Modified thermosetting resin and preparation method thereof

Abstract

The invention discloses a modified thermosetting resin and a preparation method thereof. 100 parts of heat curable resin and 0.1-100 parts of closed pore meso pore silicon oxide are uniformly mixed at the temperature of 30-180DEG C, and a modification thermosetting resin is obtained. The closed-pore mesoporous is prepared through the steps that: polyhedral silsesquioxane forms a coating on an external surface and apertures of meso pore silicon oxide, the closed-pore mesoporous silicon oxide is connected by Si-O key or Si-N key. The closed pore meso pore silicon oxide has a higher specific surface area comparing to the original closed-pore mesoporous silicon oxide, and simultaneously possesses more interfaces, which can avoid that the resin enters interfaces of inorganic materials, guaranteeing the modification thermosetting resin possesses a low dielectric property, and a stable performance. The preparation method for modified thermosetting resin disclosed in the invention has the characteristics of extensive applicability and simple operation.

Description

technical field [0001] The invention relates to a modified thermosetting resin and a preparation method thereof. It specifically relates to a thermosetting resin modified by closed-pore mesoporous silicon oxide. Background technique [0002] In recent years, with the rapid development of the electronic information industry, low dielectric constant materials have attracted widespread attention. Currently, an efficient way to prepare such materials is to introduce voids into the polymer, since air has a dielectric constant of only 1, thereby lowering the polymer's dielectric constant. For example, Gufan Zhao et al. achieved a dielectric constant of 1.9 by introducing voids into polyimide (see literature: Gufan Zhao, Takayuki Ishizaka,, Hitoshi Kasai, Masatoshi Hasegawa, Takeo Furukawa, Hachiro Nakanishi, and Hidetoshi Oikawa. Chemistry of Materials. 2009, 21, 419-424). However, this method of introducing voids often results in voids on the surface of the prepared material, ...

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Problems solved by technology

[0004] However, the above-mentioned incompletely closed-pore mesoporous silica is not easy to apply, and there are mainly the following two problems: (1) Since this incompletely closed-pore mesoporous silica is oxidized by the active groups of some materials and the original mesoporous It is formed by the chemical action of the silanol at the opening of the silicon hole, so the size of the material used for "closed cells" determines the degree of closed cells of mesoporous silica; if the size of the material used for "closed cells" is small, it does not Completely closed mesoporous silica cannot prevent the resin matrix from entering the pores of mesoporous silica; this means that the size of the material used for "closed pores" must increase as the pore size of mesoporous silica increases, and the range of raw material selection is narrow

[0005] To sum up, it can be seen that the use of inorganic materials with pore structure to modify thermosetting resins has significant advantages, but the desired results have not yet been achieved.

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