Check patentability & draft patents in minutes with Patsnap Eureka AI!

Epoxy resin encapsulating material modified by organosilicon, its preparation method and its application

An epoxy resin and silicone technology, which is applied in the direction of resistor shell/packaging shell/potting, varistor, etc., can solve the problems of easy cracking of the encapsulation layer, rough surface of the product, pinholes and pores, etc. The electrical properties are stable, the surface is bright and beautiful, and the effect of plump encapsulation layer

Inactive Publication Date: 2012-02-01
LAIZHOU SHUNLIDA ELECTRONICS MATERIAL
View PDF3 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) Poor voltage resistance and poor insulation performance, the highest insulation voltage can only reach 1500V, and the highest insulation resistance can only reach 500 megohms
[0005] (2) Poor moisture resistance, low mechanical strength, easy aging, short service life, poor adhesion, the encapsulation layer of electronic components is prone to cracks under the environmental conditions of -40 ° C ~ 200 ° C, and the surface of the encapsulated product is rough , There are defects such as pinholes and pores

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin encapsulating material modified by organosilicon, its preparation method and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Formula 1: The organosilicon modified epoxy resin encapsulant is composed of the following raw material components: 18 parts of modified epoxy resin, 1 part of silicone, 63 parts of silicon micropowder, 4 parts of titanium dioxide, 5 parts of pigment, curing agent 6 parts, 3 parts of thixotropic agent, by weight.

[0030] Use the preparation method of the organosilicon-modified epoxy resin encapsulant of formula 1, its process step is as follows:

[0031] (1) Packing treatment:

[0032] In the HJΦ300 vertical mixer, the liquid silicone 560 is evenly sprayed in the granular silicon micropowder in the form of a mist by an air pump to cover each particle of the silicon micropowder. The rotation speed of the vertical mixer is 65 rpm. Stir the material for 25-30 minutes; at the same time, stir the organosilicon 560 and granular silicon micropowder evenly with a vertical mixer;

[0033] (2) Secondary reaction modification, extrusion, tableting, crushing:

[0034] The silic...

Embodiment 2

[0036] Formula 2: The silicone-modified epoxy resin encapsulant is composed of the following raw material components: 17 parts of modified epoxy resin, 1 part of silicone, 65 parts of silicon micropowder, 5 parts of titanium dioxide, 5 parts of pigment, curing agent 4. 3 parts of thixotropic agent, calculated in parts by weight.

[0037] The preparation method steps of the organosilicon-modified epoxy resin encapsulant using Formula 2 are the same as those in Example 1.

Embodiment 3

[0039] Formula 3: The organosilicon modified epoxy resin encapsulant is composed of the following raw material components: 19 parts of modified epoxy resin, 1 part of silicone, 61 parts of silicon micropowder, 6 parts of titanium dioxide, 5 parts of pigment, curing agent 5 parts, 3 parts of thixotropic agent, by weight.

[0040] The preparation method steps of the organosilicon-modified epoxy resin encapsulant using Formula 3 are the same as those in Example 1.

[0041] The silicone-modified epoxy resin encapsulating material of the present invention is mainly used for encapsulating high-grade piezoresistors and resistors in the range of -40°C to 200°C.

[0042] The organosilicon-modified epoxy resin encapsulant prepared by the present invention is in the form of dry powder. When used specifically, it needs to be mixed with a mixed solvent at a weight ratio of 100:25 to form an organosilicon-modified epoxy resin for impregnation and encapsulation. Permanent epoxy resin encaps...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
electrical resistanceaaaaaaaaaa
Login to View More

Abstract

The invention discloses an epoxy resin encapsulating material modified by organosilicon, its preparation method and its application. The encapsulating material comprises the following raw materials by weight: 17-19 parts of modified epoxy resin, 1 part of organosilicon, 60-70 parts of silica micropowder, 4-6 parts of titanium dioxide, 5 parts of pigment, 4-6 parts of curing agent and 3 parts of thixotropic agent. The encapsulating material has high voltage resistance of 3000V alternating current, and has the advantages of temperature difference resistance, good moisture resistance, high mechanical strength, low linear expansion coefficient, fast natural drying, aging resistance, long usage life, stable electrical characteristic, good adhesive power, good thixotropy, invariant color and no crack during repeated tests and excellent insulating property, the highest insulation resistance can reach 1500 megohm, the surface of the encapsulating material is brilliant and beautiful, the production efficiency can be raised by 20%, the output rate can be raised by 10%, so that the encapsulating material can replace the imported encapsulating material, the manufacture cost is reduced, the encapsulating material is environmentally-friendly and can be applied for encapsulating -40 DEG C-200 DEG C grade high-grade piezoresistors and resistors.

Description

technical field [0001] The invention relates to the technical field of encapsulating material preparation, in particular to a silicone-modified epoxy resin encapsulating material for encapsulating electronic components, a preparation method thereof, and an application for encapsulating electronic components. Background technique [0002] With the development of society and the continuous improvement of people's living standards, the use and demand of electronic components are increasing. The encapsulation material is also the protective clothing of electronic components, which plays a very important role in the reliability and stability of electronic components. [0003] At present, silicone and epoxy resin modified encapsulation materials are mainly used to encapsulate high-grade electronic components such as piezoresistors, etc., because they cannot be produced in China, so they all rely on imports and need to pay a lot of foreign exchange; but there are also Individual e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/06C08K9/06C08K3/36C08K3/22B29C69/02H01C1/02H01C7/10
Inventor 宋学群
Owner LAIZHOU SHUNLIDA ELECTRONICS MATERIAL
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com