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Organic silicon heat conduction bonding agent adopting high-power light emitting diode (LED) for illumination and preparation method thereof

A technology of LED lighting and heat-conducting adhesives, applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of extrusion performance and elasticity decline, production difficulty increase, etc., to achieve excellent elasticity, relative Good capacitance, eliminate the effect of storage instability

Inactive Publication Date: 2012-02-15
常州联众光电新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome defects such as increased production difficulty and decreased extrusion performance and elasticity of the heat-conducting adhesive in the prior art due to high alumina filler filling, and provide a heat-conducting material with a small number of fillings, but still maintains a high Thermal conductivity, non-corrosive to LED electronic components and aluminum substrates, and will be quickly cured by moisture in the air when exposed to the air. Silicone thermally conductive adhesive for high-power LED lighting

Method used

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  • Organic silicon heat conduction bonding agent adopting high-power light emitting diode (LED) for illumination and preparation method thereof
  • Organic silicon heat conduction bonding agent adopting high-power light emitting diode (LED) for illumination and preparation method thereof

Examples

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Effect test

Embodiment 1

[0030] In terms of parts by weight, 100 parts of aluminum nitride with an average particle size of 40 nanometers and 4 parts of hexamethyldisilazane were stirred and reacted in a high-speed disperser at a temperature of 110°C for 3 hours, and used as a nano-thermal conductive material after hydrophobic treatment .

[0031] Take 100 parts of polydimethylsiloxane with a viscosity of 1Pa.S terminal trimethoxysiloxane at 25°C, 200 parts of spherical alumina with an average particle diameter of 10 microns, and 100 parts of spherical alumina with an average particle diameter of 1 micron, Add 15 parts of hydrophobically treated 40nm aluminum nitride into a high-speed dispersion mixer, stir and dehydrate in vacuum at 120°C for 2 hours, then add 5 parts of methyltrimethoxysilane, 0.5 parts of tetra-n-butyl titanate, bis (Ethyl acetoacetate) diisobutyl titanate 0.5 parts, γ-aminopropyltriethoxysilane 2 parts, 1,3,5-tris(trimethoxysilylpropyl) polyisocyanate 2 parts, vacuum stirring for ...

Embodiment 2

[0033] In terms of parts by weight, 100 parts of aluminum nitride with an average particle size of 40 nanometers and 2 parts of hexamethyldisilazane were stirred and reacted in a high-speed dispersion mixer at a temperature of 100°C for 5 hours, and used as a nano-thermal conductive material after hydrophobic treatment .

[0034] Take 100 parts of polydimethylsiloxane with a viscosity of 10 Pa.S terminal trimethoxysiloxane at 25°C, 130 parts of aluminum nitride with an average particle size of 30 microns, and 70 parts of aluminum nitride with an average particle size of 5 microns, Add 20 parts of hydrophobically treated 40nm aluminum nitride into a high-speed dispersion mixer, stir and dehydrate under vacuum for 3 hours at 110°C, and then add 2 parts of vinyltrimethoxysilane, 0.3 parts of tetraisopropoxytitanium, bis (Ethyl acetoacetate) diisobutyl titanate 0.3 part, γ-glycidyl etheroxypropyl trimethoxysilane 1 part, 1,3,5-tris(trimethoxysilylpropyl) polyisocyanate 1 part, Af...

Embodiment 3

[0036] In terms of parts by weight, 100 parts of aluminum nitride with an average particle size of 40 nanometers and 6 parts of hexamethyldisilazane were stirred and reacted in a high-speed disperser at a temperature of 120°C for 2 hours, and used as a nano-thermal conductive material after hydrophobic treatment .

[0037] Take 100 parts of polydimethylsiloxane with a viscosity of 0.5Pa.S terminal trimethoxysiloxane at 25°C, 340 parts of zinc oxide with an average particle size of 20 microns, 160 parts of aluminum oxide with an average particle size of 2 microns, hydrophobic Add 5 parts of the treated 40nm aluminum nitride into a high-speed dispersing mixer, stir and dehydrate under vacuum for 1 hour at 130°C, and then add 5 parts of phenyltrimethoxysilane, 3 parts of methyltrimethoxysilane, tetraiso 2 parts of titanium propoxide and 6 parts of γ-aminopropyltriethoxysilane were vacuum stirred for 60 minutes and then discharged into a sealed single-component package. The produc...

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Abstract

The invention discloses an organic silicon heat conduction bonding agent adopting a high-power light emitting diode (LED) for illumination and a preparation method thereof. The organic silicon heat conduction bonding agent consists of polydimethylsiloxane with trimethoxy silane oxygen at the tail end, alkoxy silane cross linking agents, titanate catalysts, adhesion promoters, micrometer level mixed heat conducting materials with different grain diameters, nanometer level heat conduction materials and the like. The preparation method of the bonding agent comprises the following steps that: the nanometer level heat conduction materials carry out lyophobic treatment, then, the polydimethylsiloxane with trimethoxy silane oxygen at the tail end, the micrometer level mixed heat conducting materials with different grain diameters and the nanometer level heat conduction materials after the lyophobic treatment are added into a high-speed dispersing stirring machine and are stirred and dewatered for 1 to 3 hours in vacuum, the alkoxy silane cross linking agents, the titanate catalysts and the adhesion promoters are added after the materials are cooled, the materials are output after the vacuum stirring for 60 minutes, and the single ingredients are sealed and packed. The organic silicon heat conduction bonding agent has the advantages that the heat conduction material filling parts are few, the heat conduction factor is high, the elasticity after the solidification is excellent, no corrosion is caused on light emitting diode (LED) electronic elements and aluminum base plates, and the like.

Description

technical field [0001] The invention belongs to the technical field of room temperature vulcanized heat-conducting silicone rubber, and in particular relates to a silicone adhesive with a small amount of heat-conducting material, high thermal conductivity, excellent elasticity after curing, and no corrosion to LED electronic components and aluminum substrates. The invention is widely used for heat conduction bonding and fixing of electronic components in high-power LED lighting products. Background technique [0002] As the fourth generation of lighting technology, the application of green and energy-saving LED lighting has gradually expanded from display and color rendering landscape lighting to functional lighting for street lights and indoor lights. , especially the light source and drive heat dissipation of high-power LED lighting is an important bottleneck of its life. [0003] High-power LED lighting products, such as LED bulb lamps for indoor lighting, LED spotlights...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C09J9/00C09J11/04C09J11/06H01L33/56H01L33/64
Inventor 俞云平俞云峰
Owner 常州联众光电新材料有限公司
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