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Demouldable foaming preparation method of wafer level glass micro-cavity

A glass micro- and wafer-level technology, which is applied in glass manufacturing equipment, glass molding, manufacturing tools, etc., can solve the problems of corroding glass, taking a long time, and removing silicon molds, and achieves short removal time, reduced costs, and shortened Effect of time to silicon removal

Active Publication Date: 2013-10-30
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, how to remove the silicon mold after the positive pressure thermoforming and negative pressure thermoforming methods to prepare the glass microcavity becomes a difficult problem
Since silicon and glass are anodically bonded, it usually takes a long time to remove silicon by using the traditional method of etching with TMAH; while using potassium hydroxide to remove silicon, although the speed is faster, it will corrode the glass at the same time

Method used

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  • Demouldable foaming preparation method of wafer level glass micro-cavity
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  • Demouldable foaming preparation method of wafer level glass micro-cavity

Examples

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Effect test

Embodiment 1

[0021] A cycle -grained microcontractive molding method of a cycle -grade glass micro -cavity, including the following steps: the first step: the erosion shape of the silicon round tablet (such as a 4 -inch round tablet) forms a micro -cavity array with a specific size.The micro cavity is a circular or square, and the craftsmanship of the pattern structure on the silicon round sheet is one of the wet etching process, the reaction ion etching process, or the deep reaction ion etching.Step 2: Painting thermal release agent in the micro -cavity array.The heat release agent can release the powder of the gas after heating. Calcium carbonate powder or titanium hydrogenated powder, the powder particle size is 300 mesh, 800 mesh, or 1000 mesh.The quality of the addition is calculated based on the size of the molding cavity. For example, calcium carbonate is used. If the quality can be 0.1mg, 0.5mg, 1mg, 1.5mg, 2mg, the third step: the borosilicon glass round sheet and the silicon round as...

Embodiment 2

[0024] A method of removable hair foaming for a round -class glass micro -cavity, including the following steps:

[0025] In the first step, 15 micron thick aluminum is sputched on the 4 -inch Si round sheet.

[0026] In the second step, the aluminum array of aluminum on the silicon round sheet is used to etch the wet method to form a square array, and the deep ratio of the micro -groove is 1: 1.

[0027] The third step is to place 0.1 mg of calcium carbonate powder in the micro-grooves on the aluminum on the above Si round sheet, and then and the Pyrex7740 glass round (a borosilic glass brand, the American Corning-CORNING company can be purchased. UsuallyIt has been polished, and its size is the same as the Si round sheet.) Under vacuum conditions, the key combination is performed to form a sealing cavity with the micro -groove of the aluminum on the above silicon round sheet on the Pyrex7740 glass.And very small surface roughness.The Si round chip and Pyrex7740 glass surface key...

Embodiment 3

[0031] A method of removable hair foaming for a round -class glass micro -cavity, including the following steps:

[0032] The first step is to use a 25%TMAH solution wet corrosion method to etch on a 4 -inch Si round sheet to form a specific pattern (in fact, the three -dimensional look at the slot on the silicon wafer, the two -dimensional pattern), the pattern is the pattern). This pattern is the pattern.It is a square groove array, and the silicon wafer is polished,

[0033] The second step is to place 0.2 mg of calcium carbonate powder in the micro-groove of the above Si round, and then the same size (4-inch) Pyrex7740 glass cyt (a borosilic glass brand, Corning-CORNING Company, the United States,The market can be purchased. It has been polished) and aluminum foil of the same size uses a low melting point metal key to make Pyrex7740 glass and aluminum foil and the above -mentioned specific patterns forming a sealing cavity.

[0034] The third step is to heat up the above -ment...

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Abstract

The invention discloses a demouldable foaming preparation method of a wafer level glass micro-cavity, which comprises the following steps of: etching a micro-groove array on a silicon wafer to obtain a silicon wafer die; putting hot release gas agent powder in the micro-groove array of the silicon wafer die; bonding the borosilicate glass wafer with the silicon wafer die through a bonding layer, and sealing the micro-groove array of the silicon wafer die; putting the bonded wafer in a heating furnace for heating above a glass softening temperature, keeping temperature, molding the softened glass with gas released by a hot release gas agent to obtain a glass micro-cavity, cooling and annealing; and then putting the molded wafer in a corrosive of the bonding layer, and removing the bonding layer so as to release the silicon wafer die and obtain the wafer level glass micro-cavity. In the invention, the bonding layer is arranged between the borosilicate glass wafer with the silicon wafer, the bonding layer is selectively removed by the corrosive, and the silicon wafer die can be completely released.

Description

Technical field [0001] The invention involves a MEMS (microelectronics mechanical system) packaging technology, especially a new and simple glass micro -cavity method. Background technique [0002] In the field of MEMS manufacturing technology, Pyrex7740 glass (a glass containing alkaline ions, Pyrex is a product brand of Corning, the American) is an important material.The thermal expansion coefficient of silicon is) similar thermal expansion coefficient, which has a high light transmission rate and strong strength. It has form a high-intensity bond connection with the glass with the glass combined with the anode key process.O covalent key, its strength is even higher than the silicon material itself.Due to this characteristic, Pyrex7740 glass is widely used in MEMS packaging, micro -flow, and MOEMS (micro -optical electromechanical system). [0003] In the field of MEMS, micro -processing of glass materials such as Pyrex7740 has always been a difficult problem.The traditional us...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B19/00C03C15/00
Inventor 尚金堂于慧秦顺金
Owner SOUTHEAST UNIV
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