Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding

A microfluidic chip, thermocompression bonding technology, applied in the field of micromanufacturing, can solve the problems of high cost, complex processing method, affecting the performance of the microfluidic system, etc., and achieves low cost, efficient processing method, and increased bonding rate. Effect

Inactive Publication Date: 2011-09-21
DALIAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved in the present invention is: to overcome problems such as complex treatment methods, high cost, and influence on the performance of the microfluidic system that exist in the treatment met

Method used

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  • Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding
  • Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding
  • Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding

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Example Embodiment

[0025] Example: Using water treatment method to make a microfluidic chip with a size of 78×28mm. Attach figure 1 The process of making the chip is as follows:

[0026] 1. Injection molding PMMA microfluidic chip:

[0027] Injection molding PMMA microfluidic chip cover and substrate (equipment model: Chende CJ80M3V injection molding machine), mold temperature 85℃, melt temperature 250℃, filling time 3s, injection pressure 140Mpa, pressure holding time 3s. The overall size of the chip obtained by injection molding is 82×40mm, in which there is a "cross-shaped" microchannel pattern on the cover sheet. The two crossed microchannels are 65mm and 15mm in length respectively. The size of the microchannel is 80μm in width and 50μm in depth; 4 sizes on the cover sheet It is a small hole of Φ2, which is the chip reservoir, see attached figure 2 , 3 .

[0028] 2. Laser cutting chip cover and substrate:

[0029] Laser cutting chip cover sheet and substrate (equipment model: Leishen CLS2000 las...

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Abstract

Provided is a method for raising the hot pressing bonding rate of a PMMA micro fluidic chip formed by injection moulding. The invention is directed to the field of micro manufacture technology, especially relates to a method for raising the hot pressing bonding quality of a micro fluidic chip. The method is characterized in that carrying out water processing before hot pressing bonding; unlike a traditional hot pressing bonding process flow of from ultrasonic cleaning to drying in a baking oven to hot pressing bonding, a new process flow of from ultrasonic cleaning to water processing to drying the surface with nitrogen to hot pressing bonding is adopted. According to the invention, problems of complex processing method, high cost and negative influence on system operational performance in processing methods such as ultraviolet ray and MMA monomer surface modification and the like are overcome. The processing method is characterized by high efficiency, low cost, unchanged microfluid system performance and simple operation. At a same hot pressing bonding technological parameter, compared to untreated chips, the effective bonding areas of the chips treated with the method provided in the invention substantially increase, the bonding rates averagely increase 20 percent, thereby the bonding quality of the chips is effectively improved.

Description

technical field [0001] The invention belongs to the technical field of micro-manufacturing, and in particular relates to a method for improving the quality of thermocompression bonding of a micro-fluidic chip. Background technique [0002] Polymer microfluidic chips have been widely used in the fields of life science, medicine, food and environmental sanitation inspection due to their small size, low cost, portability, fast analysis speed, and fewer samples required for analysis. Currently commonly used polymer materials include polycarbonate (PC), polydimethylsiloxane (PDMS), and polymethyl methacrylate (PMMA). The methods for bonding PMMA microfluidic chips mainly include thermocompression bonding, adhesive bonding, ultrasonic bonding and laser bonding, among which thermocompression bonding is the most widely used. In order to improve the production efficiency of the chip, the cover sheet and the substrate of the chip are usually obtained by injection molding with an inje...

Claims

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Application Information

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IPC IPC(8): B81C3/00
Inventor 杜立群常宏玲付其达刘冲
Owner DALIAN UNIV OF TECH
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