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High temperature resistant epoxy-imine resin adhesive and preparation method thereof

An imine resin, epoxy resin technology, applied in epoxy resin glue, adhesive, non-polymer adhesive additive and other directions, can solve problems such as unfavorable market promotion, achieve good controllability, realize industrialized production, source handy effect

Inactive Publication Date: 2015-06-03
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the adhesive can only be used in some special fields, which is not conducive to market promotion

Method used

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  • High temperature resistant epoxy-imine resin adhesive and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Add 0.1 mole (29.0 g) of 4,4'-diamino-4"-hydroxytriphenylmethane (DATHM) and 300 ml of N,N-dimethylacetamide into the polymerization bottle, stir to dissolve, add 0.2 mole (38.4 grams) of trimellitic anhydride (TMA) powder, reacted at room temperature for 0.5 hours, to obtain a transparent homogeneous solution, add 100 milliliters of toluene, carry out heating azeotropic dehydration, until the system azeotropic dehydration is complete, subsequently, the system is concentrated by heating distillation To about 1 / 5, 62.3 grams of hydroxycarboxyl-terminated imide (CPI-DAHTM) powder was prepared in acetone, with a yield of 97.7%.

Embodiment 2

[0027] Preparation process: put bisphenol A epoxy resin and hydroxyl-containing carboxy-terminated imide (CPI-DAHTM) into a reaction bottle, stir and heat to 90°C, react to a homogeneous and transparent state, cool to 50°C, add N, N, N', N'-tetraglycidyl-4,4'-diaminodiphenylmethane (TGDDM), reactive diluent and curing agent, just stir well. The specific formula is as follows:

[0028] E-51 bisphenol A epoxy resin: 100 grams

[0029] CPI-DAHTM powder: 15g

[0030] TGDDM epoxy resin: 100 grams

[0031] 4,4'-Diaminodiphenylsulfone: 15 grams

[0032] 2-Ethyl-4-methylimidazole: 5 grams

[0033] 1,3-Diglycidyloxybenzene: 30 grams.

Embodiment 3

[0035] Preparation process: Put bisphenol A epoxy resin and hydroxyl-containing carboxy-terminated imide (CPI-DAHTM) into a reaction bottle, stir and heat to 110°C, react to a homogeneous and transparent state, cool to 60°C, add N, N, N', N'-tetraglycidyl-4,4'-diaminodiphenylmethane (TGDDM), reactive diluent and curing agent, just stir well. The specific formula is as follows:

[0036] E-44 bisphenol A epoxy resin: 50 grams

[0037] CPI-DAHTM powder: 1 g

[0038] TGDDM epoxy resin: 100 grams

[0039] Methyltetrahydrophthalic anhydride: 10 grams

[0040] 2-Ethyl-4-methylimidazole: 3 grams

[0041] Dicyandiamide: 7 grams

[0042] 2,2-bis(4-glycidyloxycyclohexyl)propane: 5 grams

[0043] Vinylcyclohexene dioxide: 15 g.

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Abstract

The invention relates to a high temperature resistant epoxy-imine resin adhesive and a preparation method thereof. The adhesive comprises, by mass, 100 parts of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane (TGDDM), 50-100 parts of a bisphenol A epoxy resin, 1-15 parts of a hydroxyl-containing carboxyl-terminated imine compound, 20-30 parts of a reactive diluent, and 10-20 parts of a curing agent. The preparation method comprises the following steps: putting the bisphenol A epoxy resin and the hydroxyl-containing carboxyl-terminated imine compound into a reaction bottle, stir-heating to 90-110DEG C, reacting until a homogeneous transparent state is reached, cooling to 50-60DEG C, adding the TGDDM, the reactive diluent and the curing agent, and uniformly stirring. The adhesive of the invention, which has the advantages of simple technology, low cost and convenient operation and has a very high practical value to the development of the adhesive industry, has wide application prospects in the electronic field, the microelectronic field and the like.

Description

technical field [0001] The invention belongs to the field of adhesives and preparation thereof, in particular to a high temperature resistant epoxy-imide resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin is an adhesive with good bonding performance, high bonding strength and wide bonding surface. It can be used with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) or non-metallic materials (such as Glass, ceramics, wood, plastic, etc.), and the bonding strength is very high, even exceeding the strength of the bonded material itself. In addition, it also has good processability and good stability. However, due to its low elongation, high brittleness, and poor fatigue resistance of the bonding parts, it is not suitable for use in structural parts. The brittleness of cured epoxy resin greatly limits its application. Therefore, improving the performance of epoxy resin adhesives has become one of the hotspots of sc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J179/08C09J11/06C08G73/10C07D209/48
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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