Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate

Abstract

The invention relates to an electronic element, in particular to a multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate. The MLCC comprises an internal electrode, a medium layer which is alternately overlapped with the internal electrode, and an end electrode which is wrapped outside the internal electrode, wherein the end electrode comprises an end electrode bottom layer which is connected with the internal electrode, an end electrode outmost layer which is connected with an external circuit, and an end electrode bafflinglayer which is positioned between the end electrode bottom layer and the end electrode outmost layer; and the internal electrode is prepared by silk-screening and sintering the internal electrode paste which is prepared by uniformly mixing 25 to 68 mass percent of nickel powder, 5 to 10 mass percent of ethyl cellulose, 10 to 15 mass percent of turpentine, 5 to 12 mass percent of acetic acid and 5to 15 mass percent of shrinkage inhibitor, wherein the sintering temperature is 1,000 to 1,200 DEG C and the grain size of the nickel powder is 20 to 70nm. The excellent properties of an MLCC productare kept and the service life of the MLCC product is prolonged.

Description

technical field [0001] The invention relates to an electronic component, especially an MLCC capacitor based on balancing electrode inner slurry and ceramic film shrinkage. Background technique [0002] MLCC (Multilayer Ceramic Capacitor) is a new type of capacitor widely used with the digitalization and miniaturization of electronic products. It has the advantages of high reliability, high precision, high integration, high frequency, low power and large capacity, miniaturization, and low cost. However, MLCC will produce certain failure phenomena separately or simultaneously after working for a period of time under the combined action of working stress and environmental stress. Common failure phenomena of capacitors are: dielectric breakdown open circuit, electrical parameter changes (increased capacitance loss tangent, insulation resistance drop or loss, current rise, etc.), liquid leakage, lead wire corrosion or fracture, insulator rupture or surface arcing, etc. Capacitor...

AI Technical Summary

Problems solved by technology

Common failure phenomena of capacitors are: dielectric breakdown open circuit, electrical parameter changes (increased capacitance loss tangent, insulation resistance drop or loss, current rise, etc.), liquid leakage, lead wire corrosion or fracture, insulator rupture or surface arcing, etc. Capacitor breakdown, open-circuit lead wire breakage, etc., and insulator rupture and other failures that make the capacitor completely lose its working ability are fatal failures, and other failures will make the capacitor unable to meet the use requirements and gradually transit to fatal failures, affecting the reliability of the system.

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