Method for plating silver on surface of dendritic copper powder

A dendritic silver and copper powder technology, which is applied in liquid chemical plating, coating, metal material coating process, etc., can solve the problem of many chemical raw materials, incomplete coating of silver-coated copper powder, and complicated copper powder pretreatment process and other issues to achieve the effect of process safety

Inactive Publication Date: 2011-10-12
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] To sum up, the problems existing in the current silver-coated copper powder preparation process patents include: (1) the pretreatment process for copper powder is complicated; (2) during the preparation process, the plating solution is unstable, and the prepared silver-coated copper powder contains

Method used

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  • Method for plating silver on surface of dendritic copper powder

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Effect test

Embodiment 1

[0027] Take 5g of copper powder, add it to 200ml of dilute sulfuric acid with a weight ratio of 5%, and pickle it for 25 minutes under stirring conditions to remove oxides on the surface of the copper powder. After washing with deionized water three times, filter the water and set aside. Get 2.25g silver nitrate (Cu, AgNO 3 The molar ratio is 1:0.37) into 50ml of deionized water, add an appropriate amount of ammonia water until the solution becomes transparent; then weigh 0.25g of NaOH and dissolve it in 10ml of deionized water, then add the NaOH solution to the silver nitrate solution, the solution becomes cloudy , turn black, add ammonia water dropwise until the solution is clear. In 100ml deionized water, add 2.25g glucose (at this time AgNO 3 , glucose molar ratio is 1:0.94) and 0.3g tartaric acid, after stirring evenly, heat and boil for 10min, and obtain a reducing solution after cooling. Add the copper powder after pickling to the reducing agent solution, and add the ...

Embodiment 2

[0029] Take 10g of copper powder, add it to 400ml of dilute sulfuric acid with a weight ratio of 5%, and pickle it for 30 minutes under stirring conditions to remove oxides on the surface of the copper powder. After washing with deionized water three times, filter the water and set aside. Take 5g silver nitrate (Cu, AgNO 3 The molar ratio is 1:0.19) into 50ml of deionized water, add an appropriate amount of ammonia until the solution becomes transparent; then weigh 0.6g of NaOH and dissolve it in 10ml of deionized water, then add the NaOH solution to the silver nitrate solution, the solution becomes cloudy , turn black, add ammonia water dropwise until the solution is clear. In 200ml deionized water, add 5.5g glucose (at this time AgNO 3 , glucose molar ratio is 1: 1.04) and 0.5g tartaric acid, after stirring evenly, heat and boil for 10min, and obtain a reducing solution after cooling. Add the copper powder after pickling to the reducing agent solution, and add the main sal...

Embodiment 3

[0031] Take 50g of copper powder, add it to 2L dilute sulfuric acid with a weight ratio of 6%, pickle it for 30min under stirring condition, remove the oxide on the surface of copper powder, wash it with deionized water three times, filter the water and set aside. Get 30g silver nitrate (Cu, AgNO 3 The molar ratio is 1:0.22) into 200ml of deionized water, add an appropriate amount of ammonia water until the solution becomes transparent; then weigh 2.5g of NaOH and dissolve it in 50ml of deionized water, then add the NaOH solution to the silver nitrate solution, the solution becomes cloudy , turn black, add ammonia water dropwise until the solution is clear. Add 20g of glucose to 3L of deionized water (at this time AgNO 3 , glucose molar ratio is 1:0.63) and 4g of tartaric acid, after stirring evenly, heat and boil for 10min, and obtain a reducing solution after cooling. Add the copper powder after pickling to the reducing agent solution, and add the main salt according to th...

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Abstract

The invention discloses a method for plating silver on the surface of dendritic copper powder and belongs to the technical field of powder surface treatment. The method comprises the following steps: cleaning the dendritic copper powder with diluted acid; preparing a main saline solution and a reducing agent solution; when the copper powder is less than 100g, putting the copper powder into the reducing agent solution, and adding the main saline solution according to a 'quickly adding at first and then slowly adding' stage adding process; when the copper powder is not less than 100g, adding the reducing agent solution into the copper powder in stages and dropwise adding the main saline solution according to the 'quickly adding at first and then slowly adding' stage adding process; every 8-18 minutes, step-by-step uniformly adding the remaining reducing agent solution and dropwise adding the main saline solution according to the 'quickly adding at first and then slowly adding' stage adding process, thereby finishing the process of plating silver on the surface of the copper powder; settling the powder in a plating solution; pouring out the plating solution; washing the powder with deionized water and ethanol and then drying the powder in vacuum, thereby acquiring the silver-plated copper powder. A plated layer of the silver-plated copper powder prepared by using the method is complete, continuous and compact, has better oxidation resistance and contains 17%-30% of silver.

Description

technical field [0001] The invention relates to a method for silver-plating the surface of dendritic copper powder to obtain silver-coated copper powder, which belongs to the technical field of powder surface treatment. The prepared silver-coated copper powder has good oxidation resistance and conductivity, and can be used as a conductive filler Widely used in conductive composite materials in the electronics industry, such as conductive rubber for electromagnetic shielding. Background technique [0002] With the continuous development of modern high-tech, electronic equipment is widely used in various industries in society, and the problems of electromagnetic interference (EMI) and electromagnetic compatibility (EMC) caused by it are becoming more and more serious. In response to this phenomenon, conductive rubber, as an efficient electromagnetic shielding material, has important scientific research value. As a conductive filler, silver powder has high conductivity and oxi...

Claims

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Application Information

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IPC IPC(8): B22F1/02C23C18/44
Inventor 夏志东赵少凡周虎张星刘小黑雷永平郭福史耀武
Owner BEIJING UNIV OF TECH
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