Method for manufacturing heat-resisting temperature differential thermoelectric component

Abstract

The invention provides a method for manufacturing a heat-resisting temperature differential thermoelectric component, which comprises the steps of : making a hot end substrate; making a semi-product module; filling thermosetting insulating glue; cleaning up surplus glue; cleaning up the glue on the upper surface of a solid sealed thermoelectric semi-conductor block to expose a cleaned upper surface by using a polishing device so as to prepare for next step of welding with a welding pad on a cold end substrate; welding the cold end substrate in the same way as the second step so as to weld the upper surface of the thermoelectric semi-conductor block, cleaned up by the fourth step, with the corresponding welding pad on the cold end substrate together; till now, completing the manufacturing process. The invention has the advantage that even if the hot end temperature exceeds the melting point of a brazing filler metal to cause the melting of solder at a joint, the component can work securely due to a curing sealing compound around the component, thus the highest temperature born by the hot end of the temperature differential thermoelectric component is greatly increased. The invention has great potential application in low-level thermal energy power generation.

Description

technical field [0001] The invention belongs to the technical field of packaging and manufacturing of thermoelectric devices of temperature difference. In particular, it relates to a method for manufacturing a high temperature resistant thermoelectric device. Background technique [0002] Thermoelectric devices are devices that use the Seebeck effect of materials to achieve thermoelectric conversion, and can be used for thermoelectric refrigeration and thermoelectric power generation. Since there are no mechanical moving parts in thermoelectric power generation, it has the advantages of no noise, maintenance-free, and long service life. In recent years, with the global energy shortage, the calls for energy conservation, emission reduction and energy recovery in various fields are getting higher and higher, and semiconductor thermoelectric power generation is using low-grade heat energy, such as waste heat from engine exhaust, waste heat from thermal power plants, garbage T...

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Problems solved by technology

[0005] The present invention proposes a method for manufacturing a high-temperature-resistant thermoelectric device, which uses a combination of welding and bonding to manufacture a large-sized sandwich-structured thermoelectric device. This method can effectively solve the problems caused by the simple welding process in the traditional method. Component failure caused by high temperature melting of solder joints

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