Granulated powder and method for producing granulated powder

A powder and granulation technology, which is applied in the field of granulation powder and granulation powder manufacturing, can solve the problems of high price, lower sintered body density, and high operating capital

Active Publication Date: 2011-09-21
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, a kiln that can be used at a temperature above 1200°C requires a special heat-resistant structure, so not only is it expensive, but its operating capital is also high.
[0007] On the other hand, in the case of lowering the sintering temperature, problems such as lowered density of the sintered body and poor mechanical properties may occur

Method used

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  • Granulated powder and method for producing granulated powder
  • Granulated powder and method for producing granulated powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0178] First, 2% Ni-Fe alloy powder (manufactured by EPSON ATMIX Co., Ltd., with a true density of 7.827 g / cm3) with an average particle diameter of 6 μm produced by a water spray method was prepared. 3 ) as raw material powder. In addition, the composition of the 2% Ni-Fe alloy is: C: 0.4% by weight to 0.6% by weight, Si: 0.35% by weight or less, Mn: 0.8% by weight or less, P: 0.03% by weight or less, S: 0.045% by weight Below, Ni: not less than 1.5% by weight and not more than 2.5% by weight, Cr: not more than 0.2% by weight, Fe: the remainder.

[0179] On the other hand, polyvinyl alcohol, montan wax, and sorbitan fatty acid ester were prepared as organic binders. In addition, ion-exchanged water was prepared as a solvent. In addition, the added amount of the solvent was 50 g per 1 g of the organic binder.

[0180] Next, these organic binders were mixed with ion-exchanged water and cooled to room temperature to prepare a binder solution. Moreover, the addition amount ...

Embodiment 2～9

[0188] Granulated powders were obtained in the same manner as in Example 1, except that the compositions and addition amounts of waxes and nonionic surfactants were changed to those shown in Table 1.

Embodiment 10～12

[0190] Except that the addition amount of waxes and nonionic surfactants was changed to the amount shown in Table 1, and the organic amines shown in Table 1 were added to the organic binder, respectively, the same as in Example 1 A granulated powder was obtained.

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Abstract

The invention provides a granulated powder and a method for producing granulated powder. The granulated powder comprises a plurality of metal particles and an organic binder. It is obtainable by binding a plurality of metal particles to one another by the organic binder. The organic binder contains polyvinyl alcohol or a derivative thereof, a wax, and a nonionic surfactant. The total amount of the wax and the nonionic surfactant is preferably from 0.01 to 1 part by weight based on 100 parts by weight of the metal particles. Further, the organic binder preferably further contains a polyol and an organic amine.

Description

technical field [0001] The present invention relates to a granulated powder and a method for producing the granulated powder. Background technique [0002] As a method of molding metal powder, there is known a compression molding method in which a mixture of metal powder and an organic binder is filled into a predetermined molding die and compressed to obtain a molded body of a predetermined shape. Degreasing the obtained molded body to remove the organic binder and sintering the sintered metal powder to become a metal sintered body. This technology is a type of powder metallurgy technology, and it has become popular in many industries in recent years because it can mass-produce metal sintered bodies with complex shapes according to the shape of the molding die. [0003] In the compression molding method, it is first necessary to fill the molding die with metal powder as much as possible without voids. Once there is a void in the molding die, this void will become a void r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F1/148
CPCB22F1/0096Y10T428/249921B22F1/148
Inventor 门村刚志
Owner SEIKO EPSON CORP
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