Full-automatic electroplating production line for semi-conductor lead frames

A lead frame and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid device parts, circuits, etc., can solve the problems of increasing hanger, steel strip and spring clip corrosion, wasting anode raw materials, consuming deplating solution, etc., to achieve Save the number of operators and manual physical strength, reduce waste water discharge, and reduce the effect of coating thickness

Inactive Publication Date: 2012-03-28
SHENZHEN ALLMERIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Deplating not only consumes the deplating solution, but also wastes anode raw materials and increases the cost. Deplating will also increase the corrosion of hangers, steel strips and spring clips, wh

Method used

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  • Full-automatic electroplating production line for semi-conductor lead frames
  • Full-automatic electroplating production line for semi-conductor lead frames
  • Full-automatic electroplating production line for semi-conductor lead frames

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Embodiment Construction

[0048] The present invention will be further described below in conjunction with accompanying drawing:

[0049] Such as figure 1 As shown, it is a fully automatic production line for semiconductor lead frame electroplating, which consists of automatic feeding device 1, chemical or electrochemical degreasing (and / or electrolytic degreasing) tank 2, water washing tank 3, deoxidizing tank 4, water washing tank 5, acid Corrosion or electrolytic activation tank 6, electroplating tank 7, water washing tank 8, neutralization tank 9, water washing tank 10, coating isolation treatment tank 11, water washing tank 12, air knife electric heating drying mechanism 13, automatic feeding device 14 and receiving Box 15 etc. constitute.

[0050] All the above-mentioned treatment tanks are organically connected together by two stainless steel chains to realize their respective functions and complete the conveying cycle. The sprockets of the chains are driven by adjustable-speed variable-freque...

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PUM

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Abstract

A full-automatic electroplating production line for semi-conductor lead frames comprises an automatic feeding mechanism, a conveying mechanism, a preprocessing part, an electroplating bath, a post-processing part and an automatic discharging mechanism, wherein the automatic feeding mechanism and the automatic discharging mechanism are mainly driven pneumatically; the processing baths and the electroplating baths of the preprocessing part, as well as the processing baths of the post-processing part, are arranged side by side with the bath walls jointed with each other; and the conveying mechanism is a chain conveying mechanism. The invention has the benefits as follows: equipment is compact and occupies small land, the maintenance is convenient, the technology is reliable, the electroplated product quality is good, the efficiency is high, the processing capacity is large, and the effects of water conservation, electricity conservation and environment friendliness are achieved; owing to specially arranged shielding baffles, specially designed horizontal belts externally coated and electroplated with insulating gel, and specially designed spring leaf clamps, a complex deplating process is saved, so that the production cost and the manpower cost are greatly saved; and through appropriate changes in intervals of the horizontal belts and the configuration of the spring leaf clamps, the full-automatic electroplating production line can be suitable for various packaging forms and electroplating of various types of strip materials.

Description

technical field [0001] The invention belongs to the technical field of electroplating, in particular to a fully automatic production line for electroplating semiconductor lead frames. Background technique [0002] After the semiconductor lead frame is epoxy-encapsulated, it needs to be tin-plated on its surface for the purpose of solderability and device protection. The electroplating methods in the prior art mainly include Hanging Plating and High Speed ​​Plating. Other methods such as barrel plating and spray plating are limited by the feasibility and efficiency of the method and are not widely used. [0003] Rack plating is currently the most widely used electroplating method in various industries. Its advantages are wide adaptability, reliable method, convenient adjustment of process parameters and easy maintenance. The rack plating automatic production line designed and developed in recent years uses 2-3 cranes above the electroplating tank to control the take-off and ...

Claims

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Application Information

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IPC IPC(8): C25D7/00C25D19/00H01L23/495
CPCH01L2924/0002
Inventor 毕翊李海燕
Owner SHENZHEN ALLMERIT TECH
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