Silicon germanium heterojunction NPN (negative-positive-negative) transistor and manufacture method

A heterojunction and transistor technology, which is applied in the manufacture of germanium-silicon heterojunction NPN transistors and the field of germanium-silicon heterojunction NPN transistors, can solve the problems of high cost, complicated deep trench isolation process, and high cost of epitaxy in the collector region. Achieve the effect of reducing process cost, simplifying process flow, and achieving precise contact

Active Publication Date: 2012-07-04
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The device technology is mature and reliable, but the main disadvantages are: 1. The epitaxy cost of

Method used

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  • Silicon germanium heterojunction NPN (negative-positive-negative) transistor and manufacture method
  • Silicon germanium heterojunction NPN (negative-positive-negative) transistor and manufacture method
  • Silicon germanium heterojunction NPN (negative-positive-negative) transistor and manufacture method

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Embodiment Construction

[0043] Such as figure 1 Shown is a schematic diagram of the structure of a germanium-silicon heterojunction NPN transistor according to the embodiment of the present invention. The germanium-silicon heterojunction NPN transistor according to the embodiment of the present invention is formed on a P-type silicon substrate 1, and the active region is isolated by a shallow trench field oxygen 2, so The germanium-silicon heterojunction NPN transistors include:

[0044] A collector region 4 is composed of an N-type ion implantation region formed in the active region, and the depth of the collector region 4 is greater than the depth of the bottom of the shallow trench field oxygen 2 . The N-type ion implantation process conditions of the collector region 4 are as follows: the impurity to be implanted is phosphorus, which is formed in three steps. The first step is implanted with an energy of 10keV-60keV; The energy ranges from 150keV to 400keV; the specific values ​​of implantation ...

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Abstract

The invention discloses a silicon germanium heterojunction NPN (negative-positive-negative) transistor. A collector region is formed in an active region, is connected with N-type pseudo buried layers at the bottoms of shallow trench field oxides on two sides of the active region and is led out through deep-hole contacts, an emitter window is formed through outer spacers, a P-type silicon germanium epitaxial layer at the bottom of the emitter window is an intrinsic base region, outer base regions are formed on the P-type silicon germanium epitaxial layer outside the emitter window through further impurity doping by means of ion implantation, the outer spacers can prevent ions of the outer base regions from influencing the intrinsic base region, an emitter region consists of N-type polycrystalline silicon which is completely filled into the emitter window and extends out of the emitter window from the top of the emitter window. The invention further discloses a manufacture method for the silicon germanium heterojunction NPN transistor. The silicon germanium heterojunction NPN transistor has the advantages that the dimension of the transistor can be reduced, parasitic resistance can be reduced, characteristic frequency can be improved, the process flow can be simplified, use of photomasks is decreased, cost is reduced, and the process dimension is accurately controlled.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular to a germanium-silicon heterojunction NPN transistor; the invention also relates to a manufacturing method of the germanium-silicon heterojunction NPN transistor. Background technique [0002] In radio frequency applications, higher and higher device characteristic frequencies are required. Although RFCMOS can achieve higher frequencies in advanced process technologies, it is still difficult to fully meet radio frequency requirements. For example, it is difficult to achieve characteristic frequencies above 40GHz, and advanced technology The research and development cost of compound semiconductors is also very high; compound semiconductors can realize very high characteristic frequency devices, but due to the disadvantages of high material cost and small size, and the toxicity of most compound semiconductors, its application is limited. Silicon germanium ...

Claims

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Application Information

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IPC IPC(8): H01L29/737H01L29/06H01L29/08H01L21/331H01L21/265
Inventor 梅绍宁钱文生刘冬华胡君段文婷
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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