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Cleaning solution for light-emitting diode (LED) chip

A technology for LED chips and cleaning solutions, which is applied in detergent compounding agents, detergent compositions, surface-active detergent compositions, etc., can solve problems such as corrosion and low removal efficiency of LED chip cleaning agents, and reduce corrosion and Surface tension, corrosion reduction effect

Active Publication Date: 2012-09-12
ZHEJIANG AUFIRST MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problems of low removal efficiency and serious corrosion of LED chip cleaning agents in the prior art, and provides an LED chip with simple preparation method, low cost, high cleaning efficiency, and low corrosion rate to substrate materials and wiring Washing fluid

Method used

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  • Cleaning solution for light-emitting diode (LED) chip
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  • Cleaning solution for light-emitting diode (LED) chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Raw material and weight percent are as follows: Isomerized fatty alcohol polyoxyethylene ether C 10 h 21 O(C 2 h 4 O) 7 H 15%, monoethanolamine 10%, N-methylpyrrolidone 20%, ethylene glycol monobutyl ether 15%, ethylenediaminetetraacetic acid 2%, benzoic acid 0.05%, pure water balance.

[0030] The cleaning method adopts the above method. Compared with the existing cleaning solution, after cleaning the surface pollutants on the LED chip, there is no residue on the chip surface, the cleaning efficiency is high, and the corrosion rate to the substrate material and metal wiring is very small.

Embodiment 2

[0032] Raw material and weight percent are as follows: Isomerized fatty alcohol polyoxyethylene ether C 10 h 21 O(C 2 h 4 O) 17 H 5%, diethanolamine 10%, N-methylpyrrolidone 5%, ethylene glycol monoethyl ether 10%, ethylenediaminetetraacetic acid sodium salt 1%, 2-ethylbenzoic acid 1%, pure water balance.

[0033] The cleaning method and cleaning effect are the same as in Example 1.

Embodiment 3

[0035] Raw material and weight percent are as follows: Isomerized fatty alcohol polyoxyethylene ether C 10 h 21 O(C 2 h 4 O) 7 H 1%, triethylamine 10%, N,N-dimethylformamide 20%, diethylene glycol monobutyl ether 10%, nitrilotriacetic acid sodium salt 1%, 3-ethylbenzoic acid 0.05% , Pure water balance.

[0036] The cleaning method and cleaning effect are the same as in Example 1.

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Abstract

The invention discloses a cleaning solution for a light-emitting diode (LED) chip. A preparation method for the cleaning solution is simple, and the cleaning solution is low in cost and high in cleaning efficiency, and has low corrosion rate to substrate materials and wire harnesses. The cleaning solution consists of the following components in percentage by weight: 1 to 15 percent of isomerized fatty alcohol-polyoxyethylene ether, 1 to 20 percent of organic amine, 1 to 20 percent of organic amide solvent, 1 to 15 percent of alcohol ether solvent, 0.1 to 5 percent of nitronic acid-containing chelating agents, 0.01 to 5 percent of arylcarboxylic acid, and the balance of pure water.

Description

technical field [0001] The invention relates to a cleaning agent for LED chips, in particular to a cleaning solution for LED chips with simple preparation method, low cost, high cleaning efficiency and low corrosion rate to substrate materials and wiring. Background technique [0002] Because light-emitting diodes (LEDs) have many advantages such as high efficiency, energy saving, and environmental protection, their prospects in the lighting market have attracted the attention of countries all over the world. In the manufacturing process of LED chips, in addition to chip manufacturing technology, chip packaging technology and heat dissipation technology, the cleaning technology of LED chips also has a significant impact on its luminous efficiency, brightness and service life. During the LED chip manufacturing process, the main purpose of cleaning the wax, film-forming agent, inorganic impurities, metal particles and other pollutants on the chip surface is the main purpose of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/722C11D3/60
Inventor 侯军崔京南高远
Owner ZHEJIANG AUFIRST MATERIAL TECH CO LTD
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