Surface plating of Ag-Ni electric contact and preparation process thereof
An electric contact, ag-ni technology, applied in the direction of coating, electrolytic coating, etc., can solve the problems of reducing the surface finish of the gold coating, the difference in the performance of the gold composite coating, and the decrease in the conductivity of the contact material, so as to improve the mechanical properties, Strengthen the gold plating layer and reduce the effect of internal stress
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Embodiment 1
[0029] Composite electroplating adopts a regulated DC power supply, and constant temperature magnetic stirring is used during the electroplating process to make solid particles evenly and fully suspended in the plating solution; the anode is a platinum sheet with a specification of 1cm×1cm, and the distance between the anode and the workpiece is maintained at 4-5cm. Ensure that a stable plating solution layer is formed between the two and maintain a relatively stable current density and voltage.
[0030] Prepare nano-SiC / Ni composite plating solution, and configure nano-SiC / Ni composite plating solution after surface treatment of nano-SiC particles. The surface treatment of the particles includes putting the nano-SiC particles into the dilute NaOH solution and boiling for 10-30 minutes; then putting them into the hydrochloric acid aqueous solution with a volume ratio of 1:1 for ultrasonic soaking, the ultrasonic power is 300-500W, and the soaking time is 10-20min ;Finally, was...
Embodiment 2
[0035]First, put the cleaned and activated Ag-Ni matrix as the cathode and place it in the nano-SiC / Ni composite electroplating solution. The temperature of the bath is 50°C, the stirring speed is 200rpm, the current density is 50Am / cm2, the concentration of nano-SiC is 7g / L, and the electroplating time is 10min. ; Then the resulting plated piece is placed in the gold plating solution, the temperature of the plating solution is 40°C, the stirring speed is 100rpm, the current density is 25mA / cm2, and the electroplating time is 20min. Finally, ultrasonically clean the electroplated parts to remove the particles floating on the coating.
[0036] Carry out microhardness and resistivity test to single-layer pure gold coating and SiC / Ni+Au double coating of the present invention that above-mentioned embodiment 2 obtains through microhardness meter and four-probe tester, hardness test loading load 10g, loading time 5s, its test result is shown in the table below, the hardness of nano...
Embodiment 3
[0038] First, put the cleaned and activated Ag-Ni matrix as the cathode in the nano-SiC / Ni composite electroplating solution. The temperature of the bath is 50°C, the stirring speed is 200rpm, the current density is 60Am / cm2, the concentration of nano-SiC is 8g / L, and the electroplating time is 10min. ; Then the resulting plated piece is placed in the gold plating solution, the temperature of the plating solution is 40°C, the stirring speed is 100rpm, the current density is 20mA / cm2, and the electroplating time is 20min. Finally, ultrasonically clean the electroplated parts to remove the particles floating on the coating.
[0039] Carry out microhardness and electrical resistivity test to single-layer pure gold coating and SiC / Ni+Au double coating of the present invention that above-mentioned embodiment 3 obtains through microhardness tester and four-probe tester, hardness test loading load 10g, loading time 5s, its test result is shown in the table below, the hardness of the ...
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