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Conductive paste composition

A technology of conductivity and paste, which is applied in the field of conductive paste components for gravure offset printing, can solve the problems of waste of paste components, difficulty in obtaining fine line width, and reduced productivity, etc., to achieve reduced waste liquid, excellent physical properties, The effect of improving productivity

Inactive Publication Date: 2011-08-17
SSCP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned photosensitivity makes the therapy suitable for large-area panel technology, but the slurry components need to be coated on the entire substrate, resulting in waste of slurry components, and because of the need to go through multiple processes, thereby reducing productivity
In addition, screen printing also has the disadvantage that it is difficult to obtain fine line widths

Method used

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  • Conductive paste composition
  • Conductive paste composition
  • Conductive paste composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] The above-mentioned binder resin is produced by adding (poly)isocyanate to a polymer obtained by polymerizing at least one or more monomers that provide the repeating unit of the above Chemical Formula 1 and stirring, and the above-mentioned polymer and (poly)isocyanate The weight ratio is 100:1-10, and preferably 100:1-5. Within the above range, the binder resin becomes more suitable for footprint printing by partial cross-linking between monomer molecules caused by combination of potassium urethane formed by the reaction of isocyanate and hydroxyl group, In addition, stable dispersion of glass frit and metal fine powder and improvement of setting characteristics during printing can be obtained. If the weight ratio of the above-mentioned polymer and (poly)isocyanate is less than 100:1, the continuous printing characteristics will be reduced, and if it is greater than 100:5, the viscosity of the binder resin will increase, and the size of the paste will decrease. Moreo...

preparation example 1

[0050] 10% by weight of acrylic acid-2-hydroxyethyl (HEA) and 40% by weight of (meth)acrylic acid n-butyl (BA) were used as monomers, and 2% by weight of 2,2-isocyanate (BA) was selected as a polymerization initiator. Azodiisobutyronitrile (AIBN), after selecting 50% by weight of diethylene glycol butyl ether acetate (BCA) as the solvent, the solvent is dropped into the reactor and under the reaction temperature condition of 100°C, the monomer and the polymerization initiator are mixed The polymer was prepared by dripping the liquid into the reactor over two hours. 1% by weight of isophorone diisocyanate (IPDI) was added to the prepared polymer and then stirred for three hours to prepare a binder resin having a viscosity of 10,000 cP and a weight average molecular weight of 15,000.

preparation example 2

[0052] A binder resin having a viscosity of 15,000 cP and a weight-average molecular weight of 20,000 was prepared by the same method as in Preparation Example 1 above except that the content of isophorone diisocyanate was increased to 3% by weight.

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Abstract

The present invention relates to a conductive paste composition which comprises: a binder resin in which a urethane group is present in a main chain or side chain, especially a binder resin formed from both (poly)isocyanate and a polymer with at least one hydroxyl group, fine powder, glass frit, and solvent. The conductive paste composition ensures excellent physical properties and can reduce waste liquid such as aqueous alkaline solution, so environment problems and productivity can be improved. The conductive paste composition is especially useful for a paste for gravure offset printing by forming structurally-improved fine patterns.

Description

technical field [0001] The present invention relates to a conductive paste component, and particularly relates to a conductive paste component for gravure offset printing. Background technique [0002] Methods for forming electrode patterns for display devices such as plasma display panels (PDPs), solar cells, optical filters, and other electronic devices include vapor deposition, photosensitive paste, screen printing, Various methods such as an inkjet printing method. [0003] Among them, in the photosensitive paste method, a film is formed on a substrate by screen printing using a paste component containing photosensitive inorganic particles, and then the film is irradiated with ultraviolet light through a light-shielding film to leave a pattern on the substrate and then molded. The photosensitivity described above is suitable for large-area panel technology, but the slurry components need to be coated on the entire substrate, resulting in waste of slurry components, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/20
CPCC09D11/033H01B1/20C09D11/102C09D11/52H01J2211/225
Inventor 金朱镐金和重金仁喆
Owner SSCP CO LTD