Low-temperature sintered high-permeability NiCuZn ferrite material

Abstract

The invention discloses a low-temperature sintered high-permeability NiCuZn ferrite material for a wire wound chip inductor and a preparation method of the ferrite material. The ferrite material comprises the following main components based on oxide content: 40.5 to 49.6 moles percent of Fe2O3, 30 to 47 moles percent of ZnO, 5 to 20 moles percent of CuO and the balance of NiO. The preparation method comprises the following steps of: (1) mixing raw materials, (2) performing primary sanding, (3) performing primary spray drying and granulation, (4) pre-sintering, (5) adding trace elements, (6) performing secondary sanding, (7) performing secondary spray drying and granulation, (8) molding and (9) sintering. By adding auxiliary components such as NaCO3, B2O3, Ta2O5 and the like, the sintering temperature is greatly reduced, the sintering temperature is below 900 DEG C, the high-frequency electromagnetic performance of the material is greatly improved, the sintering density of the material is improved, the mechanical strength of the material is improved, and the manufacturing process requirement of the wire wound chip inductor is met; and on the other hand, energy is saved, and the producing and manufacturing costs are greatly reduced. The initial permeability of the material is 2,850; the specific loss coefficient of the material is less than 5.5*10<-6> under the test conditions of 100 kHz and 0.25mT; and the specific loss coefficient of the material is less than 25.6*10<-6> under the test conditions of 500 kHz and 0.25mT.

Description

technical field [0001] The invention relates to a method for preparing low-temperature sintered high-permeability NiCuZn ferrite material. Background technique [0002] The continuous progress of modern electronic technology requires that electronic equipment continue to develop in the direction of miniaturization, light weight, and thinning. In addition, in order to adapt to modern communications, network technology, computers, audio-visual equipment, electronic office equipment, automotive electronic systems, military and aerospace electronics As well as the needs of electromagnetic compatibility (EMC), chip inductors, one of the three major passive devices, have also achieved greater development. [0003] Structurally, there are two types of chip inductors, one is a laminated chip inductor, and the other is a wire-wound chip inductor. Each of these two chip inductors has its outstanding advantages: the size of the laminated chip inductor can be made smaller, but due to s...

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Problems solved by technology

Reducing the average particle size of the powder to the submicron or nanometer level increases the specific surface area of ​​the particles and improves the activity of the powder, but simply reducing the particle size will put higher requirements on the equipment, which is not conducive to cost reduction , and there is a certain limit to reducing the particle size simply by adjusting the process, the particle size cannot be reduced indefinitely, and when the particle size drops to a certain level, it is easy to reunite

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