dow Corning's epoxy silane coupling agent YC-1027;

[0048] The leveling agent is Tego 655.

[0049] The mass percentages of each component are:

[0050] Conductive Powder: 50%,

[0051] Solvent: 39%,

[0052] Polymer resin: 9%,

[0053] Coupling agent: 1%,

[0054] Leveling agent: 1%;

[0055] First, the solvent and the polymer resin are mixed at a high speed at 70°C to form a uniform organic carrier; then the pre-mixed conductive powder is added to the organic carrier, a coupling agent and a l...

Embodiment 2

[0057] Preparation of conductive powder: choose flake silver powder with a particle diameter of 7-9 μm and a tap density of 1.2-1.6 g / ml, conductive phosphorus-iron alloy powder particles with a particle diameter of less than 10 μm, and conductive nickel powder with a particle diameter of 0.5-4.0 μm Mixed, its mass ratio is 37:4:7;

[0058]The solvent is ethyl carbitol acetate;

[0059] The polymer resin is a mixture of Dow Chemical VAGH type vinyl acetate resin and Toyobo 200 type polyester resin in a mass ratio of 4:1;

[0060] The coupling agent is Dow Corning's epoxy silane coupling agent YC-1027;

[0061] The leveling agent is Tego 655;

[0062] The anti-sedimentation agent is 229 of Deqian Chemical.

[0063] The mass percentages of each component are:

[0064] Conductive Powder: 48%,

[0065] Solvent: 40%,

[0066] Polymer resin: 9%,

[0067] Coupling agent: 1.5%,

[0068] Leveling agent: 1.0%,

[0069] Anti-sedimentation agent: 0.5%;

[0070] First, the solven...

Embodiment 3

[0072] Preparation of conductive powder: choose flake silver powder with a particle diameter of 7-9 μm and a tap density of 1.2-1.6 g / ml, conductive phosphorus-iron alloy powder particles with a particle diameter of less than 10 μm, and conductive nickel powder with a particle diameter of 0.5-4.0 μm Mixed, its mass ratio is 35:5:5;

[0073] The solvent is a mixture of ethyl carbitol acetate and butyl cellosolve acetate in a mass ratio of 2:1;

[0074] The polymer resin is a mixture of VITEL R-60B polyester resin and TOYOBO 670 polyester resin in a mass ratio of 3:1;

[0075] The coupling agent is Dow Corning's epoxy silane coupling agent YC-1027;

[0076] The leveling agent is Tego 655;

[0077] The anti-sedimentation agent is Deqian Chemical 229;

[0078] The thickener was Cabot's M-5.

[0079] The mass percentages of each component are:

[0080] Conductive Powder: 45%,

[0081] Solvent: 40%,

[0082] Polymer resin: 11.5%,

[0083] Coupling agent: 1.5%,

[0084] Anti...

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Abstract

The invention provides a low-temperature cured conductive paste with ultra-low silver content, which is prepared by the following components in percentage by weight: 45-50% of conductive powder, 40-45% of solvent, 10-15% of macromolecule resin, and 0-5% of additive, wherein the conductive powder is a mixture of 35-40% of silver flake powder, 3-5% of conductive ferrophosphorus alloyed powder and 5-7% of conductive nickel powder accounting for the conductive paste in percentage by weight; the solvent is one of dibasic ester (DBE), diethylene glycol monoethyl ether acetate or 2-Butoxyethyl acetate; the macromolecule resin is hydroxyl-modified vinyl resin or polyester resin; and the additive comprises one or more of coupling agent, suspending agent, thickening agent and flatting agent. The silver content of the conductive paste of the invention is below 40%, and demands of customers on resistance and other aspects are met while reducing cost.

Description

technical field [0001] The invention relates to a conductive paste, in particular to a low-temperature curing conductive paste with ultra-low silver content and a preparation method thereof. Background technique [0002] At present, the low-temperature curing silver paste technology is quite mature. In today's more intense and cruel industry competition, in addition to the promotion of environmentally friendly products, cost reduction has become another very important issue for low-temperature silver paste. Nowadays, foreign silver paste manufacturers such as Acheson, Dupont, Fujikura, and Changxing have launched low-silver-content low-temperature curing conductive silver pastes. According to different needs of customers, the silver content of mainstream low-temperature curing silver pastes on the market varies greatly. Large, from 45% to 55% or more, there are many products. In order to meet the needs of customers, some manufacturers at home and abroad have further reduce...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 朱万超
Owner IRICO
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