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A processing method and technology of copper clad laminates, which are applied in the field of composite boards to achieve the effects of low processing costs, reduced production energy consumption, and excellent loss conditions
Active Publication Date: 2011-09-21
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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Problems solved by technology
[0011] The technical problem to be solved by the present invention is to overcome the defects of various copper clad laminates in the prior art with their own advantages and disadvantages, and to provide a copper clad laminate with excellent comprehensive performance.
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Embodiment 1
[0042] Such as image 3 As shown, a copper clad laminate of the present invention includes two copper foil layers 1 and 5, which are respectively located on the upper and lower outermost sides. The copper clad laminate also includes upper layers 2 and 4 made of glass fiber cloth, a lower layer, and a core material 3 between the upper layer 2 and the lower layer 4 .
[0043] The core material 3 is composed of glass fiber cloth prepreg and glass fiber non-woven prepreg. The stacking in this embodiment is the alternate stacking of glass fiber cloth prepregs and glass fiber non-woven prepregs. Specifically, in this embodiment, the core material 3 is composed of two glass fiber non-woven fabric prepregs 31 and 33, and a glass fiber cloth prepreg 32 sandwiched between them.
[0044]Specifically, the thickness of the copper foil layers 1 and 5 is between 3-150um.
[0045] In other embodiments, the copper clad laminate may only include one copper foil layer as required.
[0046] A...
Embodiment 2
[0056] The present invention also provides a processing method for any of the above-mentioned copper-clad laminates, which at least includes the following steps:
[0057] Step one, deploy glue. The components in the glue system are proportioned and matured in an industrial stirred tank according to the formula requirements.
[0058] Step two, gluing. The glass fiber cloth and the glass fiber non-woven fabric are respectively dipped in the glue solution, then taken out and baked, and then cooled to obtain the glass fiber cloth prepreg and the glass fiber non-woven prepreg respectively.
[0059] In different specific embodiments, the obtained glass fiber cloth prepreg and glass fiber non-woven fabric prepreg can also be cut according to the required size.
[0060] Among them, the baking temperature of the glass fiber cloth is 150°C-200°C, and the baking temperature of the glass fiber non-woven fabric is 170°C-210°C.
[0061] The gluing parameters are shown in the table below:...
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Abstract
The invention discloses a copper-clad plate which at leas comprises a copper foil layer, an upper surface layer and a lower surface layer of glass fiber cloth, and a core material located between the upper surface layer and the lower surface layer, wherein the core material formed by overlapping the glass fiber cloth prepreg and glass fiber non-woven cloth prepreg in any manner. The invention also discloses a processing method of the copper-clad plate, which at least comprises the steps of mixing a glue liquid, gluing, overlapping, pressing and the like. Due to the structure and processing method, the copper-clad plate disclosed by the invention has excellent comprehensive performance, which not only guarantees good heat resistance, electric performance and drug resistance, but also obtains good stamping performance, mechanical strength and size stability; and the production cost is lower. The copper-clad plate disclosed by the invention has stronger adaptability to the PCB (printed circuit board) processing process, causes less loss of the PCB processing equipment, and has lower processing cost; and moreover, the production energy consumption of raw materials is relatively low, and pollution is less.
Description
technical field [0001] The invention relates to the technical field of composite boards, in particular to a copper clad board applied to PCBs. The present invention also relates to the composition and structure of the aforementioned copper clad laminate. Background technique [0002] As the development of electronic products tends to be multi-functional, the components of electronic products are also constantly developing in light, thin, short, small, etc., especially the wide application of high-density integrated circuit technology, which proposes high-performance, Requirements for high reliability and high security; requirements for good technical performance, low cost, and low energy consumption for industrial electronic products. Therefore, the core material of electronic products --- printed circuit board (Printed Circuit Board, referred to as PCB) base material CCL is facing higher technical requirements, more severe use environment and higher environmental protectio...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information
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