Process for producing high-power light emitting diode (LED) substrate

Abstract

The invention discloses a process for producing a high-power light emitting diode (LED) substrate. The process comprises the following steps of: (1) adding 5 to 30kg / m<3> nano diamond powder into common electrolyte; and (2) controlling the temperature of the electrolytic mixed solution to be between 40 and 50 DEG C, putting a substrate material into the electrolyte, performing conventional chemical plating, dispersing the electrolyte by adopting ultrasonic wave in the plating process, and mechanically stirring the electrolyte at the same time so that the diamond powder is uniformly suspended in the plating solution. The LED substrate produced by the process has better heat dissipation performance, the reflectivity and the luminous efficiency of the LED substrate are improved, and the process is simple and convenient to manufacture.

Description

Technical field: [0001] The invention relates to a manufacturing technology of an electric light source product, in particular to a production process of a high-power LED substrate. Background technique: [0002] LED comes from the abbreviation of LIGHT EMITTING DIODE in English, which means light-emitting diode. The structure of the simplest light-emitting diode includes P-type semiconductor, N-type semiconductor and the PN junction formed between them. When the current passes through the diode, charge carriers are generated at the above-mentioned PN junction, that is, electrons and Holes, electrons combine with holes and release energy in the form of photons. Adding specific chemicals at the PN junction can make the diode emit light of a specific color, such as adding indium gallium nitride (InGaN) to produce blue light, adding gallium nitride (GaN) to produce green light, etc. LED has the advantages of long life, power saving, durability, reliability, fast response, low...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of the existing LED substrates such as slow heat dissipation, low reflectivity, and inconvenient manufacture, the purpose of the present invention is to provide a high-power LED substrate with better heat dissipation performance, improved reflectivity and luminous efficiency, and is simple and convenient to manufacture.