Anti-bonding copper infiltration powder and preparation method thereof

An anti-adhesion, copper powder technology, applied in the field of powder metallurgy, can solve the problems of large batches of defective products, low efficiency, corrosion holes and cracks, etc., to achieve the effect of clean and beautiful surface, simple process flow, and improved material performance

Inactive Publication Date: 2012-07-04
有研科技集团有限公司 +1
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are a lot of residues and corrosion holes and cracks on the surface of low-end copper infiltration powder after copper infiltration, resulting in a large number of defective products, which require subsequent processing
The conventional copper infiltration method currently used in the industry is to place the green body of copper infiltration powder (without adding anti-adhesion additives) on the top of the parts for single-layer infiltration. Low production efficiency
If the parts are stacked up and down, and conventional copper infiltration powder is pl

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Anti-bonding copper infiltration powder and preparation method thereof
  • Anti-bonding copper infiltration powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] Example 1

[0022] An anti-adhesive copper powder, the composition is Cu-1.5Fe-1.8Zn+3%MgO, the raw materials are: atomized copper powder (-100 mesh), ultra-fine iron powder (-800 mesh), CuZn20 powder ( -250 mesh); the anti-adhesion additive is MgO powder, the particle size is -100 mesh, -325 mesh is less than 15%, and the mass percentage is 3%.

[0023] A preparation method of copper infiltration powder, the method steps are as follows:

[0024] (1) Weigh 89.5 kg of atomized copper powder, 1.5 kg of ultra-fine iron powder, and 9 kg of CuZn20 powder, add 5 kg of ceramic balls, and mix in the mixer for 0.5 h;

[0025] (2) After the mixing process, the powder is sent to the hydrogen reduction furnace for diffusion, the diffusion temperature is 650℃, the diffusion time is 1.7h, the hydrogen reduction furnace is an ammonia decomposition and reduction atmosphere, and the ratio of hydrogen to nitrogen is 3:1 ;

[0026] (3) Circulating water is cooled, discharged from the furnace and ...

Example Embodiment

[0028] Example 2

[0029] An anti-adhesive copper powder, the composition is Cu-1.8Fe-2.0Zn+5% SiO 2 , Atomized copper powder (-100 mesh), ultra-fine iron powder (-800 mesh), CuZn30 powder (-250 mesh), anti-adhesion additive is SiO 2 Powder, the particle size is -100 mesh, -325 mesh <15%, and the added mass percentage is 5%.

[0030] A preparation method of copper infiltration powder, the method steps are as follows:

[0031] (1) Weigh 91.53 kg of atomized copper powder, 1.8 kg of ultra-fine iron powder, and 6.67 kg of CuZn30 powder, add 5 kg of ceramic balls, and mix for 0.8 hours in a mixer;

[0032] (2) After the mixing process is over, the powder is sent to the hydrogen reduction furnace for diffusion, the diffusion temperature is 660℃, the diffusion time is 1.5h, the ammonia decomposition and reduction atmosphere, the ratio of hydrogen to nitrogen is 3:1;

[0033] (3) Circulating water is cooled, discharged from the furnace and crushed, collected by 100 mesh sieving, and then 5.26k...

Example Embodiment

[0035] Example 3

[0036] An anti-adhesive copper powder, the composition is Cu-1.3Fe-2.5Zn+7% Al 2 O 3 , Atomized copper powder (-100 mesh), superfine iron powder (-800 mesh), CuZn20 powder (-250 mesh), anti-adhesion additive is Al 2 O 3 Powder, the particle size is -100 mesh, -325 mesh <15%, and the added mass percentage is 7%.

[0037] A preparation method of copper infiltration powder, the method steps are as follows:

[0038] (1) Weigh 86.2 kg of atomized copper powder, 1.3 kg of ultra-fine iron powder, and 12.5 kg of CuZn20 powder, add 5 kg of ceramic balls, and mix in the mixer for 1 hour;

[0039] (2) After the mixing process, the powder is sent to the hydrogen reduction furnace for diffusion, the diffusion temperature is 720°C, the diffusion time is 1h, the ammonia decomposition and reduction atmosphere, the ratio of hydrogen to nitrogen is 3:1;

[0040] (3) Circulating water is cooled, discharged from the furnace and crushed, collected by 100 mesh sieving, and then added 7.53k...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Granularityaaaaaaaaaa
Granularityaaaaaaaaaa
Login to view more

Abstract

The invention discloses anti-bonding copper infiltration powder and a preparation method thereof and belongs to the technical field of powder metallurgy. The anti-bonding copper infiltration powder is composed of raw materials, an anti-bonding additive and a lubricating agent, wherein the raw materials are composed of the following components by weight percent: 0.5-3.8% of iron powder, 1.5-18% of brass powder and the balance of copper powder; the addition of the anti-bonding additive is 2-15% of the weight of the raw materials; and the addition of the lubricating agent is 0.5% of the weight of the raw materials. An anti-bonding matter is added in the copper infiltration powder prepared by the preparation method disclosed by the invention, so that the copper infiltration overlying is realized. The anti-bonding copper infiltration powder has better forming property. During a use process, the copper infiltration parts can be stacked and placed in multiple layers, the products are not corroded and the strength of the products is obviously increased. After the copper infiltration is ended, the contact surfaces of the products are not bound mutually; only an incompact oxide interlayer which can be easily removed is arranged on the surface; the surface of the parts is clean and beautiful; the copper infiltration efficiency of the parts is greatly increased; and the capacity is increased.

Description

technical field [0001] The invention relates to an anti-bonding copper infiltration powder and a preparation method thereof, belonging to the technical field of powder metallurgy. Background technique [0002] At present, due to its low cost and easy processing, powder metallurgy parts are used more and more in industry, but the residual pores inside the parts greatly affect the performance of the parts, and the powder metallurgy copper infiltration process is a common Under pressing pressure, it can effectively reduce porosity and obtain high-density parts. The density, hardness, impact toughness and processability of parts prepared by copper infiltration method are much higher than those of traditional densification processes such as warm pressing, repressing and refiring. And the cost is low, which is a cost-effective method. There are a lot of residues and corrosion holes and cracks on the surface of low-end copper infiltration powder after copper infiltration, resultin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B22F3/24B22F1/00
Inventor 徐景杰王林山汪礼敏张景怀刘宇惠刘一浪
Owner 有研科技集团有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap