Method for processing micropore of patch clamp chip

Abstract

The invention discloses a method for processing a micropore of a patch clamp chip. The method comprises the following steps of: 1) expanding an ultraviolet Gaussian laser beam which is emitted by an ultraviolet laser and has the power of 1 to 7W by using a beam expander; 2) taking a central light spot of the ultraviolet Gaussian laser beam with an aperture of 1.2 to 1.8 millimeters out through an adjusting diaphragm from the ultraviolet Gaussian laser beam expanded by the beam expander; and 3) focusing the central light spot of the ultraviolet Gaussian laser beam to the surface of the glass patch clamp chip for perforation, and during perforation, forming a funnel-shaped micropore on the glass patch clamp chip by controlling a central diameter of the adjusting diaphragm in the step 2). By the method, the high energy of the focused ultraviolet laser can break a molecular structure of a glass material on a patch clamp chip clamp within an extreme time, and uniform pores can be formed on the glass material.

Description

technical field [0001] The invention relates to the technical field of laser microhole processing, in particular to a microhole processing method for a patch clamp chip. technical background [0002] Patch clamp technique is an important technique in ion channel research. Although the classic patch clamp has the advantages of large technical information content and high resolution, its disadvantages such as low throughput, cumbersome operation, and high requirements for experimental conditions limit its application in researches such as cell physiology and drug discovery. Therefore, patch clamp chip technology came into being. Patch clamp chip technology can perform high-throughput electrophysiological measurements, automatically form high-impedance seals, and can be combined with optical measurement methods, which promotes the research of ion channels and high-throughput drug screening. The patch clamp chip technology uses a planar structure with micron-scale holes instea...

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Problems solved by technology

In addition, it also has the advantages of uniform drilling, small heat-affected zone, no noise during processing, good verticality of slit edge, smooth cutting edge, easy automatic control of the processing process, etc., but the current laser drilling technology has the smallest The processed pore diameter is about 100 μm, and it is difficult to punch hole-like micropores

In addition, conventional YAG lasers and CO 2 It is difficult for the laser to act on the glass material, the processing effect is poor, and the processed glass is prone to cracks and chipping, which cannot meet the requirements of the diaphragm embedded chip processing

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