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Silicon wafer finger print removing method and cleaning method

A technology of finger prints and silicon wafers, applied in cleaning methods and utensils, chemical instruments and methods, cleaning methods using liquids, etc., can solve problems such as container damage, influence on electrical effects, and change, and reduce the ratio of color difference films , Improve production efficiency, increase the effect of process time

Inactive Publication Date: 2011-09-14
JETION SOLAR HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Not only can this kind of finger prints not be removed after washing and making velvet, but also it will become obvious white spots after reacting with the liquid medicine.
This kind of white spot not only affects the normal diffusion and electrical effects, but also causes serious color difference after PECVD (Plasma Enhanced Chemical Vapor Deposition)
[0010] In the prior art, fingerprints on silicon wafers cannot be effectively removed
If an organic solvent is used to ultrasonically clean the silicon wafer, it will cause great damage to the container, and the organic solvent cannot directly take away the oil

Method used

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  • Silicon wafer finger print removing method and cleaning method
  • Silicon wafer finger print removing method and cleaning method
  • Silicon wafer finger print removing method and cleaning method

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Embodiment Construction

[0030] The invention discloses a method for removing fingerprints on a silicon chip and a cleaning method, which can effectively remove the fingerprints on the silicon chip and reduce the ratio of color difference films.

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] see figure 1 , figure 1 A flow chart of a method for removing fingerprints on a silicon wafer provided by an embodiment of the present invention.

[0033] The method for removing fingerprints on silicon wafers provided by the invent...

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Abstract

The invention discloses a silicon wafer finger print removing method which comprises the steps of adopting pure water to conduct ultrasonic cleaning on a silicon wafer; using the mixed solution of acetone and alcohol to soak the silicon wafer; and volatilizing the mixed solution of the acetone and alcohol on the surface of the silicon wafer. The method adopts the mixed solution of acetone and alcohol having volatility to soak the silicon wafer so as to enable the organic solvent and organic lipid to be mutually soluble fully, and through volatilizing the mixed solution of the acetone and alcohol, the mutually soluble organic lipid can be taken away to enable the silicon wafer finger print removing efficiency to be improved by 0.18 percent. The method can remove the finger print to greatest extent without influencing the normal process stability and increasing the process time, thus improving the electrical property of a silicon solar cell, improving the production efficiency of the silicon solar cell, and greatly reducing the proportion of color difference plates. The invention also discloses a silicon wafer cleaning method comprising the silicon wafer finger print removing method steps.

Description

technical field [0001] The invention relates to the technical field of silicon solar cell processing technology, in particular to a method for removing fingerprints on a silicon wafer and a cleaning method. Background technique [0002] At present, the main manufacturing process of monocrystalline and polycrystalline silicon solar cells has been standardized, and the main steps are as follows: [0003] a. Chemical cleaning and surface texture treatment: through chemical reaction, the original bright silicon wafer surface forms an uneven structure to increase light absorption; [0004] b. Diffusion: The surface of the P-type silicon wafer becomes N-type after diffusion, forming a PN junction, which makes the silicon wafer have a photovoltaic effect. The concentration, depth and uniformity of the diffusion directly affect the electrical properties of the solar cell, and the total amount of impurities diffused Measured by sheet resistance, the smaller the total amount of impur...

Claims

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Application Information

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IPC IPC(8): H01L31/18B08B3/08
CPCY02P70/50
Inventor 王守志殷立明王竞争赵静祝耀华
Owner JETION SOLAR HLDG
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