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Flexibility-regulable epoxy resin adhesive and preparation method thereof

A technology for adjusting epoxy resin and flexibility, applied in the field of flexible adjustable epoxy adhesive and its preparation, can solve the problems of high cross-linking density, poor impact resistance, small fracture deformation range, etc. Wide range of effects with high bond reliability

Inactive Publication Date: 2012-07-25
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a flexible and adjustable epoxy resin adhesive and its preparation method to overcome the high crosslinking density and brittleness of ordinary epoxy resin after curing, poor impact resistance, and the fracture deformation range of the material. Relatively small, easy to crack and other defects

Method used

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  • Flexibility-regulable epoxy resin adhesive and preparation method thereof
  • Flexibility-regulable epoxy resin adhesive and preparation method thereof
  • Flexibility-regulable epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] 1. Preparation of component A: Weigh 30% of SST-2390 solvent-free polyurethane modified epoxy resin, 5% of ethylene glycol diglycidyl ether, 59.5% of hydrophobic silica powder, 1% of KH560 coupling agent, carbon Add 0.5% of black 101 dye and 4% of epoxy-terminated nitrile rubber into the mixer in turn, evacuate until the vacuum degree is -0.08~-0.05MPa, stir at 500~1000 rpm for 0.5~2 hours, and stir evenly. Let it cool down to room temperature naturally, then pack it tightly.

[0029] 2. Preparation of component B: Weigh 40% of DMP-30 curing agent, 55% of hydrophobic silicon micropowder, and 5% of liquid nitrile rubber, and add them into the mixer in turn, and vacuumize until the vacuum degree is -0.08~-0.05MPa. Stir at 500-1000 rpm for 0.5-2 hours, stir evenly, let it air naturally to room temperature, and seal the package.

[0030] 3. The ratio of component A: component B is 100:100 by weight.

Embodiment 2

[0032] 1. Preparation of component A: Weigh 30% of Dow Chemical linear aliphatic flexible epoxy DER-732 resin, 30% of Japanese core-shell rubber toughened MX125 epoxy resin, and 2% of butanediol diglycidyl ether , calcium carbonate 35%, KH560 coupling agent 0.5%, carbon black 101 dye 0.5%, polyethylene glycol 2%, add to the mixer in turn, vacuum until the vacuum degree is -0.08~-0.05MPa, at 500~1000 rpm Stir for 0.5 to 2 hours per minute, stir evenly, let it air naturally to room temperature, and seal the package.

[0033]2. Preparation of component B: Weigh 90% of amidoamine 502 curing agent, 5% of calcium carbonate, and 5% of liquid nitrile rubber, add them to the mixer in turn, vacuumize until the degree of vacuum is -0.08~-0.05MPa, and put them at 500 Stir at ~1000 rpm for 0.5 to 2 hours, stir evenly, let it air naturally to room temperature, and seal the package.

[0034] 3. The ratio of component A: component B is 100:100 by weight.

Embodiment 3

[0036] 1. Preparation of component A: Weigh 30% of Dow Chemical linear aliphatic flexible epoxy DER-736 resin, 30% of aromatic epoxy-terminated aliphatic diol epoxy resin XZ02466.00 compound, Add 1% of 1,2-cyclohexanediol diglycidyl ether, 37% of diatomaceous earth, 1% of KH560 coupling agent, 0.5% of carbon black 101 dye, and 0.5% of glycerin into the mixer in turn, and vacuumize until the degree of vacuum is -0.08~-0.05MPa, stir at 500~1000 rpm for 0.5~2 hours, stir evenly, let it air to room temperature naturally, and seal the package.

[0037] 2. Preparation of component B: Weigh 50% of polythiol 3800, 5% of DMP-30, 42% of diatomaceous earth, and 3% of liquid nitrile rubber, add them to the mixer in turn, and vacuum until the vacuum degree is -0.08 ~-0.05MPa, stir at 500~1000 rpm for 0.5~2 hours, stir evenly, let it air naturally to room temperature, and seal the package.

[0038] 3. The ratio of component A: component B is 100:100 by weight.

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Abstract

The invention relates to a flexibility-regulable epoxy resin adhesive, which consists of component A and component B; the component A consists of the following materials in percentage by weight: 30 to 60 percent of toughened epoxy resin, 1 to 5 percent of thinning agent, 30 to 60 percent of filler, 0 to 1 percent of silane active coupling agent, 0 to 1 percent of dye, 1 to 10 percent of toughener and 0 to 1 percent of defoaming agent; and the component B consists of the following materials in percentage by weight: 40 to 99 percent of curing agent, 0 to 60 percent of filler, 0 to 1 percent of dye, 0 to 10 percent of toughener and 0 to 1 percent of defoaming agent. The invention solves the problems of cured epoxy resin, i.e. high brittleness and weak impact resistance, the modulus is not lost on the basis of toughening, moreover, the bonding reliability of the cured system is high, and the application range is wide.

Description

technical field [0001] The invention relates to a flexible and adjustable epoxy adhesive and a preparation method thereof, belonging to the field of epoxy resin adhesives. Background technique [0002] Epoxy resin is one of the most widely used matrix resins in composite materials, with excellent properties, such as excellent mechanical properties, good electrical insulation properties, good corrosion resistance, low shrinkage, good chemical and thermal stability, high strength And high modulus, good bonding performance and excellent processing performance, so it is widely used in many fields. However, ordinary epoxy resin has high crosslinking density after curing, has great brittleness, poor impact resistance, and relatively small fracture deformation range of the material, resulting in poor impact resistance and easy cracking; There is a large difference in the expansion coefficient of the bonding substrate, and the interface is prone to disengagement, bulging, and edge ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J11/08C09J11/06
Inventor 骆万兴王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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