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Wire-cutting wire of structural electrodeposited abrasive material

A kind of wire cutting wire and structural technology, applied in the field of hard and brittle material cutting and processing consumables, can solve the problems of poor cooling effect, large cutting force, time-consuming, etc., achieve sufficient lubrication and cooling, enhance chip removal ability, and overcome aging failure Effect

Inactive Publication Date: 2011-08-17
CHANGSHA DIAT NEW MATERIAL SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are two outstanding problems in this cutting method, which hinder the popularization and application of electroplated diamond wire: one is that the electroplated diamond wire is easy to break during the cutting process
An electroplated diamond wire made of a layer of compact but discontinuous diamond particles embedded on the surface of the metal base wire by electrochemical means; during the cutting process, especially when cutting large-size silicon ingots, chips cannot be discharged in time and accumulate on the In the cutting seam, the feed of the cutting wire is affected and the wire is broken, causing very serious impacts, such as scrap loss of electroplated diamond wire, debris, poor cutting surface quality, time-consuming, etc.; second, the cutting fluid that undertakes cooling and lubrication functions is difficult to uniform, Fully enter the cutting seam, resulting in high cutting force and poor cooling effect during high-speed cutting

Method used

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  • Wire-cutting wire of structural electrodeposited abrasive material
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] See attached figure 1 , the present invention chooses that the curved surface shape is an S-shaped structural metal wire, the wire diameter is 0.10 mm, and the projected wire diameter is a metal embryo wire of 0.13 mm. The diamond particle size is 5 to 20 μm, and the average particle size is 13 μm. The structure Degreasing and derusting metal embryo wires, composite electrodeposited diamond and metal nickel, cleaning and drying to obtain structural electroplated diamond wires, and using the same wire diameter, same diamond particle size, and linear diamond wire prepared by the same process. Cut comparison. On the same cutting machine, slice two polysilicon ingots of the same size, and when the linear electroplated diamond wire basically has no cutting ability, measure the slice area and other parameters, as shown in Table 1:

[0027] Table 1

[0028]

[0029] The structural electrodeposited diamond wire basically has no broken wires, and the cutting efficiency and ...

Embodiment 2

[0031] See attached figure 1 , the present invention chooses that the curved surface shape is an S-shaped structural metal wire, the wire diameter is 0.20 mm, and the projected wire diameter is a metal embryo wire of 0.27 mm. The diamond particle size is 30-45 μm, and the average particle size is 36 μm. The structure Degreasing and derusting metal embryo wires, compounding electrodeposited diamond and metal nickel, cleaning and drying to obtain structural electrodeposited diamond wires, and linear diamond wires prepared with the same wire diameter, the same diamond particle size, and the same process Compare cuts. On the same cutting machine, slice two polysilicon ingots of the same size, and measure parameters such as the slice area when the linear diamond wire has no cutting ability, as shown in Table 1:

[0032] Table 1

[0033]

[0034] The structural electrodeposited diamond wire basically has no broken wires, and the cutting efficiency and slice quality are signific...

Embodiment 3

[0036] See attached figure 1 , the choice of the present invention is a Z-shaped structural metal wire with a curved surface, a wire diameter of 0.50 mm, and a metal embryo wire with a projected wire diameter of 0.6 mm. The particle size of cubic boron nitride particles is 50-70 μm, and the average particle size is 58 μm. , remove oil and rust from the structural metal embryo wire, composite electrodeposited cubic boron nitride and metal nickel, wash and dry to obtain a structured electrodeposited cubic boron nitride wire, and use the same wire diameter and the same cubic boron nitride The particle size and the linear cubic boron nitride wire prepared by the same process were cut and compared. On the same cutting machine, slice two polysilicon ingots of the same size, and measure parameters such as the slice area when the linear cubic boron nitride wire basically has no cutting ability, as shown in Table 1:

[0037] Table 1

[0038]

[0039] The structural electrodeposited ...

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Abstract

The invention relates to a wire-cutting wire of a structural electrodeposited abrasive material, comprising a structural metal blank wire, superhard abrasive material granules and a coating. The superhard abrasive material granules and the coating are plated on the surface of the structural metal blank wire which uses the axis of the structural metal blank wire as a basic wire, and a plurality of segments of S-shaped or Z-shaped curves are distributed in a range of 360 degrees along the axis of the structural metal blank wire; the structural metal blank wire has the projection diameter of 0.1-0.6 mm; and the abrasive material granules are selected from diamond granules or cubic boron nitride granules with the grain sizes of 10-50 microns. In the invention, the wire-cutting wire is prepared by using the structural metal blank wire as the basic wire and using a composite galvanization method, has favorable scrap containing and retreating functions, and is beneficial to effective prevention of the obvious problem of broken wire; meanwhile, the formed stable and high-efficiency cutting state improves the use efficiency of the wire-cutting wire of the structural electrodeposited abrasive material, and the wire-cutting wire is suitable for industrial application.

Description

technical field [0001] The invention relates to a wire-cutting wire for electrodeposited abrasives, in particular to a wire-cut wire for structured electrodeposited abrasives, and belongs to the field of cutting and processing consumables for hard and brittle materials. Background technique [0002] Cutting and processing of hard and brittle materials is a key process in the field of production and application of hard and brittle materials. Its main technical requirements are: high efficiency, low cost, no or less damage to the sliced ​​surface, and no environmental pollution. Electroplated diamond wire cutting is now a new method with high efficiency, energy saving and environmental protection. It can cut flat and curved surfaces with narrow kerf and high yield. It is suitable for precision cutting of precious hard and brittle materials. However, there are two outstanding problems in this cutting method, which hinder the popularization and application of electroplated diamo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/06
Inventor 贺跃辉匡怡新
Owner CHANGSHA DIAT NEW MATERIAL SCI & TECH
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