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Preparation method of light source assembly of light emitting diode (LED) lamp and LED roadway lamp involving in method

A technology for LED roadway lights and light source components, which is applied to semiconductor devices, light sources, and electric light sources of light-emitting elements. It can solve the problems of difficult control of processing compaction, increase in lamp body size, and large volume of lamps, and meet the manufacturing process conditions. It is not easy to control, the product is bulky and beautiful, and the total heat dissipation area is small

Inactive Publication Date: 2013-05-08
SHAANXI STAR EXPLOSION SAFETY POLYTRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Common installation and connection methods, such as using high thermal conductivity glue to connect the light source and the lamp holder or heat conduction plate, improve the heat conduction performance between the light source and the lamp holder, and then effectively export the heat. The LED roadway lamp disclosed in ZL201020132511. The heat is introduced into the light source lamp panel through the high thermal conductivity silicone layer and dissipated into the air. Although this method can improve the heat dissipation performance of the lamp to a certain extent, in the actual use process, the heat conduction glue often falls off due to overdrying. The thermal conductivity of the luminaire decreases, leading to bad phenomena such as light decay and dead lights; in addition, the LED lamp bead and the LED lamp bead PCB are directly installed on the lamp holder with good thermal conductivity by mechanical connection, which not only improves the thermal conductivity of the lamp In addition, in the process of processing lamps and lanterns, the degree of processing compression is not easy to control, which can easily cause damage to components. At the same time, lamps prepared by mechanical connection are bulky and clumsy, and parts are prone to appear during use. Loose phenomenon
[0004] For the heat dissipation performance of LED roadway lights, it directly depends on the relevant structure inside the lamps, that is, in terms of the luminous efficiency of existing LED lights, the heat emitted by the light source can be effectively exported by means of scientific selection of components and reasonable assembly between components. That is, by optimizing the design, increasing the heat dissipation area and ventilation convection effect, and improving the surface radiation coefficient, coupled with the above-mentioned conventional installation method of the light source component, the lamp body will eventually increase in size, bulky in appearance, and affect the appearance

Method used

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  • Preparation method of light source assembly of light emitting diode (LED) lamp and LED roadway lamp involving in method
  • Preparation method of light source assembly of light emitting diode (LED) lamp and LED roadway lamp involving in method

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Embodiment 1

[0044] In this embodiment, twenty-eight SMD LED lamp beads with copper-based bases, copper-based LED lamp bead printed circuit boards, and aluminum-based heat conducting plates are used as components. The specific preparation method steps are as follows:

[0045] Step 1: Apply solder paste at the position where the lamp bead base of each LED lamp bead is connected to the LED lamp bead printed circuit board, and then perform hot air welding at 250°C after applying the solder paste, and then obtain an LED with LED lamp beads installed. LED printed circuit board;

[0046] Step 2: The part where the LED printed circuit board is installed on the aluminum-based heat-conducting board is copper-plated with a bonding process, and the thickness of the copper-plated layer is 40 microns; The parts where the boards are connected are tinned by the conventional process, and the thickness of the tinned layer is 130 microns; then, apply solder paste on the entire surface where the copper-plate...

Embodiment 2

[0050] The difference between this embodiment and Embodiment 1 is that the soldering temperature between the LED lamp bead 14 and the LED lamp bead PCB 15 is 255° C., and the soldering temperature between the LED lamp bead PCB 15 and the aluminum-based heat conducting plate 7 is 250° C.

Embodiment 3

[0052] The difference between this embodiment and the first embodiment is that the soldering temperature between the LED lamp bead 14 and the LED lamp bead PCB 15 is 230° C., and the soldering temperature between the LED lamp bead PCB 15 and the aluminum-based heat conducting plate 7 is 225° C.

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Abstract

A method for manufacturing an LED lamp light source component (11) and an LED roadway lighting lamp manufactured using the method. In the manufacturing method, an LED lamp bead (14) is first installed on an LED lamp bead PCB (15) by means of high-temperature hot-air soldering, and then the LED lamp bead PCB (15) provided with said LED lamp bead (14) is soldered to an aluminum-based heat conducting plate (7) at a lower temperature. The LED lamp light source component manufactured using the method is applicable to an LED roadway lighting lamp. The light source component (11) is installed on the heat-dissipation housing (6) of an LED roadway lighting lamp by means of soldering, said heat-dissipation housing (6) of the LED roadway lighting being cooling fins in the shape of a sunflower. The LED roadway lighting lamp has the benefits of good heat-dissipation performance, compact structure, good appearance, high efficiency, low energy cost, and long service life.

Description

technical field [0001] The invention relates to a lamp and a processing and manufacturing method for the lamp, in particular to a method for preparing an LED light source assembly and an LED roadway lamp involved in the method. Background technique [0002] Heat dissipation performance is one of the key factors affecting the service life of LED lamps. During the use of LED lamps, about 80% of the energy is converted into heat energy, and with the increase of power density and packaging density of LED lamp products, it will inevitably cause the accumulation of heat inside the lamp, which will lead to the shift of luminous wavelength and the decrease of light output efficiency. And problems such as reduced service life of lamps and lanterns. [0003] Among the many factors related to the heat dissipation performance of LED lamps, the installation and connection method between the LED lamp bead of the light source component, the LED lamp bead printed circuit board (LED lamp be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S8/00F21V19/00F21V29/00F21V31/00F21V17/12F21Y101/02
CPCF21V29/2206F21V31/005F21V31/00F21V17/12F21K9/90F21S8/00F21W2131/103F21V23/004H05K1/00F21V15/011F21V19/00F21V29/00F21Y2101/02F21V23/006F21V29/507F21V29/74F21Y2115/10H05K1/0203H05K3/0061
Inventor 文新国
Owner SHAANXI STAR EXPLOSION SAFETY POLYTRON TECH INC
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