Method for manufacturing heat-resisting temperature differential thermoelectric component

A technology of thermoelectric devices and manufacturing methods, which is applied in the direction of manufacturing/processing of thermoelectric devices, can solve problems such as high-temperature melting of solder joints, device failure, etc., and achieve the effect of increasing the use temperature and high application value

Active Publication Date: 2011-08-17
XUZHOU XINLONG ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention proposes a method for manufacturing a high-temperature-resistant thermoelectric device, which uses a combination of welding and bonding to manufacture a large-sized sandwich-struct

Method used

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  • Method for manufacturing heat-resisting temperature differential thermoelectric component
  • Method for manufacturing heat-resisting temperature differential thermoelectric component
  • Method for manufacturing heat-resisting temperature differential thermoelectric component

Examples

Experimental program
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Effect test

Example Embodiment

[0046] In Example 1, a low-temperature solder with a melting point temperature of only 138 degrees was used to solder the semiconductor block, and Thomas potting glue with a heat-resistant temperature of 360 degrees was used for potting. After potting, it was cured at a temperature of 80 degrees for 48 hours. When the manufactured thermoelectric device is used for thermoelectric power generation, the hot end substrate can withstand a high temperature of 260 degrees for a long time without being damaged.

Example Embodiment

[0047] In Example 2, a tin-silver solder with a melting point of 221 degrees was used to solder the semiconductor block, and a copper oxide-phosphate inorganic glue with a heat-resistant temperature of 800 degrees was used for potting. After potting, it was cured at 150 degrees for 48 hours. When the manufactured thermoelectric device is used for thermoelectric power generation, the hot end substrate can withstand a high temperature of 360 degrees for a long time without being damaged. The instantaneous heat-resistant temperature of the hot end face of the device reaches 450 degrees.

[0048] Such as Figure 4 As shown, in order to reduce the heat loss caused by the heat conduction of the sealing glue and the temperature difference between the hot and cold surfaces, the filling amount of the glue can be reduced when the heat-resistant thermosetting insulating glue is filled, and only half the height of the thermoelectric semiconductor material block is filled After cleaning the ...

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Abstract

The invention provides a method for manufacturing a heat-resisting temperature differential thermoelectric component, which comprises the steps of : making a hot end substrate; making a semi-product module; filling thermosetting insulating glue; cleaning up surplus glue; cleaning up the glue on the upper surface of a solid sealed thermoelectric semi-conductor block to expose a cleaned upper surface by using a polishing device so as to prepare for next step of welding with a welding pad on a cold end substrate; welding the cold end substrate in the same way as the second step so as to weld the upper surface of the thermoelectric semi-conductor block, cleaned up by the fourth step, with the corresponding welding pad on the cold end substrate together; till now, completing the manufacturing process. The invention has the advantage that even if the hot end temperature exceeds the melting point of a brazing filler metal to cause the melting of solder at a joint, the component can work securely due to a curing sealing compound around the component, thus the highest temperature born by the hot end of the temperature differential thermoelectric component is greatly increased. The invention has great potential application in low-level thermal energy power generation.

Description

technical field [0001] The invention belongs to the technical field of packaging and manufacturing of thermoelectric devices of temperature difference. In particular, it relates to a method for manufacturing a high temperature resistant thermoelectric device. Background technique [0002] Thermoelectric devices are devices that use the Seebeck effect of materials to achieve thermoelectric conversion, and can be used for thermoelectric refrigeration and thermoelectric power generation. Since there are no mechanical moving parts in thermoelectric power generation, it has the advantages of no noise, maintenance-free, and long service life. In recent years, with the global energy shortage, the calls for energy conservation, emission reduction and energy recovery in various fields are getting higher and higher, and semiconductor thermoelectric power generation is using low-grade heat energy, such as waste heat from engine exhaust, waste heat from thermal power plants, garbage T...

Claims

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Application Information

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IPC IPC(8): H01L35/34
Inventor 程方杰李维毅
Owner XUZHOU XINLONG ELECTRONIC TECH CO LTD
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