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Alumina particle dispersion strengthened copper composite material and preparation method thereof

A technology for dispersion strengthening of copper and alumina particles, applied in the field of electronic materials, can solve the problems of complex process, poor high temperature performance and high cost, and achieve the effects of high softening resistance temperature, short oxidation time and high high temperature strength

Inactive Publication Date: 2012-09-19
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Production of Al by Powder Metallurgy 2 o 3 The dispersion strengthened copper process is mature, and the performance of the composite material produced is good, but the production process is complicated, the cost is high, the production efficiency is low, and the interface of the composite material is easily polluted
The improved process is the most widely used powder internal oxidation powder metallurgy method, and its common technology flow is: alloy smelting → powder making → internal oxidation → reduction → pressing → sintering → thermal processing → cold processing, this manufacturing process is through internal oxidation in situ Nanoscale Al 2 o 3 The particles are fine and evenly distributed in the matrix, and have high thermodynamic stability, but their high temperature performance is not good, and the process is complicated, which makes it difficult to control the quality of the material and the cost is very high, which greatly limits its popularization and application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The chemical composition of the aluminum oxide particle dispersion-strengthened copper composite material provided in this example consists of: α-Al with a weight percentage of 0.05% 2 o 3 , with a weight percentage of 0.38% γ-Al 2 o 3 , the balance of copper.

[0026] The preparation method of the aluminum oxide particle dispersion strengthened copper composite material provided in this embodiment includes the following steps:

[0027] (1) Ingredients

[0028] Take the following raw materials: Cu-Al alloy powder produced by water mist method, its aluminum content is 0.20wt%, particle size 37.0-106.0 microns; α-Al 2 o 3 Powder, particle size 0.5-5.0 microns, purity ≥99.5wt%; oxidizing agent Cu 2 O powder, particle size 37.0-106.0 microns, purity ≥ 99.5wt%;

[0029] Dosing according to the following weight ratio: α-Al 2 o 3 The weight percentage of powder is 0.05%, Cu 2 The weight percent content of O is 1.90%, the Cu-Al alloy powder of balance;

[0030] Then ...

Embodiment 2

[0039] The chemical composition of the aluminum oxide particle dispersion-strengthened copper composite material provided in this example consists of: 0.75% by weight of α-Al 2 o 3 , with a weight percentage of 0.66% γ-Al 2 o 3 , the balance of copper.

[0040] The preparation method of the aluminum oxide particle dispersion strengthened copper composite material provided in this embodiment includes the following steps:

[0041] (1) Ingredients

[0042] Take the following raw materials: Cu-Al alloy powder produced by water mist method, its aluminum content is 0.35wt%, particle size 37.0-106.0 microns; α-Al 2 o 3 Powder, particle size 0.5-5.0 microns, purity ≥99.5wt%; oxidizing agent Cu 2 O powder, particle size 37.0-106.0 microns, purity ≥ 99.5wt%;

[0043] Dosing according to the following weight ratio: α-Al 2 o 3 The weight percentage of powder is 0.75%, Cu 2 The weight percent content of O is 3.30%, the Cu-Al alloy powder of balance;

[0044] Then use a V-shaped ...

Embodiment 3

[0053] The chemical composition of the aluminum oxide particle dispersion-strengthened copper composite material provided in this example consists of: 1.5% by weight of α-Al 2 o 3 , with a weight percentage of 0.94% γ-Al 2 o 3 , the balance of copper.

[0054] The preparation method of the aluminum oxide particle dispersion strengthened copper composite material provided in this embodiment includes the following steps:

[0055] (1) Ingredients

[0056] Take the following raw materials: Cu-Al alloy powder produced by water mist method, its aluminum content is 0.50wt%, particle size 37.0-106.0 microns; α-Al 2 o 3 Powder, particle size 0.5-5.0 microns, purity ≥99.5wt%; oxidizing agent Cu 2 O powder, particle size 37.0-106.0 microns, purity ≥ 99.5wt%;

[0057] Dosing according to the following weight ratio: α-Al 2 o 3 The weight percentage of powder is 1.5%, Cu 2 The weight percent composition of O is 4.75%, the Cu-Al alloy powder of balance;

[0058] Then use a V-shape...

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Abstract

The invention relates to the technical field of electronic materials, and particularly discloses an alumina particle dispersion strengthened copper composite material and a preparation method thereof. The alumina particle dispersion strengthened copper composite material comprises the following chemical components in percentage by weight: 0.05-1.5 percent of alpha-Al2O3, 0.38-0.94 percent of gamma-Al2O3 and the balance of copper. The preparation method of the alumina particle dispersion strengthened copper composite material provided by the invention has the advantages of short internal oxidation time, low cost and high efficiency. The prepared alumina particle dispersion strengthened copper composite material has high strength, high conductivity, high anti-softening temperature and high high-temperature strength, can meet the requirements of microelectronic industry and electronic information industry on high-conductivity, high-strength and high-temperature-resistant copper alloy andis widely applied to mechanical industry, defense industry and electronic information industry.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to an aluminum oxide particle dispersion strengthened copper composite material and a preparation method thereof. Background technique [0002] The conductivity, strength and high-temperature performance of pure copper and existing grades of copper alloy materials are often difficult to balance, and cannot fully meet the requirements for comprehensive performance of the rapid development of aviation, aerospace, microelectronics and other high-tech, Al 2 o 3 Dispersion strengthened copper (Cu-Al 2 o 3 ) The composite material not only maintains the high electrical and thermal conductivity of the copper matrix, but also has superior high temperature performance and corrosion resistance. Materials, electrical switch contact bridges, welding torch nozzles, etc. have broad application prospects. [0003] Glidcop series Cu-Al developed by American SCM company 2 o 3 The ...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C1/05
Inventor 田保红杨雪瑞龙永强张毅刘勇任凤章贾淑果宋克兴
Owner HENAN UNIV OF SCI & TECH
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