Polyurethane resin potting adhesive with high bonding strength and preparation method thereof

A polyurethane resin, high-adhesion technology, used in polyurea/polyurethane adhesives, chemical instruments and methods, adhesives, etc., can solve the harsh requirements of thermal shock resistance, poor adhesion of PA66, difficult to withstand parking sensors, etc. problems, to achieve the effects of excellent electrical properties, good bonding properties, and low internal stress

Inactive Publication Date: 2012-08-22
ELANTAS ZHUHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the polyurethane potting products available in the market generally have shortcomings such as poor adhesion to PA66 or difficulty in withstanding the harsh requirements of reversing radar and tire pressure detectors against cold and heat shocks.

Method used

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  • Polyurethane resin potting adhesive with high bonding strength and preparation method thereof
  • Polyurethane resin potting adhesive with high bonding strength and preparation method thereof
  • Polyurethane resin potting adhesive with high bonding strength and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A high bonding strength polyurethane resin potting glue, consisting of component A and component B, in parts by weight,

[0044] Component A: 31 parts of castor oil (hydroxyl equivalent: 345, average hydroxyl functionality: 2.7), 12 parts of polyoxypropylene glycol (average molecular weight: 1000), 0.2 parts of accelerator (DBU), 48 parts of inorganic powder, 8.2 parts of effect additives;

[0045] Component B: 26.7 parts of hydroxyl-terminated polybutadiene (hydroxyl value 0.9mmol / g, number average molecular weight 2300), MDI (MDI-100HL, 4,4'-MDI content ≥ 90%, NCO content 29%) 33.3 parts, accelerator (DABCO 33LV) 0.03 parts, flame retardant 40 parts;

[0046] 8.2 parts of the above-mentioned effect additives are composed of 0.35 parts of black pigment, 0.5 parts of defoaming agent, 0.6 parts of wetting agent, 0.25 parts of anti-settling agent, and 6.5 parts of water-removing agent.

[0047] The preparation method of the above-mentioned high bond strength polyurethan...

Embodiment 2

[0051] A high bonding strength polyurethane resin potting glue, consisting of component A and component B, in parts by weight,

[0052] Component A: 20.5 parts of castor oil (hydroxyl equivalent: 345, average hydroxyl functionality: 2.7), 7.9 parts of polyoxypropylene glycol (average molecular weight: 1000), 0.2 parts of accelerator (DBU), 62.6 parts of inorganic powder, 8.2 parts of effect additives;

[0053] Component B: 26.7 parts of hydroxyl-terminated polybutadiene (hydroxyl value 0.9mmol / g, number average molecular weight 2300), MDI (MDI-100HL, 4,4'-MDI content ≥ 90%, NCO content 29%) 33.3 parts, accelerator (DABCO 33LV) 0.03 parts, flame retardant 40 parts;

[0054] 8.2 parts of the above-mentioned effect additives are composed of 0.35 parts of black pigment, 0.5 parts of defoaming agent, 0.6 parts of wetting agent, 0.25 parts of anti-settling agent, and 6.5 parts of water-removing agent.

[0055] The preparation method of the above-mentioned high bond strength polyur...

Embodiment 3

[0059] A high bonding strength polyurethane resin potting glue, consisting of component A and component B, in parts by weight,

[0060] Component A: 31 parts of castor oil (hydroxyl equivalent 345, average hydroxyl functionality 2.7), 12 parts of polyoxypropylene glycol (average molecular weight 1000), 0.2 parts of accelerator (DBU), 48 parts of inorganic powder, 8.2 parts of effect additives;

[0061] Component B: 20.5 parts of hydroxyl-terminated polybutadiene (hydroxyl value 0.9mmol / g, number average molecular weight 2300), MDI (MDI-100HL, 4,4'-MDI content ≥ 90%, NCO content 29%) 25.5 parts, accelerator (DABCO 33LV) 0.03 parts, flame retardant 54 parts;

[0062] 8.2 parts of the above-mentioned effect additives are composed of 0.35 parts of black pigment, 0.5 parts of defoamer, 0.6 part of wetting agent, 0.25 parts of anti-settling agent, and 6.5 parts of water-removing agent.

[0063] The preparation method of the above-mentioned high bond strength polyurethane resin pot...

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Abstract

The invention discloses a polyurethane resin potting adhesive with a high bonding strength, which is composed of a component A and a component B. The component A comprises castor oil and polyether polyatomic alcohol in parts by weight; the component B comprises hydroxyl-terminated polybutadiene, MDI (diphenylmethane diisocyanate), an accelerating agent and an additive; the molar ratio of hydroxyls of the hydroxyl-terminated polybutadiene to isocyanate radicals of the MDI is 0.06-0.25; and the MDI contains no less than 80 wt% of 4,4'-MDI and residues of isomerism homologues of the MDI or the modified MDI which contains no less than 80 wt% of the 4,4'-MDI isomer. The polyurethane resin potting adhesive disclosed by the invention has the high bonding strength and particularly has good bonding performance with plastic materials (PA66) including nylon and the like; and the polyurethane resin potting adhesive has good electric performance, lower inner stress and excellent heat impact resistance and is particularly suitable for potting and packaging electronic elements which have more demanding requirements on the inner stress, such as a reversing radar, a tire pressure monitor and the like.

Description

technical field [0001] The invention relates to a high bonding strength polyurethane resin potting glue and a preparation method thereof, which are suitable for potting and encapsulating electronic and electrical components. Background technique [0002] Nowadays, more and more electronic and electrical components are applied to automobiles, which transforms automobiles from an integration of purely mechanical components to an electronic complex, so as to continuously improve driving comfort and safety. These electronic and electrical components are generally equipped with electrical components such as electronic circuit boards and controllers, and often need to be potted and encapsulated with insulating resin to meet their requirements for insulation, shock resistance, weather resistance, moisture resistance, and confidentiality. [0003] As electronic components that can effectively improve driving safety, reversing sensors and tire pressure detectors are increasingly used...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C09J175/14C09K3/10C08G18/10C08G18/67C08G18/48C08G18/62
Inventor 苏祖君周美勇王长扬
Owner ELANTAS ZHUHAI CO LTD
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