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Nano-structure Ni-base composite electroplating solution containing nano Si3N4 particles and preparation method thereof

A composite electroplating and nanostructure technology, which is applied in the fields of electrochemistry and metal surface treatment, can solve the problems of high cost, high pollution hardness, etc., and achieve the effects of excellent corrosion resistance, reduced coating thickness, and low raw material cost

Inactive Publication Date: 2011-05-11
JIAXING TIANQI NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the technical defects of high cost, high pollution and hardness that cannot meet the requirements in the existing electroplating, the first purpose of the present invention is to provide a nano-Si 3 N 4 The nanostructure Ni base composite electroplating solution of particle, the second object of the present invention is to provide and adopt above-mentioned nano-Si containing 3 N 4 The configuration method of the nanostructure Ni-based composite electroplating solution of the particles adopts the characteristics of good bonding force between the film material and the substrate produced by the composite electroplating solution of the present invention, excellent corrosion resistance, high hardness and good wear resistance

Method used

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  • Nano-structure Ni-base composite electroplating solution containing nano Si3N4 particles and preparation method thereof
  • Nano-structure Ni-base composite electroplating solution containing nano Si3N4 particles and preparation method thereof
  • Nano-structure Ni-base composite electroplating solution containing nano Si3N4 particles and preparation method thereof

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Embodiment 1

[0042] A nano-Si 3 N 4 The preparation method of the nanostructure Ni base composite thin film material of particle, this method comprises the following steps:

[0043] (1) Nano Si 3 N 4 Surface chemical modification before particle plating

[0044] Nano-Si 3 N 4 The particles were surface chemically modified in sodium lauryl sulfate solution at the following ratio: per 1 gram of Si 3 N 4 The particles were dispersed in 4 liters of sodium dodecyl sulfate solution with a concentration of 1.2 g / L, and then ultrasonically dispersed for 3 hours to carry out surface chemical modification before plating.

[0045] (2) Configuration of composite plating solution

[0046] The concentration of each component of the electroplating solution is as follows: nickel sulfate hexahydrate 200g / L; nickel chloride hexahydrate 48g / L; boric acid 45g / L; sodium lauryl sulfate 1.7g / L; 1-4 butynediol 0.4g / L; sodium allyl sulfonate is 0.6g / L, sodium propyne sulfonate is 0.8g / L; the above electro...

Embodiment 2

[0058] A nano-Si 3 N 4 The preparation method of the nanostructure Ni base composite thin film material of particle, this method comprises the following steps:

[0059] (1) Nano Si 3 N 4 Surface chemical modification before particle plating

[0060] Nano-Si 3 N 4 The particles were surface chemically modified in sodium lauryl sulfate solution at the following ratio: per 1 gram of Si 3 N 4 The particles were dispersed in 4 liters of sodium lauryl sulfate solution, the concentration of the sodium lauryl sulfate solution was 1.5 g / L, and then ultrasonic dispersion was used for 4 hours to carry out surface chemical modification before plating.

[0061] (2) Configuration of composite plating solution

[0062] The concentration of each component of the electroplating solution is as follows: nickel sulfate hexahydrate 180g / L; nickel chloride hexahydrate 55g / L; boric acid 50g / L; sodium lauryl sulfate 1.7g / L; 1-4 butynediol 0.4g / L; sodium allyl sulfonate is 0.8g / L, sodium prop...

Embodiment 3

[0074] A nano-Si 3 N 4 The preparation method of the nanostructure Ni base composite thin film material of particle, this method comprises the following steps:

[0075] (1) Nano Si 3 N 4 Surface chemical modification before particle plating

[0076] Nano-Si 3 N 4 The particles were surface chemically modified in sodium lauryl sulfate solution at the following ratio: per 1 gram of Si 3 N 4 The particles were dispersed in 6 liters of sodium lauryl sulfate solution, the concentration of the sodium lauryl sulfate solution was 0.8g / L, and then ultrasonic dispersion was used for 3 hours to carry out surface chemical modification before plating.

[0077] (2) Configuration of composite plating solution

[0078] The concentration of each component of the electroplating solution is as follows: nickel sulfate hexahydrate 220g / L; nickel chloride hexahydrate 45g / L; boric acid 50g / L; sodium lauryl sulfate 1.7g / L; 1-4 butynediol 0.4g / L; sodium allyl sulfonate is 1.2g / L, sodium propy...

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Abstract

The invention belongs to the technical fields of electrochemistry and metal surface treatment, in particular relates to a nano-structure Ni-base composite electroplating solution containing nano Si3N4 particles and a preparation method thereof. Every 1L of the nano-structure Ni-base composite electroplating water solution containing nano Si3N4 particles comprises 5-12g of the nano Si3N4 particles, 160-220g of nickel sulfate hexahydrate, 42-57g of nickel chloride hexahydrate, 40-55g of boric acid, 1.6-5.0g of lauryl sodium sulfate, 0.1-1.0g of 1,4-butynediol and 0.8-5.0g of brightener, whereinthe nano Si3N4 particles are firstly subjected to surface chemical modification by using a lauryl sodium sulfate solution. A thin-film material produced by using the composite electroplating solutionprovided by the invention has the characteristics of favorable binding force with a substrate, favorable corrosion resistance, higher hardness and favorable wear resistance.

Description

technical field [0001] The invention belongs to the technical field of electrochemistry and metal surface treatment, in particular to a 3 N 4 Particle nanostructure Ni-based composite electroplating solution and preparation method thereof. Background technique [0002] Traditional nickel plating generally uses double-layer nickel, multi-layer nickel or "copper layer + nickel layer", and "chrome plating or chrome passivation" is also performed later. The process is relatively complicated, which increases the operating cost in production. At the same time, the Cr The use has also brought serious environmental problems; moreover, the hardness of the traditional nickel plating layer is around 200~300 Hv, which is far from meeting customer requirements. And "energy saving, environmental protection, low consumption" is the goal pursued by the electroplating industry at this stage. [0003] Adding "inert nanoparticles with chemically modified surface" to the optimized nickel pla...

Claims

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Application Information

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IPC IPC(8): C25D3/16C25D15/00B82Y30/00
Inventor 张昭李劲风蔡超
Owner JIAXING TIANQI NEW MATERIAL TECH
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