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Epoxidized soybean oil modified phenolic resin and method for producing non-fire-retardant paper based copper clad laminate by using same

A technology of epoxidized soybean oil and phenolic resin, which is applied in the field of epoxidized soybean oil modified phenolic resin and copper clad laminate production, can solve the problems of long production cycle of tung oil, limited amount of resources, and inability to meet market demand.

Active Publication Date: 2012-04-11
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the production cycle of tung oil is long, and the output and quality are greatly affected by climate, season, and region. The number of resources is very limited. With the development of the copper clad laminate industry, the demand for tung oil is increasing year by year. The output of tung oil in my country can no longer meet the market demand, resulting in The imbalance between supply and demand, and the rising price of tung oil have brought great pressure to domestic paper-based copper-clad laminate manufacturers.

Method used

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  • Epoxidized soybean oil modified phenolic resin and method for producing non-fire-retardant paper based copper clad laminate by using same

Examples

Experimental program
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Effect test

Embodiment

[0039] The epoxidized soybean oil modified phenolic resin in the resin composition of the present embodiment, the raw materials used are phenol, epoxidized soybean oil, amine catalyst, react in the range of 80-90 ℃ for 60-90 minutes, then add formaldehyde, containing Nitrogen phenolic resin, react in the range of 80-90°C for 70-90 minutes, and then dehydrate under reduced pressure; after dehydration, carry out thermal processing, test the gel time at 155-165°C, and control the gel time to 70-80 Seconds, methanol was added to obtain an epoxy soybean oil modified phenolic resin solution with a solid content of 48-53%.

[0040] Use 140 g / m2 high density (the industry usually uses 126 g / m2, 130 g / m2, 135 g / m2) bleached wood pulp paper to dip-coat epoxy soybean oil modified phenolic resin solution, and control the temperature at 160 degrees, The drying time is 1 minute, and the glue content is controlled to be 50±1% (the percentage of pure resin solids in the weight of the sizing s...

specific Embodiment 1

[0041] Into a 1000 ml three-neck flask, put in order: 200 grams of phenol, 50 grams of epoxidized soybean oil, 0.5 grams of amine catalysts, react in the range of 80-90 °C for 60-90 minutes, put in 200 grams of formaldehyde, and 20 grams of nitrogen-containing phenolic resin Carry out the reaction, react in the range of 80-90°C for 70-90 minutes, and then dehydrate under reduced pressure; after removing all the water, perform thermal processing, test the gelation time at 155-165°C, and control the gelation time to 70-80 seconds , adding methanol to obtain an epoxy soybean oil modified phenolic resin solution with a solid content of 48-53%, and then use it to impregnate 140g / m2 bleached wood pulp paper, and control the glue content to 50±1% (resin pure solid accounts for The percentage of the weight of the sizing sheet), fluidity 10±1% (the weight of the sizing material flowing out of the sizing material at a pressure of 70±5kg / cm2 and 160±2°C accounts for the percentage of the ...

specific Embodiment 2

[0042] Put 200 grams of phenol, 110 grams of epoxidized soybean oil, and 3 grams of amine catalyst into a 1000 ml three-necked flask, react at 80-90 °C for 60-90 minutes, add 300 grams of formaldehyde, and 40 grams of nitrogen-containing phenolic resin Carry out the reaction, operate according to the process of specific example 1, obtain sample 2. Test according to the same standard.

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Abstract

The invention relates to epoxidized soybean oil modified phenolic resin and a method for producing the non-fire-retardant paper based laminate by using the resin, and belongs to the technical field of a production method of a copper clad laminate. The epoxidized soybean oil modified phenolic resin is characterized by comprising the following raw materials in parts by weight: 100-200 parts of phenol, 50-110 parts of epoxidized soybean oil, 0.5-3 parts of amine catalyst, 200-300 parts of formaldehyde, 20-40 parts of nitrogen-containing phenolic resin and 100-400 parts of solvent. The method forproducing the non-fire-retardant paper based copper clad laminate by using the epoxidized soybean oil modified phenolic resin is characterized by comprising the following steps: (1) preparing a resincomposition; (2) preparing a sizing material slice; and (3) preparing the non-fire-retardant paper based copper clad laminate.

Description

[0001] 1. Technical field [0002] The invention relates to an epoxy soybean oil modified phenolic resin and a method for manufacturing a non-flame-retardant paper-based laminate using the resin, belonging to the technical field of copper-clad laminate production methods. 2. Background technology [0003] Copper clad laminate is an important material in the printed circuit board industry. When making printed circuit boards, copper clad laminates, the paper base material, have excellent punching and drilling properties, and are inexpensive, so they are widely used in printed circuit boards for civilian electronic devices. [0004] The manufacturing process of paper-based copper-clad laminates is: modify the phenolic resin with drying oil (mainly tung oil), then impregnate and dry the wood pulp paper to obtain a prepreg. The prepregs are stacked according to the specified number of sheets, then combined with copper foil, and then heated and pressed to obtain a paper-based ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/34C08L61/14C08J5/24C08G8/32C08G14/10
Inventor 陈晓鹏林洪会考松波郑宝林王祝明温卫国冷新宇杨宝杰
Owner SHANDONG JINBAO ELECTRONICS
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