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Cyanogen-free acidic cupronickel-tin plating solution

A technology of cupronickel tin and electroplating solution, applied in the field of surface treatment, which can solve the problems of low hardness, poor wear resistance, and impossibility of arbitrary thick plating, etc., and achieve the effects of strong anti-discoloration ability, strong corrosion resistance, and high electroplating efficiency

Inactive Publication Date: 2015-02-18
深圳市华傲创表面技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are also companies in China that have invested in the research and development of cyanide-free cupronickel tin. For example, Guangzhou Medis New Materials Co., Ltd. has developed a FCS cyanide-free cupronickel tin electroplating instead of nickel electroplating. Based on this, a new type of brightener is used to achieve the requirement of being completely cyanide-free. The color and luster of the coating is comparable to that of bright nickel, and the welding performance is good. keep improve
In addition, BYD Co., Ltd. (Patent No. CN 101096769, CN101618616, 101899664A, etc.), Shanghai Mint Co., Ltd. (Patent No. CN 102108533A) and Fuzhou University (Patent No. CN 102220610A) have also applied for the cyanide-free copper-tin alloy electroplating method Patents, again, these patents are based on pyrophosphate, with similar advantages and disadvantages

Method used

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  • Cyanogen-free acidic cupronickel-tin plating solution
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  • Cyanogen-free acidic cupronickel-tin plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A kind of cyanate-free copper-nickel tin electroplating solution, comprises following formula component:

[0035]

[0036] Prepare the cyanide-free copper-nickel tin electroplating solution according to the electroplating operation steps in the specific embodiment and use the electroplating solution for electroplating operation, the current density is 1.0A / dm 2 , The electroplating time is 10min. As a result, a uniform and bright white copper-tin alloy is plated on the copper sheet, and the thickness of the coating is measured to be 3.0 μm.

Embodiment 2

[0038] A kind of cyanate-free copper-nickel tin electroplating solution, comprises following formula component:

[0039]

[0040] Prepare the cyanide-free copper-nickel tin electroplating solution according to the electroplating operation steps in the specific embodiment and use the electroplating solution for electroplating operation, the current density is 0.6A / dm 2 , the electroplating time is 10min, and as a result, a bright silver white copper-nickel-tin alloy is plated on the copper sheet, and the copper-tin components in the alloy account for 59% and 41% respectively.

Embodiment 3

[0042] A kind of cyanate-free copper-nickel tin electroplating solution, comprises following formula component:

[0043]

[0044] Prepare the cyanide-free copper-nickel tin electroplating solution according to the electroplating operation steps in the specific embodiment and use the electroplating solution for electroplating operation, the current density is 1.5A / dm 2 , The electroplating time is 25min. As a result, a uniform and bright white copper-tin alloy is plated on the copper sheet. The thickness of the coating reaches 10.5μm and the hardness reaches 380Vickers.

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Abstract

The invention discloses a cyanogen-free acidic cupronickel-tin plating solution. The cyanogen-free acidic cupronickel-tin plating solution comprises the following formulation components: 150 to 400 g / L of organic acid, 10 to 60 g / L of copper methanesulfonate, 5 to 25 g / L of tin methanesulfonate, 0.1 to 5 g / L of brightening agent, 1.0 to 10 g / L of wetting agent, and 0.5 to 10 g / L stabilizing agent. The operating conditions of the plating solution are that a copper-tin alloy anode is adopted; and the current density is 0.3 to 2.0A / dm<2>. The cyanogen-free acidic cupronickel-tin plating solution disclosed by the invention has high stability and plating efficiency, has no cyanogen or heavy metal additives, and is safe and environment-friendly. The obtained copper-tin alloy clad layer in uniform and luculent in appearance, is bright silver-white, high in malleability, corrosion resistance, discoloration preventing capacity and hardness; the thickness of the clad layer can reach over 10 mu m; therefore, the copper-tin alloy clad layer is an ideal substitute for a nickel clad layer.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, and in particular relates to a cyanide-free cupronickel tin electroplating solution. Background technique [0002] Nickel plating is widely used due to its excellent decorative protection, but with the improvement of life quality and in-depth research on human pathogens, nickel plating has been abandoned and eliminated in many fields of decorative electroplating. According to reports, the EU stopped importing and producing nickel-containing trims in July 2000, and commercialization was prohibited after July 2001. With the implementation of the ban on the import of nickel plating on jewelry, glasses, clothing, children's toys, luggage and other daily necessities in the European Union and Western countries, the copper-nickel-chromium process that has always been dominant in protective decoration has been gradually weakened, and the industry has been tirelessly developing new ones. Nickel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/58
Inventor 刘迪
Owner 深圳市华傲创表面技术有限公司