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Acrylic acid positive photoresist and preparation method thereof

A technology of acrylic positive and positive photoresist, which is applied in the field of photoresist, can solve the problem of low resolution, and achieve the effect of good permeability, high resolution and sensitivity, and large contrast

Inactive Publication Date: 2012-07-25
SUNTIFIC MATERIALS WEIFANG LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the resolution of the photoresist, people have been continuously improving the photoresist, but the wavelength of the ultraviolet exposure light source suitable for the existing photoresist is generally between 300-600nm, so there is a common problem of low resolution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Under dust-free and yellow light conditions, according to polyacrylic resin 5wt%, triphenylsulfonium and trifluoromethanesulfonic acid salt (1:1) 2wt%, dipentaerythritol hexaacrylate 8wt%, propylene glycol methyl ether acetate 30wt % by weight, comprising the following steps of preparation:

[0036] (1) Add dipentaerythritol hexaacrylate to propylene glycol methyl ether acetate;

[0037] (2) Stir the substance in step (1) for 6 hours to form a mixed solution;

[0038] (3) Add polyacrylic acid resin, triphenylsulfonium and trifluoromethanesulfonic acid salt (1:1) to the mixed solution;

[0039] (4) Stir the composition obtained in (3) for 20 hours to obtain the acrylic positive photoresist.

Embodiment 2

[0041] Under dust-free and yellow light conditions, according to polyacrylic resin 30wt%, triphenylsulfonium and trifluoromethanesulfonic acid salt (1:1) 20wt%, dipentaerythritol pentaacrylate 40wt%, propylene glycol methyl ether acetate 60wt% % by weight, comprising the following steps of preparation:

[0042] (1) Add dipentaerythritol pentaacrylate to propylene glycol methyl ether acetate;

[0043] (2) stirring the substance in step (1) for 10 hours to form a mixed solution;

[0044] (3) Add polyacrylic acid resin, triphenylsulfonium and trifluoromethanesulfonic acid salt (1:1) to the mixed solution;

[0045] (4) Stir the composition obtained in (3) for 30 hours to obtain the acrylic positive photoresist.

Embodiment 3

[0047] Under dust-free and yellow light conditions, according to polyacrylic resin 15wt%, triphenylsulfonium and trifluoromethanesulfonic acid salt (1:1) 6wt%, dipentaerythritol hexaacrylate 20wt%, propylene glycol methyl ether acetate 50wt % by weight, comprising the following steps of preparation:

[0048] (1) Add dipentaerythritol hexaacrylate to propylene glycol methyl ether acetate;

[0049] (2) stirring the substance in step (1) for 8 hours to form a mixed solution;

[0050] (3) Add polyacrylic acid resin, triphenylsulfonium and trifluoromethanesulfonic acid salt (1:1) to the mixed solution;

[0051] (4) Stir the composition obtained in (3) for 24 hours to obtain the acrylic positive photoresist.

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Abstract

The invention discloses an acrylic acid positive photoresist and a preparation method thereof. The acrylic acid positive photoresist is prepared from the following components in percentage by weight under the conditions of dust-free and yellow light: 5 to 30 weight percent of polyacrylic resin, 1 to 20 weight percent of photoacid generator, 5 to 40 weight percent of ester containing a plurality of hydroxide radicals and 30 to 60 weight percent of propylene glycol methyl ether acetate. The preparation method comprises the following steps of: (1) adding the ester containing a plurality of hydroxide radicals into the propylene glycol methyl ether acetate; (2) stirring the materials in the step (1) for 6 to 10 hours to form mixed solution; (3) adding the polyacrylic resin and the photoacid generator into the mixed solution; (4) and stirring a composition obtained in the step (3) to obtain the acrylic acid positive photoresist. The acrylic acid positive photoresist prepared according to the invention has the advantages of small diffraction, high resolution and sensitivity, large contrast, good permeability, strong etching resistance capacity and the like.

Description

technical field [0001] The invention relates to a photoresist, in particular to a positive photoresist composition of an acrylic resin system and a preparation method thereof. Background technique [0002] In the fabrication process of integrated circuits, photoresist is a key functional material for the photolithography process. Photolithography is a precision surface processing technology that combines pattern printing and chemical etching. To put it simply, photocopying is used to transfer the pattern on the mask plate to the photoresist on the surface of the silicon wafer to achieve subsequent selective etching or implantation doping. It is the most important process in IC manufacturing, accounting for about half of the steps in chip manufacturing and accounting for about 35% of all costs. The photoresist is particularly important as the main material in the photolithography process. Photoresists can be divided into two categories: photosolvable positive-tone photores...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039G03F7/027G03F7/004
Inventor 张盼杨光孙越
Owner SUNTIFIC MATERIALS WEIFANG LTD
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