Manufacturing method of suede cleaning roller

Abstract

The invention discloses a manufacturing method of a suede cleaning roller which is used in the fields of common printed circuit boards, optical thin film materials, liquid crystal display panels and the like. A suede bonding paint coat is arranged outside the suede cleaning roller, and the suede bonding paint comprises the following components in portions by weight: 40-60 portions of maleic anhydride dibutyl ester, 10-30 portions of acrylic acid 2-ethyl sulfosuccinate, 5-35 portions of butyl acrylate, 2-4 portions of glycidyl acrylate, 0.5-4 portions of methacrylic acid, 60-100 portions of alkane organic solvent, 1-10 portions of suede additive, 0-2 portions of dispersant, 0-1 portion of defoaming agent, 0-1 portion of leveling agent, 0-2 portions of antisettling agent, 0-1 portion of anti-aging agent and 60-100 portions of binding resin. The suede binding paint is evenly coated on a substrate to prepare the suede cleaning roller. The coat which is used for adsorbing an impurity / foreign matter, on the cleaning roller is the suede binding paint coat instead of a pressure-sensitive coat. The suede cleaning roller is soft, feels like suede, and is delicate and fine. The suede cleaning roller can be used for directly contacting the printed circuit boards, the liquid crystal display panels and the like to achieve the goal of adsorbing and cleaning the tiny dust on the surfaces of the printed circuit boards, the liquid crystal display panels and the like.

Description

technical field [0001] The invention relates to a manufacturing method of a suede cleaning roller which is in direct contact with the surface of a printed circuit board and an optical film material. Background technique [0002] Printed circuit boards are the basis for miniaturization and light weight of all electronic products. It is usually composed of a molecular-level conductive noble metal layer and an ultra-thin plastic film. After printing and etching, all impurities and foreign matter that may remain on the surface must be removed to ensure that the circuit board is qualified. The cleaning method is to use a traditional pressure-sensitive adhesive type cleaning roller to contact the conductive layer, and use the adhesiveness of the pressure-sensitive adhesive to remove impurities or foreign objects, but the printed circuit board is extremely thin and soft. When the pressure-sensitive adhesive is in contact with it, the circuit board is often rolled up and bent; cau...

AI Technical Summary

Problems solved by technology

The cleaning method is to use a traditional pressure-sensitive adhesive type cleaning roller to contact the conductive layer, and use the adhesiveness of the pressure-sensitive adhesive to remove impurities or foreign objects. However, due to the extremely thin and soft printed circuit board

When the pressure-sensitive adhesive is in contact with it, the circuit board is often rolled up and bent; causing the circuit board to wrinkle, deform and be scrapped; if the pressure-sensitive adhesive is reduced, the conductive metal layer will be damaged due to the increase in hardness , or the purpose of cleaning the circuit board cannot be achieved due to a significant reduction in adhesion. In the cleaning process, there are also cases where the silicone release agent layer is not completely cured and falls off and transfers to the conductive metal layer, which affects the non-conductivity of the circuit. ACCIDENT

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