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Preparation method of porous core with gradient composite structure

A composite structure and hole core technology, which is applied to semiconductor/solid-state device parts, instruments, semiconductor devices, etc., can solve the problems of increased internal pressure, affecting heat dissipation effect, and reduced thermal conductivity, so as to achieve smooth micropores and heat dissipation The effect of strong ability and high thermal conductivity

Inactive Publication Date: 2012-07-25
SHANDONG UNIV
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Problems solved by technology

[0004] Ordinary porous core heat exchanger generally includes evaporation zone, heat insulation zone and condensation zone. Each zone adopts porous core (porous alloy heat pipe) with the same compaction density, pore diameter and porosity. In the microstructure, when the working fluid phase When changing, its internal pressure will increase sharply, resulting in poor permeability, lower thermal conductivity, and affect heat dissipation effect

Method used

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  • Preparation method of porous core with gradient composite structure
  • Preparation method of porous core with gradient composite structure
  • Preparation method of porous core with gradient composite structure

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Embodiment Construction

[0022] Such as figure 1 As shown, the heat exchanger is generally divided into evaporation zone 1, adiabatic zone 2 and condensation zone 3. In actual operation, the working medium in evaporation zone 1 is mainly liquid phase, and the working medium in adiabatic zone 2 is vapor-liquid two-phase, and condensation The working fluid in zone 3 is mainly gas phase. To achieve the best heat dissipation effect, the aperture of the porous core in the evaporation zone 1 is the smallest, the aperture of the porous core in the condensation zone 3 is the largest, and the aperture of the porous core in the heat insulation zone 2 is between the two (currently the porous core in each area using the same compacted density, pore size and porosity). In this way, when preparing the porous core of three regions (evaporation region, adiabatic region and condensation region), it is necessary to consider the preparation process of the porous core in three regions, the critical surface of the evapor...

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Abstract

The invention relates to a preparation method of a porous core with a gradient composite structure. The method comprises the steps of mixing metal powder and a polyester ball to form three different kinds of blended powder; making the three different kinds of blended powder into a blank; conducting grinding to remove a metal layer at the outer layer of the blank after the blank is prepared; bonding the grinded blanks into a whole according to the aperture sequence from small to big of the polyester balls; and firing the three blanks which are bonded into a whole in a vacuum furnace, wherein the outer layer thickness of the blank removed is not smaller than the radius of the polyester ball. The porous core prepared has a gradient composite structure, the aperture and porosity of each layerare different, and the porous core is strong in radiating capability, good in permeability and high in heat conductivity, and can meet the requirements of a minitype heat pipe radiator on the porous core.

Description

technical field [0001] The invention relates to a manufacturing method of a porous core used for heat dissipation of electronic devices, and belongs to the technical field of heat dissipation materials. Background technique [0002] With the development of digitization and network informatization, the demand for the performance and speed of microelectronic devices is getting higher and higher. At present, semiconductor technology has entered the nanometer level, and more transistors can be manufactured on IC chips. Based on portability and integration Functional requirements are also currently developing in the direction of a system-on-a-chip. Active devices such as transistors in ICs generate a lot of heat when they are operating. As the number of transistors in the chip increases, the heat generated will also increase. If the chip area does not increase significantly, the heat generation density of the device will increase. Overheating has become a bottleneck restricting ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427H01L23/36G06F1/20
Inventor 陈岩张树生郭雷常威陈雅群田帅霍梦佳位红燕安保睿
Owner SHANDONG UNIV