Method for cleaning solar cell silicon wafers
A technology for solar cells and solar silicon wafers, which is applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., and can solve the problems of inability to completely remove moisture on the surface of silicon wafers, incomplete air drying of silicon wafers, and variable production cycles. To simplify cleaning equipment and cleaning process, save cleaning energy consumption, and improve equipment productivity
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[0016] Example 2:
[0017] The water cutting agent provided in this embodiment is composed of 15 parts of 1,2-dimethoxyethane, 60 parts of n-pentane, 40 parts of n-nonane, and 15 parts of octylphenol polyoxyethylene ether. The water cutting agent is placed in a cleaning equipment with ultrasonic cleaning. The silicon wafers to be cleaned are ultrasonically cleaned in the provided water cutting agent for 5 minutes, and then transported to 50°C for hot air drying.
Example Embodiment
[0018] Example 3:
[0019] The water cutting agent described in this embodiment is composed of 10 parts of 1,2-dimethoxyethane, 50 parts of n-pentane, 30 parts of n-nonane, and 10 parts of octylphenol polyoxyethylene ether. The cleaning and drying process is as in Example 2.
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