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Curable resin composition for nanoimprint

一种固化性树脂、纳米压印的技术，应用在纳米技术、纳米技术、用于信息加工的纳米技术等方向，能够解决基体材料贴合性不充分、不适于形成图案等问题，达到提高模具剥离性、剥离性优异、贴合性好的效果

Active Publication Date: 2011-03-09
DAICEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the reaction system is a free radical curing system and is a solvent-free system, it also sacrifices the adhesion to the base material while improving the mold release property, which is not suitable for forming good patterns.
In particular, when used instead of photolithography, low-residue films can be obtained, but adhesion to substrates is not sufficient when using this method

Method used

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  • Curable resin composition for nanoimprint
  • Curable resin composition for nanoimprint
  • Curable resin composition for nanoimprint

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～11、 comparative example 1～3

[0163] 1) Coating film preparation method

[0164]

[0165] A 4-inch silicon wafer pre-treated with hexamethyldisilazane was used as the Si substrate material.

[0166]

[0167] The photocurable resin composition for nanoimprinting is shown in Table 1, using a compound (A) having a reactive functional group and a hydrophobic functional group in the same molecular skeleton, a curable monomer (B), an initiator (C), an extender The sensitizer (D), nano-sized particles (E), binder resin (film forming aid: F), and solvent (G) were prepared by a known method with a spin coater. The specific compound of each component in Table 1 is shown below.

[0168] Compounds with reactive functional groups and hydrophobic functional groups in the same molecular skeleton: as shown in Table 2.

[0169] Curable monomer: as shown in Table 3.

[0170] Initiator

[0171] C-1: 4-methylphenyl[4-(1-methylethyl)phenyliodonium tetrakis(pentafluorophenyl)borate / PI2074 manufactured by ROHDEA / radiatio...

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Abstract

Disclosed is a photocurable resin composition for nanoimprint, which contains a curable monomer, or alternatively a curable monomer and a binder resin. The photocurable resin composition for nanoimprint is characterized by further containing 0.001-5 parts by weight of a compound, which has a reactive functional group and a hydrophobic functional group in the same molecular structure, per 100 parts by weight of the total of the curable monomer and the binder resin. The reactive functional group is preferably composed of at least one functional group selected from the group consisting of a hydroxyl group, an epoxy group, a vinyl ether group, an oxetanyl group, an alkoxysilane group and a radically polymerizable vinyl group. The hydrophobic functional group is preferably composed of at leastone functional group selected from the group consisting of a fluorine atom-containing group, an alkylsilane group, an alicyclic hydrocarbon group, and an aliphatic hydrocarbon group having 4 or more carbon atoms.

Description

technical field [0001] The present invention relates to a photocurable resin composition for nanoimprinting suitable for forming fine patterns with high precision by nanoimprinting in the field of microlithography, a cured product thereof, a method for producing a fine structure using the same, and the use of the photocurable resin composition for nanoimprinting Microstructures produced by the method. Background technique [0002] Essentially, the miniaturization of electronic components whose resolution must be in the range below 1 μm can be realized by photolithography. The case of smaller structures has been realized with the development of ArF and its immersion technology, but from around 32nm, due to the similar size to the resin used, problems such as line edge roughness become obvious. In addition, due to the increasing requirements for resolution, wall tilt, and aspect ratio (ratio of resolution to height), photolithographic structures such as masks, mask aligners, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F20/32B29C59/02C08F2/44G03F7/20H01L21/027B29K63/00
CPCG03F7/027B82Y40/00B82Y10/00G03F7/0002C08F2/48G03F7/0048G03F7/038B29C2059/023H01L21/0274Y10T428/24479
Inventor 三宅弘人伊吉就三
Owner DAICEL CORP
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