Low-warpage aluminum paste for back field of solar battery and preparation method for aluminum paste

A solar cell, low warpage technology, applied in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems that aluminum paste can not meet the requirements of low sheet, poor bending stress resistance of thin silicon wafer, etc., to achieve photoelectric conversion efficiency High, powder sphericity, good printability

Inactive Publication Date: 2014-04-09
西安创联光电新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in order to save materials and reduce costs, the solar cell industry pursues the thinning of silicon wafer materials, which leads to poor bending stress resistance of thin silicon wafers, and warpage problems caused by reducing the thickness of silicon wafers.
The aluminum paste of the prior art cannot meet the requirements of low flakes

Method used

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Embodiment Construction

[0016] The method of the present invention will be further described in detail below in conjunction with specific examples.

[0017] Binder phase preparation: Bi 2 o 4 40-60%; Al 2 o 3 3~10%, SiO 2 5~10%, B 2 o 3 10~25%, ZnO 10~30%, TiO2 0~5%, ZrO2 0~5%, V 2 o 3 0~5%. The weighed Bi 2 o 3 , Al 2 o 3 , SiO 2 , B 2 o 3 , ZnO, TiO2, ZrO2, V 2 o 3 After mixing evenly, heat it in a muffle furnace, control the temperature at 900-1200°C, keep it warm for 30-60 minutes, quench the melted glass powder particles with deionized water, dry them, ball mill them to 0.5-2um, and pass through a 400-mesh sieve Get an environmentally friendly glass bond.

[0018] Preparation of the organic carrier: including the preparation of the main carrier and the auxiliary carrier, the main carrier and the auxiliary carrier are mixed according to the mass ratio of 20:1-10:1 and then put into the reaction kettle for stirring, and the temperature is raised to 60-80°C and then treated a...

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PUM

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Abstract

The invention discloses a low-warpage aluminum paste for a back field of a solar battery and a preparation method for the aluminum paste. The aluminum paste comprises the following components in percentage by weight: 50 to 80 percent of function phase, 1 to 10 percent of bonding phase and 10 to 35 percent of organic carrier, wherein the function phase is conductive aluminum powder; the bonding phase is a glass adhesive; and the organic carrier is formed by preparing an organic solvent and an organic additive. Meanwhile, the invention provides the preparation method for the aluminum paste. The aluminum paste is low in warpage, meets requirements for thinning of the solar battery and is an ideal paste for a back electrode, and the fragment rate during encapsulation can be reduced.

Description

technical field [0001] The invention belongs to the technical field of thick-film electronic paste compositions, and relates to an aluminum paste and a preparation method thereof, in particular to an aluminum paste for the back field of a low-warpage solar cell and a preparation method thereof. Background technique [0002] Aluminum paste for solar cells is mainly used as an anode material in the field of solar cells, that is, the aluminum back field. With the development of solar cell manufacturing technology, the trend of silicon wafer thinning becomes more and more obvious. The requirements for solar cell aluminum paste are: the aluminum paste has good printability, electrical conductivity, weather resistance and chemical resistance, and can be co-sintered with the front silver paste and the back silver paste. After sintering, the silicon wafer has good adhesion and no deformation of the silicon wafer. Small, low warpage, good compactness of aluminum film, no micro-crack...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 公立王国芳王保德张淑鸿席友谊陈玲韩源石如玉
Owner 西安创联光电新材料有限公司
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