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Adhesive special for inorganic insulation board

An inorganic thermal insulation board and adhesive technology, which is applied in the field of special adhesives for inorganic thermal insulation boards, can solve the problems of not being economical and practical, toxic, and highly toxic, and achieve the effects of low cost, small amount of addition, and strong adhesion

Inactive Publication Date: 2012-02-15
上海丰慧节能环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional adhesive uses natural rubber as the raw material, and the solvent used usually contains formaldehyde, which is costly and highly toxic; later, polystyrene resin or phenolic resin is used as the main raw material, and the solution contains toluene, which still does not reduce the cost and has Toxicity; other adhesives use neoprene, in addition to the high cost, the preparation conditions also have corresponding requirements, not economical and practical

Method used

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  • Adhesive special for inorganic insulation board
  • Adhesive special for inorganic insulation board
  • Adhesive special for inorganic insulation board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1. Formula (expressed in parts by weight)

[0028] Powder formula:

[0029] Cement 300 Yellow Mortar 750

[0030] PFA 50 Polyester 2

[0031] Liquid formula

[0032]

[0033] 2. Preparation method

[0034] Grind the glutinous rice into 100 meshes, ripen it in 90 parts of hot water at 60°C, disperse it evenly in the preservative, and mix it with the liquid formula. The powder formula and the liquid formula are the powder by weight Formula: liquid material formula = 5: 1 for mixing, stirring at room temperature. After testing, the adhesive force of the present invention is 0.80 MPa.

Embodiment 2

[0036] 1. Formula (expressed in parts by weight)

[0037] Powder formula:

[0038] Cement 400 Yellow Mortar 600

[0039] Fly Ash 50 Polyester 1

[0040] Liquid formula

[0041]

[0042]

[0043] 2. Preparation method

[0044] Grind the glutinous rice into 100 meshes, ripen it with 60 parts of hot water at 80°C, disperse it evenly in the preservative, and mix it together with the liquid formula. Formula: liquid material formula = 5: 1 for mixing, stirring at room temperature. The adhesion force of the present invention is tested to be 0.75MPa.

Embodiment 3

[0046] 1. Formula (expressed in parts by weight)

[0047] Powder formula:

[0048] Cement 350 Yellow Mortar 800

[0049] Fly Ash 50 Polyester 3

[0050] Liquid formula

[0051]

[0052] 2. Preparation method

[0053] Grind the glutinous rice into 100 meshes, ripen it with 100 parts of hot water at 90°C, disperse it evenly in the preservative, and mix it with the liquid formula. Formula: liquid material formula = 5: 1 for mixing, stirring at room temperature. The adhesion force of the present invention is tested to be 0.82MPa.

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Abstract

The invention discloses an adhesive special for an inorganic insulation board. The adhesive is characterized by being formed by stirring and mixing components in a solid formula and components in a liquid formula in a weight ratio of 5:1, wherein the components in the solid formula mainly comprise 300 to 400 weight parts of cement, 600 and 800 weight parts of mortar, 50 parts of fly ash, and 1 to 3 weight parts of polyester fiber; and the components in the liquid formula mainly comprise 100 to 250 weight parts of vinyl acetate elastomer (VAE) emulsion, 3 to 10 parts of sodium silicate solution, 3 to 10 weight parts of water-retaining agent, 1 weight part of polyvinyl alcohol, 0.5 to 1 weight part of starch ethers, 0.5 to 1 weight part of preservative and 50 to 100 weight parts of water. Glutinous rice is used as retarder, so a good delayed drying effect is achieved, and the adhesive has high-intensity adhesion.

Description

technical field [0001] The invention relates to a special adhesive for inorganic thermal insulation boards, which belongs to the field of chemical technology, in particular to a special adhesive for inorganic thermal insulation boards. Background technique [0002] In the process of exterior wall decoration, the firmness of the inorganic insulation board is the key point of the decoration. The existing technology has continuously improved the inorganic insulation board to make it have higher water resistance and fire resistance. These properties make the inorganic insulation board need to add more When the multi-layer structure is in contact with the wall, the general adhesive does not have the bonding strength suitable for the inorganic board. [0003] For the composite layer structure of the bottom surface of the existing inorganic board, the retarding effect of the adhesive needs to be greatly improved. If the adhesive effect is not good, it will affect the overall flatne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/26C04B24/26C04B24/10
Inventor 贾铭琳毕立新贾薏臻
Owner 上海丰慧节能环保科技有限公司
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