Method for extracting gold from waste and old circuit board
A technology of waste circuit boards and circuit substrates, which is applied in the direction of improving process efficiency, etc., can solve the problems of high safety operation cost, waste water and waste gas discharge, etc., achieve high gold leaching rate, low treatment cost, and reduce treatment costs.
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Embodiment 1
[0033] A method for extracting gold from waste circuit boards, the specific steps are:
[0034] Step (1), removing the solder and electronic components on the waste circuit board to form a circuit substrate; adding hydrogen peroxide and a corrosion inhibitor to a potassium iodide solution with a mass ratio of 8:1 to configure a potassium iodide solution mixture; the potassium iodide solution is mixed The mass concentration of potassium iodide in the solution is 5%, the mass concentration of the oxidizing agent is 1.2%, and the mass concentration of the corrosion inhibitor is 0.10%.
[0035] Step (2), after cleaning the circuit substrate three times in clear water, soak it in the potassium iodide solution mixture, and react for 3 minutes under the condition of 10, and accompanied by bubbling and stirring, the deplating rate is 100% Then clean the circuit substrate with clear water, the resulting cleaning solution flows into the potassium iodide solution mixed solution to obtain...
Embodiment 2
[0038] It differs from Example 1 in that:
[0039] In step (1), add hydrogen peroxide and corrosion inhibitor in the potassium iodide solution that mass ratio is 20: 1, be configured into potassium iodide solution mixed solution; The potassium iodide mass concentration in described potassium iodide solution mixed solution is 25%, the oxidant mass concentration is 10 %, corrosion inhibitor mass concentration 5%.
[0040] In step (2), the circuit substrate is washed three times in clean water, then soaked in the potassium iodide solution mixture, and reacted at 80° C. for 5 minutes with bubbling and stirring.
Embodiment 3
[0042] It differs from Example 1 in that:
[0043] In step (1), add hydrogen peroxide and corrosion inhibitor in the potassium iodide solution that mass ratio is 12: 1, be configured into potassium iodide solution mixed solution; The potassium iodide mass concentration in described potassium iodide solution mixed solution is 12%, the oxidant mass concentration is 4% %, corrosion inhibitor mass concentration 1%.
[0044] In step (2), the circuit substrate is washed three times in clean water, then soaked in the potassium iodide solution mixture, and reacted at 35°C for 4 minutes with bubbling and stirring.
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