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Straight-pull eight-inch silicon single crystal thermal field and production method of eight-inch silicon single crystal

A production process, silicon single crystal technology, applied in the direction of single crystal growth, single crystal growth, crystal growth, etc., can solve the problems of low yield and crystal pulling speed, unreasonable structure of graphite crucible, and insufficient compactness of the thermal field as a whole , to achieve the effect of improving yield and crystal pulling speed, good heat insulation effect, and reducing heat loss

Inactive Publication Date: 2012-03-07
东方电气集团峨嵋半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The overall thermal field is not compact enough, the insulation effect is poor, and the energy consumption is high;
[0006] 2. The unreasonable structure design of the thermal field guide tube leads to poor flow of argon gas, poor heat insulation effect, a large amount of silicon oxide volatiles are easily attached to the outside of the outer guide tube, and the crystal formation is unstable;
[0008] 4. The structure of the graphite crucible is unreasonable and the service life is low
[0010] Using the above production process to produce silicon single crystal uses the original thermal field, so the silicon single crystal produced has higher energy consumption, shorter service life of the system, and shorter service life of the crucible holder, resulting in higher production costs , the yield rate and crystal pulling speed are not high, and the general yield rate is less than 54.18%.

Method used

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  • Straight-pull eight-inch silicon single crystal thermal field and production method of eight-inch silicon single crystal
  • Straight-pull eight-inch silicon single crystal thermal field and production method of eight-inch silicon single crystal
  • Straight-pull eight-inch silicon single crystal thermal field and production method of eight-inch silicon single crystal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A Czochralski eight-inch silicon single crystal thermal field, such as figure 2 , image 3 , Figure 4 As shown, the thermal field includes graphite felt 1, furnace bottom support ring 2, electrode sheath 3, lower protective plate pressing sheet 4, graphite electrode 5, lower insulation cylinder 6, crucible support 7, graphite crucible 8, heater 9, main Insulation cylinder 10, upper support ring 11, upper insulation cover 13, electrode bolt 15, graphite central shaft 16, central shaft extension shaft 17, upper insulation cylinder 19, outer guide cylinder 20, guide cylinder support ring 21, inner guide Cylinder 22, guard disc pressing sheet 24 and quartz crucible 25, main insulation cylinder 10 is arranged on heater 9 periphery, and heater 9 is arranged on graphite electrode 5; The central axis extension shaft 17, the central axis extension shaft 17 supports the crucible support 7, and the protective disk pressing piece 24 is arranged on the lower protective disk pres...

Embodiment 2

[0069] The thermal field for Czochralski eight-inch silicon single crystal is the same as that of Embodiment 1.

[0070] The production process of the eight-inch silicon single crystal is the same as the process steps of Example 1, but the parameters in the SOP file are set differently, and the obtained effects are also different.

[0071] Its process steps are as follows:

[0072] Step 1: ventilation pressure 0.25Mpa, argon flow rate 45slpm, furnace pressure 12Torr;

[0073] Step 3: Crystal rotation: 12 rpm, pot rotation: 6 rpm; adjust the position of the crucible to the position of the seeding pot, and the position of the seeding pot is 32mm from the bottom edge of the guide tube to the liquid surface.

[0074] Step 4: The "Neck Diameter Set Point" is 4.8mm, and the "Target Thin Neck Length" is 130mm.

[0075] Step 5: The equipment automatically sets the shoulders according to the parameter settings in the SOP file. The specific shoulder setting table is shown in Table 5. ...

Embodiment 3

[0088] A thermal field for Czochralski eight-inch silicon single crystal: the same as in Embodiment 1.

[0089] A production process method for an eight-inch silicon single crystal: the process steps are the same as in Embodiment 1, but the parameter settings in the SOP file are slightly different.

[0090] Step 1: ventilation pressure 0.3Mpa, argon gas flow rate 50slpm, furnace pressure 15Torr;

[0091] Step 3: Crystal rotation: 12 rpm, crucible rotation: 8 rpm; adjust the position of the crucible to the position of the seeding crucible, and the position of the seeding crucible is 35mm from the bottom edge of the guide tube to the liquid surface.

[0092] Step 4: The "neck diameter set point" is 4.7mm, and the "target narrow neck length" is 150mm.

[0093] Step 5: The equipment automatically sets the shoulders according to the parameter settings in the SOP file. The specific shoulder setting table is shown in Table 9. When the shoulder is placed less than the required diamet...

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Abstract

The invention discloses a straight-pull eight-inch silicon single crystal thermal field and a production method of an eight-inch silicon single crystal. The straight-pull eight-inch silicon single crystal thermal field is characterized in that a protective tray compressed sheet is arranged on a lower protective tray compressed sheet; a graphite felt is filled between the lower protective tray compressed sheet and the protective tray compressed sheet; the bottom of a main thermal insulation cylinder is clamped with a lower thermal insulation cylinder; the bottom of the lower thermal insulation cylinder is clamped with the lower protective tray compressed sheet; the bottom of the lower protective tray compressed sheet is clamped with a furnace bottom support ring; an outer guide cylinder is arranged on a guide cylinder support ring; and an inner guide cylinder is clamped on the outer guide cylinder, and a graphite felt is filled between the inner guide cylinder and the outer guide cylinder. The thermal field has compact structure and better thermal insulation property; and in the thermal field, the equal-diameter average pulling speed is improved, equal-diameter power consumption is reduced, production cost is reduced, and production efficiency is improved. The production method of the eight-inch silicon single crystal comprises: clearing and charging a single-crystal furnace, vacuumizing, smelting a material, thermally sealing, automatically seeding, shouldering, carrying out equal-diameter growing and ending. By utilizing the method, the production efficiency and yield of a product are improved.

Description

technical field [0001] The invention relates to a Czochralski eight-inch silicon single crystal thermal field and a production process method for an eight-inch silicon single crystal, belonging to the technical field of a silicon single crystal thermal field and a silicon single crystal production process method. Background technique [0002] Solar energy is the cleanest, safest and most reliable energy source in the future, and silicon monocrystalline solar cells are one of the most important green energy sources for human beings in the future. Under the existing technology and conditions and in terms of battery performance, silicon single crystal is an ideal material for manufacturing solar cells, and silicon single crystal with high-quality parameters is the basic condition for the production of high-efficiency solar cells. [0003] The mainstream product of Czochralski silicon single crystal in the world is Φ200mm, gradually transitioning to Φ300mm, and the research and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B15/14C30B15/20C30B29/06
Inventor 雷世俊吴雪霆谢江帆杨帆陈军
Owner 东方电气集团峨嵋半导体材料有限公司
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