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Modified dicyclopentadiene dioxide epoxy resin potting material and preparation method thereof

A technology of dicyclopentadiene dioxide epoxy resin and epoxy resin, which is applied in the direction of chemical instruments and methods, and other chemical processes, can solve the problems of poor impact strength, unfavorable operation, and high production conditions, and achieve high resistance The effect of impact strength

Inactive Publication Date: 2012-03-21
CHANGCHUN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of poor impact strength of dicyclopentadiene dioxide epoxy resin potting compound, freezing point of 45°C, high requirements on production conditions and unfavorable operation, the invention provides a modified dicyclopentadiene dioxide ring Oxygen resin potting compound and preparation method thereof

Method used

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  • Modified dicyclopentadiene dioxide epoxy resin potting material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The raw materials are weighed, wherein the mass proportion of each raw material is dicyclopentadiene dioxide epoxy resin: curing agent: accelerator: isocyanate: polyether polyol: bisphenol A epoxy resin: methyltetrahydrophthalic anhydride: nanoparticles : The filler is 100:51:7.5:0.31:1.19:10:8.5:1:100;

[0021] ① Add 100g of dicyclopentadiene dioxide epoxy resin to 51g of maleic anhydride, heat and stir until a clear solution is obtained, and keep warm at 60°C for later use; In the three-port reactor, the temperature was raised to 40°C, and under the protection of nitrogen, 1.19g of PPG2000 was added dropwise under stirring conditions. value of 0.48~0.54 bisphenol A epoxy resin 10g, add 8.5g of methyltetrahydrophthalic anhydride, stir at 80°C for 6h, stop nitrogen protection, add the clear solution obtained in ①, stir evenly; cool to room temperature and discharge, add Add 7.5 g of glycerin, add 1 g of nano silicon dioxide, 100 g of quartz powder with a particle size ...

Embodiment 2

[0023] The raw materials are weighed, wherein the mass proportion of each raw material is dicyclopentadiene dioxide epoxy resin: curing agent: accelerator: isocyanate: polyether polyol: bisphenol A epoxy resin: methyltetrahydrophthalic anhydride: nanoparticles : The filler is 100:51:12.0:8.30:31.70:100:85.0:8:300;

[0024] ① Add 100g of dicyclopentadiene dioxide epoxy resin to 51g of maleic anhydride, heat and stir until a clear solution is obtained, and keep it warm at 60°C for later use; In the three-port reactor, the temperature was raised to 80°C, under the protection of nitrogen, 31.70g of PPG1000 was added dropwise under stirring conditions, and the dropwise addition was completed after 0.5h, stirred for 2h, and then the grade E-51, epoxy Add 100g of bisphenol A epoxy resin with a value of 0.48 to 0.54, add 85.0g of methyltetrahydrophthalic anhydride, stir for 5 hours at a temperature of 90°C, stop nitrogen protection, add the clear solution obtained in ①, stir evenly; c...

Embodiment 3

[0026] The raw materials are weighed, wherein the mass proportion of each raw material is dicyclopentadiene dioxide epoxy resin: curing agent: accelerator: isocyanate: polyether polyol: bisphenol A epoxy resin: methyltetrahydrophthalic anhydride: nanoparticles : The filler is 100:51:7.5:0.62:0.88:50:36.5:5:137;

[0027] ① Add 100g of dicyclopentadiene dioxide epoxy resin to 51g of maleic anhydride, heat and stir until a clear solution is obtained, and keep warm at 60°C for later use; In the three-port reactor, the temperature was raised to 60°C, and under the protection of nitrogen, 0.88g of PEG1000 was added dropwise under the condition of stirring, and the addition was completed after 0.5h. Add 50g of bisphenol A epoxy resin with an oxygen value of 0.41 to 0.47, add 36.5g of methyltetrahydrophthalic anhydride, stir for 4 hours at a temperature of 100°C, stop nitrogen protection, add the clear solution obtained in ①, stir evenly; cool down to room temperature and discharge ,...

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Abstract

The invention provides a modified dicyclopentadiene dioxide epoxy resin potting material and a preparation method thereof. The modified dicyclopentadiene dioxide epoxy resin potting material is prepared from dicyclopentadiene dioxide epoxy resin, curing agent, accelerating agent, isocyanate, polyether polyol, bisphenol A epoxy resin, Methyl tetrahydrophthalic anhydride, nanoparticles and filler. In the preparation method, polyurethane prepolymer is firstly subjected to a cross linking reaction with the bisphenol A epoxy resin so that the possibility of reacting with anhydride curing agent is eliminated. Because a polyurethane chain segment is introduced, higher impact strength is obtained. The heat deformation temperature of the potting material is up to 273 DEG C. Compared with the traditional dicyclopentadiene dioxide epoxy resin potting material, the modified dicyclopentadiene dioxide epoxy resin potting material has the advantages that the freezing point is reduced to 0 DEG C from 45 DEG C, shock resistance strength of an Izod gap is increased to 40Jm<-1> from 11Jm<-1>, and the amount of the filler can be increased to 300PHR from 100PHR of the traditional formula. The modified dicyclopentadiene dioxide epoxy resin potting material is suitable for potting electronic parts and components which require the heat resistance temperature to be higher than 200 DEG C. The modified dicyclopentadiene dioxide epoxy resin potting material has good weather resistance, wide operating temperature range, high tenacity and low linear expansion coefficient, and is simple to use.

Description

technical field [0001] The invention relates to a modified dicyclopentadiene dioxide epoxy resin potting compound and a preparation method thereof, belonging to the field of polymer materials. Background technique [0002] Dicyclopentadiene dioxide has excellent electrical properties at high temperatures, and is widely used in the advanced motor industry and military special needs departments. It is a plastic with excellent heat resistance and high strength. It is the development direction of special epoxy resins. . The traditional dicyclopentadiene dioxide potting compound uses maleic anhydride as the curing agent for dicyclopentadiene dioxide. Mixing maleic anhydride with dicyclopentadiene dioxide can obtain a mixture with a lower viscosity at 60°C. The freezing point of the mixture is 45°C, which requires high production conditions; the maleic anhydride curing agent is easy to volatilize during heating operation, which is irritating to the operator's body; the cured prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/10C08L63/00C08K3/36C08K3/34
Inventor 张龙于在乾冯文平
Owner CHANGCHUN UNIV OF TECH