Lead wire for capsulation and manufacturing method thereof

Abstract

The invention relates to a lead wire for capsulation. The lead wire comprises a core wire and a plating layer, wherein the core wire is made of silver, silver-gold alloy, silver-copper alloy, silver-palladium alloy, copper, aluminum or alloy thereof; the plating layer is coated on the surface of the core wire; and the plating layer is made of gold, silver, palladium, platinum, ruthenium, nickel or alloy thereof. A manufacturing method of the lead wire comprises the following steps of: introducing the core wire to a reaction chamber to generate plasma for cleaning the surface of the core wire in the reaction chamber; and then coating the plating layer on the surface of the core wire. Because the surface of the core wire can be cleaned and activated fast and completely by the plasma, the plating layer can be firmly coated on the surface of the core wire and is not easy to fall off.

Description

technical field [0001] The invention relates to a wire for packaging, in particular to a wire for packaging and a manufacturing method thereof, which can quickly and completely clean the surface of the core wire and enable the coating to be firmly coated on the outside of the core wire. Background technique [0002] It is known that pure gold wires are the main wires used for packaging. Gold wires have good electrical properties and stable workability in packaging applications. However, due to the sharp rise in the cost and price of gold wires recently, the industry has begun to seek alternative materials for gold wires. Copper and silver, which have good electrical properties, are currently the main substitutes that the industry is trying to replace gold. However, pure copper and pure silver wires are easily affected by temperature and humidity, so they are not as stable as gold wires in storage and packaging operations. As a result, the pass rate of the packaging is reduce...

AI Technical Summary

Problems solved by technology

However, the degreasing and activation treatment before the formation of the coating is not only time-consuming, but also often due to the variation of the potency, the surface of the core wire cannot be completely cleaned, which affects the adhesion of the coating, causing the coating to fall off accidentally, and leading to the failure of the packaged wire. fail

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